AU506055B2 - Molded printed circuit board - Google Patents
Molded printed circuit boardInfo
- Publication number
- AU506055B2 AU506055B2 AU27434/77A AU2743476A AU506055B2 AU 506055 B2 AU506055 B2 AU 506055B2 AU 27434/77 A AU27434/77 A AU 27434/77A AU 2743476 A AU2743476 A AU 2743476A AU 506055 B2 AU506055 B2 AU 506055B2
- Authority
- AU
- Australia
- Prior art keywords
- circuit board
- printed circuit
- molded printed
- molded
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/119—Details of rigid insulating substrates therefor, e.g. three-dimensional details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10446—Mounted on an edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10863—Adaptations of leads or holes for facilitating insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US71785676A | 1976-08-26 | 1976-08-26 | |
USUS717856 | 1976-08-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
AU506055B2 true AU506055B2 (en) | 1979-12-13 |
Family
ID=24883769
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU27434/77A Expired AU506055B2 (en) | 1976-08-26 | 1977-07-29 | Molded printed circuit board |
AU27434/77A Granted AU2743477A (en) | 1976-08-26 | 1977-07-29 | Molded printed circuit board |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU27434/77A Granted AU2743477A (en) | 1976-08-26 | 1977-07-29 | Molded printed circuit board |
Country Status (11)
Country | Link |
---|---|
JP (1) | JPS5326967A (en) |
AR (1) | AR213322A1 (en) |
AU (2) | AU506055B2 (en) |
BR (1) | BR7705677A (en) |
DE (1) | DE2734819A1 (en) |
ES (1) | ES461902A1 (en) |
FR (1) | FR2363260A1 (en) |
IT (1) | IT1079835B (en) |
NL (1) | NL7709361A (en) |
SE (1) | SE7709349L (en) |
ZA (1) | ZA775017B (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56109096A (en) * | 1980-02-01 | 1981-08-29 | Nippon Gakki Seizo Kk | Diaphragm plate for audio equipment |
DE3326968A1 (en) * | 1982-06-12 | 1985-02-14 | IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen | Support member made of thermoplastic material having metallic conductors applied by hot embossing |
US4591667A (en) * | 1984-03-06 | 1986-05-27 | Onkyo Kabushiki Kaisha | Dome speaker with cut-out portions in the voice coil bobbin |
US4709392A (en) * | 1984-03-08 | 1987-11-24 | Onkyo Kabushiki Kaisha | Dome speaker with a diaphragm having at least one elongated cut-out portion |
JPS6173498A (en) * | 1984-09-19 | 1986-04-15 | Onkyo Corp | Diaphragm for speaker |
DE3700902A1 (en) * | 1986-01-14 | 1987-07-16 | Mitsubishi Gas Chemical Co | METHOD OF MANUFACTURING PLASTIC MOLDED PRINTED CIRCUIT PANELS |
DE3615583C2 (en) * | 1986-05-09 | 1995-05-24 | Hella Kg Hueck & Co | Circuit arrangement |
DE3640760A1 (en) * | 1986-11-28 | 1988-06-01 | Richard Landgraf | Arrangement having electrical conductor tracks, and a method for producing the arrangement |
DE3717306A1 (en) * | 1987-05-22 | 1988-12-01 | Ruf Kg Wilhelm | METHOD FOR PRODUCING AN ELECTRICAL CONTACT, AND CIRCUIT BOARD PRODUCED BY THE METHOD |
DE3801352A1 (en) * | 1988-01-19 | 1989-07-27 | Standard Elektrik Lorenz Ag | Printed circuit board |
DE3836405A1 (en) * | 1988-10-26 | 1990-05-03 | Teves Gmbh Alfred | Board arrangement, especially for a valve block of an anti-skid (skid-controlled) hydraulic braking system |
WO2005000637A1 (en) | 2003-06-23 | 2005-01-06 | Iee International Electronics & Engineering S.A. | Seat occupancy sensor |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS445657Y1 (en) * | 1966-12-22 | 1969-02-28 |
-
1977
- 1977-07-29 AU AU27434/77A patent/AU506055B2/en not_active Expired
- 1977-07-29 AU AU27434/77A patent/AU2743477A/en active Granted
- 1977-08-02 DE DE19772734819 patent/DE2734819A1/en not_active Withdrawn
- 1977-08-17 IT IT50697/77A patent/IT1079835B/en active
- 1977-08-18 ZA ZA00775017A patent/ZA775017B/en unknown
- 1977-08-19 SE SE7709349A patent/SE7709349L/en not_active Application Discontinuation
- 1977-08-23 JP JP10023077A patent/JPS5326967A/en active Pending
- 1977-08-23 AR AR268916A patent/AR213322A1/en active
- 1977-08-24 FR FR7725856A patent/FR2363260A1/en not_active Withdrawn
- 1977-08-24 NL NL7709361A patent/NL7709361A/en not_active Application Discontinuation
- 1977-08-25 BR BR7705677A patent/BR7705677A/en unknown
- 1977-08-26 ES ES461902A patent/ES461902A1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS5326967A (en) | 1978-03-13 |
FR2363260A1 (en) | 1978-03-24 |
ZA775017B (en) | 1978-07-26 |
ES461902A1 (en) | 1978-06-01 |
IT1079835B (en) | 1985-05-13 |
AR213322A1 (en) | 1979-01-15 |
NL7709361A (en) | 1978-02-28 |
DE2734819A1 (en) | 1978-03-02 |
SE7709349L (en) | 1978-02-27 |
AU2743477A (en) | 1979-03-08 |
BR7705677A (en) | 1978-06-27 |
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