JPS5646540A - Manufacture of circuit board for watch - Google Patents
Manufacture of circuit board for watchInfo
- Publication number
- JPS5646540A JPS5646540A JP12258279A JP12258279A JPS5646540A JP S5646540 A JPS5646540 A JP S5646540A JP 12258279 A JP12258279 A JP 12258279A JP 12258279 A JP12258279 A JP 12258279A JP S5646540 A JPS5646540 A JP S5646540A
- Authority
- JP
- Japan
- Prior art keywords
- projection
- mold
- circuit board
- watch
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000002093 peripheral effect Effects 0.000 abstract 2
- 238000000465 moulding Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/04—Mounting of electronic components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Electric Clocks (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12258279A JPS5646540A (en) | 1979-09-26 | 1979-09-26 | Manufacture of circuit board for watch |
GB8001694A GB2042774B (en) | 1979-01-18 | 1980-01-18 | Fabricating method of electronic watch module |
CH40980A CH641626B (de) | 1979-01-18 | 1980-01-18 | Verfahren zur herstellung von elektronischen uhrmodulen. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12258279A JPS5646540A (en) | 1979-09-26 | 1979-09-26 | Manufacture of circuit board for watch |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5646540A true JPS5646540A (en) | 1981-04-27 |
JPS6216542B2 JPS6216542B2 (ja) | 1987-04-13 |
Family
ID=14839473
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12258279A Granted JPS5646540A (en) | 1979-01-18 | 1979-09-26 | Manufacture of circuit board for watch |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5646540A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016511928A (ja) * | 2013-05-22 | 2016-04-21 | ザ・スウォッチ・グループ・リサーチ・アンド・ディベロップメント・リミテッド | 電気化学セル |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102673883B1 (ko) * | 2023-05-24 | 2024-06-10 | 강병모 | 반려동물 보안출입장치가 구비된 펫하우스 |
-
1979
- 1979-09-26 JP JP12258279A patent/JPS5646540A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016511928A (ja) * | 2013-05-22 | 2016-04-21 | ザ・スウォッチ・グループ・リサーチ・アンド・ディベロップメント・リミテッド | 電気化学セル |
Also Published As
Publication number | Publication date |
---|---|
JPS6216542B2 (ja) | 1987-04-13 |
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