JPS5326967A - Die molding circuit board - Google Patents

Die molding circuit board

Info

Publication number
JPS5326967A
JPS5326967A JP10023077A JP10023077A JPS5326967A JP S5326967 A JPS5326967 A JP S5326967A JP 10023077 A JP10023077 A JP 10023077A JP 10023077 A JP10023077 A JP 10023077A JP S5326967 A JPS5326967 A JP S5326967A
Authority
JP
Japan
Prior art keywords
circuit board
die molding
molding circuit
die
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10023077A
Other languages
English (en)
Inventor
Rarufu Erichiero Dominitsuku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of JPS5326967A publication Critical patent/JPS5326967A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09045—Locally raised area or protrusion of insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/1003—Non-printed inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10863—Adaptations of leads or holes for facilitating insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP10023077A 1976-08-26 1977-08-23 Die molding circuit board Pending JPS5326967A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71785676A 1976-08-26 1976-08-26

Publications (1)

Publication Number Publication Date
JPS5326967A true JPS5326967A (en) 1978-03-13

Family

ID=24883769

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10023077A Pending JPS5326967A (en) 1976-08-26 1977-08-23 Die molding circuit board

Country Status (11)

Country Link
JP (1) JPS5326967A (ja)
AR (1) AR213322A1 (ja)
AU (2) AU506055B2 (ja)
BR (1) BR7705677A (ja)
DE (1) DE2734819A1 (ja)
ES (1) ES461902A1 (ja)
FR (1) FR2363260A1 (ja)
IT (1) IT1079835B (ja)
NL (1) NL7709361A (ja)
SE (1) SE7709349L (ja)
ZA (1) ZA775017B (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56109096A (en) * 1980-02-01 1981-08-29 Nippon Gakki Seizo Kk Diaphragm plate for audio equipment
JPS6173498A (ja) * 1984-09-19 1986-04-15 Onkyo Corp スピ−カ用振動板
US4591667A (en) * 1984-03-06 1986-05-27 Onkyo Kabushiki Kaisha Dome speaker with cut-out portions in the voice coil bobbin
US4709392A (en) * 1984-03-08 1987-11-24 Onkyo Kabushiki Kaisha Dome speaker with a diaphragm having at least one elongated cut-out portion
US8115648B2 (en) 2003-06-23 2012-02-14 Iee International Electronics & Engineering S.A. Seat occupancy sensor

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3326968A1 (de) * 1982-06-12 1985-02-14 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen Traegerbauteil aus thermoplastischem material mit durch heisspraegen aufgebrachten metallischen leitern
US4764327A (en) * 1986-01-14 1988-08-16 Mitsubishi Gas Chemical Company, Inc. Process of producing plastic-molded printed circuit boards
DE3615583C2 (de) * 1986-05-09 1995-05-24 Hella Kg Hueck & Co Schaltungsanordnung
DE3640760A1 (de) * 1986-11-28 1988-06-01 Richard Landgraf Anordnung mit elektrischen leiterbahnen und verfahren zur herstellung der anordnung
DE3717306A1 (de) * 1987-05-22 1988-12-01 Ruf Kg Wilhelm Verfahren zum herstellen eines elektrischen kontaktes und nach dem verfahren hergestellte leiterbahnplatte
DE3801352A1 (de) * 1988-01-19 1989-07-27 Standard Elektrik Lorenz Ag Leiterplatte
DE3836405A1 (de) * 1988-10-26 1990-05-03 Teves Gmbh Alfred Platinenanordnung, insbesondere fuer einen ventilblock einer schlupfgeregelten hydraulischen bremsanlage

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS445657Y1 (ja) * 1966-12-22 1969-02-28

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS445657Y1 (ja) * 1966-12-22 1969-02-28

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56109096A (en) * 1980-02-01 1981-08-29 Nippon Gakki Seizo Kk Diaphragm plate for audio equipment
US4591667A (en) * 1984-03-06 1986-05-27 Onkyo Kabushiki Kaisha Dome speaker with cut-out portions in the voice coil bobbin
US4709392A (en) * 1984-03-08 1987-11-24 Onkyo Kabushiki Kaisha Dome speaker with a diaphragm having at least one elongated cut-out portion
JPS6173498A (ja) * 1984-09-19 1986-04-15 Onkyo Corp スピ−カ用振動板
US8115648B2 (en) 2003-06-23 2012-02-14 Iee International Electronics & Engineering S.A. Seat occupancy sensor

Also Published As

Publication number Publication date
FR2363260A1 (fr) 1978-03-24
ZA775017B (en) 1978-07-26
DE2734819A1 (de) 1978-03-02
AU2743477A (en) 1979-03-08
AU506055B2 (en) 1979-12-13
IT1079835B (it) 1985-05-13
ES461902A1 (es) 1978-06-01
AR213322A1 (es) 1979-01-15
SE7709349L (sv) 1978-02-27
BR7705677A (pt) 1978-06-27
NL7709361A (nl) 1978-02-28

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