JPS51110269A - Handotaisochino kimitsufushikumitatehoho - Google Patents

Handotaisochino kimitsufushikumitatehoho

Info

Publication number
JPS51110269A
JPS51110269A JP3506575A JP3506575A JPS51110269A JP S51110269 A JPS51110269 A JP S51110269A JP 3506575 A JP3506575 A JP 3506575A JP 3506575 A JP3506575 A JP 3506575A JP S51110269 A JPS51110269 A JP S51110269A
Authority
JP
Japan
Prior art keywords
kimitsufushikumitatehoho
handotaisochino
handotaisochino kimitsufushikumitatehoho
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3506575A
Other languages
Japanese (ja)
Other versions
JPS5917542B2 (en
Inventor
Eiji Hagimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP50035065A priority Critical patent/JPS5917542B2/en
Publication of JPS51110269A publication Critical patent/JPS51110269A/en
Publication of JPS5917542B2 publication Critical patent/JPS5917542B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
JP50035065A 1975-03-24 1975-03-24 Hermetically sealed assembly method for semiconductor devices Expired JPS5917542B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50035065A JPS5917542B2 (en) 1975-03-24 1975-03-24 Hermetically sealed assembly method for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50035065A JPS5917542B2 (en) 1975-03-24 1975-03-24 Hermetically sealed assembly method for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS51110269A true JPS51110269A (en) 1976-09-29
JPS5917542B2 JPS5917542B2 (en) 1984-04-21

Family

ID=12431607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50035065A Expired JPS5917542B2 (en) 1975-03-24 1975-03-24 Hermetically sealed assembly method for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5917542B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259572A (en) * 1975-11-12 1977-05-17 Hitachi Ltd Electronic circuit device
JPS60247955A (en) * 1984-04-02 1985-12-07 バロ−ス・コ−ポレ−シヨン Electromechanical assembly of integrated circuit die
JPS62183543A (en) * 1986-02-07 1987-08-11 Hitachi Ltd Semiconductor device package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48104469A (en) * 1972-04-14 1973-12-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48104469A (en) * 1972-04-14 1973-12-27

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259572A (en) * 1975-11-12 1977-05-17 Hitachi Ltd Electronic circuit device
JPS5631894B2 (en) * 1975-11-12 1981-07-24
JPS60247955A (en) * 1984-04-02 1985-12-07 バロ−ス・コ−ポレ−シヨン Electromechanical assembly of integrated circuit die
JPH0473625B2 (en) * 1984-04-02 1992-11-24
JPS62183543A (en) * 1986-02-07 1987-08-11 Hitachi Ltd Semiconductor device package

Also Published As

Publication number Publication date
JPS5917542B2 (en) 1984-04-21

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