ES461902A1 - Perfeccionamientos en placas de circuito moldeadas. - Google Patents

Perfeccionamientos en placas de circuito moldeadas.

Info

Publication number
ES461902A1
ES461902A1 ES461902A ES461902A ES461902A1 ES 461902 A1 ES461902 A1 ES 461902A1 ES 461902 A ES461902 A ES 461902A ES 461902 A ES461902 A ES 461902A ES 461902 A1 ES461902 A1 ES 461902A1
Authority
ES
Spain
Prior art keywords
circuit board
board
die molding
molding circuit
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES461902A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of ES461902A1 publication Critical patent/ES461902A1/es
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10863—Adaptations of leads or holes for facilitating insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Perfeccionamientos en placas de circuito moldeadas, caracterizados porque la placa conformada de antemano en una configuración plana, recibir y soportar en la misma componentes eléctricos seleccionados, estando adaptada la placa de circuito para recibir en ella una plantilla de material conductor para interconectar los componentes eléctricos recibidos y soportados en una configuración deseada de circuito.
ES461902A 1976-08-26 1977-08-26 Perfeccionamientos en placas de circuito moldeadas. Expired ES461902A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71785676A 1976-08-26 1976-08-26

Publications (1)

Publication Number Publication Date
ES461902A1 true ES461902A1 (es) 1978-06-01

Family

ID=24883769

Family Applications (1)

Application Number Title Priority Date Filing Date
ES461902A Expired ES461902A1 (es) 1976-08-26 1977-08-26 Perfeccionamientos en placas de circuito moldeadas.

Country Status (11)

Country Link
JP (1) JPS5326967A (es)
AR (1) AR213322A1 (es)
AU (2) AU2743477A (es)
BR (1) BR7705677A (es)
DE (1) DE2734819A1 (es)
ES (1) ES461902A1 (es)
FR (1) FR2363260A1 (es)
IT (1) IT1079835B (es)
NL (1) NL7709361A (es)
SE (1) SE7709349L (es)
ZA (1) ZA775017B (es)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56109096A (en) * 1980-02-01 1981-08-29 Nippon Gakki Seizo Kk Diaphragm plate for audio equipment
DE3326968A1 (de) * 1982-06-12 1985-02-14 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen Traegerbauteil aus thermoplastischem material mit durch heisspraegen aufgebrachten metallischen leitern
US4591667A (en) * 1984-03-06 1986-05-27 Onkyo Kabushiki Kaisha Dome speaker with cut-out portions in the voice coil bobbin
US4709392A (en) * 1984-03-08 1987-11-24 Onkyo Kabushiki Kaisha Dome speaker with a diaphragm having at least one elongated cut-out portion
JPS6173498A (ja) * 1984-09-19 1986-04-15 Onkyo Corp スピ−カ用振動板
US4764327A (en) * 1986-01-14 1988-08-16 Mitsubishi Gas Chemical Company, Inc. Process of producing plastic-molded printed circuit boards
DE3615583C2 (de) * 1986-05-09 1995-05-24 Hella Kg Hueck & Co Schaltungsanordnung
DE3640760A1 (de) * 1986-11-28 1988-06-01 Richard Landgraf Anordnung mit elektrischen leiterbahnen und verfahren zur herstellung der anordnung
DE3717306A1 (de) * 1987-05-22 1988-12-01 Ruf Kg Wilhelm Verfahren zum herstellen eines elektrischen kontaktes und nach dem verfahren hergestellte leiterbahnplatte
DE3801352A1 (de) * 1988-01-19 1989-07-27 Standard Elektrik Lorenz Ag Leiterplatte
DE3836405A1 (de) * 1988-10-26 1990-05-03 Teves Gmbh Alfred Platinenanordnung, insbesondere fuer einen ventilblock einer schlupfgeregelten hydraulischen bremsanlage
ES2281000T3 (es) 2003-06-23 2007-09-16 IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A. Sensor de ocupacion de asiento.

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS445657Y1 (es) * 1966-12-22 1969-02-28

Also Published As

Publication number Publication date
AR213322A1 (es) 1979-01-15
JPS5326967A (en) 1978-03-13
AU2743477A (en) 1979-03-08
FR2363260A1 (fr) 1978-03-24
BR7705677A (pt) 1978-06-27
ZA775017B (en) 1978-07-26
DE2734819A1 (de) 1978-03-02
IT1079835B (it) 1985-05-13
NL7709361A (nl) 1978-02-28
SE7709349L (sv) 1978-02-27
AU506055B2 (en) 1979-12-13

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