JPS5259572A - Electronic circuit device - Google Patents

Electronic circuit device

Info

Publication number
JPS5259572A
JPS5259572A JP50135086A JP13508675A JPS5259572A JP S5259572 A JPS5259572 A JP S5259572A JP 50135086 A JP50135086 A JP 50135086A JP 13508675 A JP13508675 A JP 13508675A JP S5259572 A JPS5259572 A JP S5259572A
Authority
JP
Japan
Prior art keywords
circuit device
electronic circuit
electronic parts
theremal
integration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50135086A
Other languages
Japanese (ja)
Other versions
JPS5631894B2 (en
Inventor
Manabu Nakagawa
Hajime Murakami
Michio Yanatori
Hiroshi Tsuneno
Minoru Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50135086A priority Critical patent/JPS5259572A/en
Publication of JPS5259572A publication Critical patent/JPS5259572A/en
Publication of JPS5631894B2 publication Critical patent/JPS5631894B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To reduce the thermal resistance of an electronic circuit device and increase the scale of integration by mounting electronic parts on a good theremal-conductive member and securing said member to a member provided with wiring patterns for the electronic parts.
JP50135086A 1975-11-12 1975-11-12 Electronic circuit device Granted JPS5259572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50135086A JPS5259572A (en) 1975-11-12 1975-11-12 Electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50135086A JPS5259572A (en) 1975-11-12 1975-11-12 Electronic circuit device

Publications (2)

Publication Number Publication Date
JPS5259572A true JPS5259572A (en) 1977-05-17
JPS5631894B2 JPS5631894B2 (en) 1981-07-24

Family

ID=15143492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50135086A Granted JPS5259572A (en) 1975-11-12 1975-11-12 Electronic circuit device

Country Status (1)

Country Link
JP (1) JPS5259572A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0613494A (en) * 1992-12-04 1994-01-21 Sumitomo Electric Ind Ltd Substrate for semiconductor device
US5708959A (en) * 1982-07-26 1998-01-13 Sumitomo Electric Industries, Ltd. Substrate for semiconductor apparatus
US6876075B2 (en) 2000-03-15 2005-04-05 Sumitomo Electric Industries, Ltd. Aluminum-silicon carbide semiconductor substrate and method for producing the same
JP2010034212A (en) * 2008-07-28 2010-02-12 Toshiba Corp High-frequency ceramic package and method of fabricating the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49123954U (en) * 1973-02-23 1974-10-23
JPS5128960A (en) * 1974-09-04 1976-03-11 Seiko Instr & Electronics HANDORINGUSOCHI
JPS51110269A (en) * 1975-03-24 1976-09-29 Nippon Electric Co Handotaisochino kimitsufushikumitatehoho

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49123954U (en) * 1973-02-23 1974-10-23
JPS5128960A (en) * 1974-09-04 1976-03-11 Seiko Instr & Electronics HANDORINGUSOCHI
JPS51110269A (en) * 1975-03-24 1976-09-29 Nippon Electric Co Handotaisochino kimitsufushikumitatehoho

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5708959A (en) * 1982-07-26 1998-01-13 Sumitomo Electric Industries, Ltd. Substrate for semiconductor apparatus
JPH0613494A (en) * 1992-12-04 1994-01-21 Sumitomo Electric Ind Ltd Substrate for semiconductor device
US6876075B2 (en) 2000-03-15 2005-04-05 Sumitomo Electric Industries, Ltd. Aluminum-silicon carbide semiconductor substrate and method for producing the same
JP2010034212A (en) * 2008-07-28 2010-02-12 Toshiba Corp High-frequency ceramic package and method of fabricating the same
US8476755B2 (en) 2008-07-28 2013-07-02 Kabushiki Kaisha Toshiba High frequency ceramic package and fabrication method for the same

Also Published As

Publication number Publication date
JPS5631894B2 (en) 1981-07-24

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