BR7705677A - MOLDED CIRCUIT PANEL - Google Patents

MOLDED CIRCUIT PANEL

Info

Publication number
BR7705677A
BR7705677A BR7705677A BR7705677A BR7705677A BR 7705677 A BR7705677 A BR 7705677A BR 7705677 A BR7705677 A BR 7705677A BR 7705677 A BR7705677 A BR 7705677A BR 7705677 A BR7705677 A BR 7705677A
Authority
BR
Brazil
Prior art keywords
circuit panel
molded circuit
molded
panel
circuit
Prior art date
Application number
BR7705677A
Other languages
Portuguese (pt)
Inventor
D Errichiello
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of BR7705677A publication Critical patent/BR7705677A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/119Details of rigid insulating substrates therefor, e.g. three-dimensional details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0284Details of three-dimensional rigid printed circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/117Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09045Locally raised area or protrusion of insulating substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09118Moulded substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827Tapered, e.g. tapered hole, via or groove
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845Stepped hole, via, edge, bump or conductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854Hole or via having special cross-section, e.g. elliptical
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/1003Non-printed inductor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10446Mounted on an edge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/1075Shape details
    • H05K2201/10863Adaptations of leads or holes for facilitating insertion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
BR7705677A 1976-08-26 1977-08-25 MOLDED CIRCUIT PANEL BR7705677A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71785676A 1976-08-26 1976-08-26

Publications (1)

Publication Number Publication Date
BR7705677A true BR7705677A (en) 1978-06-27

Family

ID=24883769

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7705677A BR7705677A (en) 1976-08-26 1977-08-25 MOLDED CIRCUIT PANEL

Country Status (11)

Country Link
JP (1) JPS5326967A (en)
AR (1) AR213322A1 (en)
AU (2) AU506055B2 (en)
BR (1) BR7705677A (en)
DE (1) DE2734819A1 (en)
ES (1) ES461902A1 (en)
FR (1) FR2363260A1 (en)
IT (1) IT1079835B (en)
NL (1) NL7709361A (en)
SE (1) SE7709349L (en)
ZA (1) ZA775017B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56109096A (en) * 1980-02-01 1981-08-29 Nippon Gakki Seizo Kk Diaphragm plate for audio equipment
DE3326968A1 (en) * 1982-06-12 1985-02-14 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen Support member made of thermoplastic material having metallic conductors applied by hot embossing
US4591667A (en) * 1984-03-06 1986-05-27 Onkyo Kabushiki Kaisha Dome speaker with cut-out portions in the voice coil bobbin
US4709392A (en) * 1984-03-08 1987-11-24 Onkyo Kabushiki Kaisha Dome speaker with a diaphragm having at least one elongated cut-out portion
JPS6173498A (en) * 1984-09-19 1986-04-15 Onkyo Corp Diaphragm for speaker
US4764327A (en) * 1986-01-14 1988-08-16 Mitsubishi Gas Chemical Company, Inc. Process of producing plastic-molded printed circuit boards
DE3615583C2 (en) * 1986-05-09 1995-05-24 Hella Kg Hueck & Co Circuit arrangement
DE3640760A1 (en) * 1986-11-28 1988-06-01 Richard Landgraf Arrangement having electrical conductor tracks, and a method for producing the arrangement
DE3717306A1 (en) * 1987-05-22 1988-12-01 Ruf Kg Wilhelm METHOD FOR PRODUCING AN ELECTRICAL CONTACT, AND CIRCUIT BOARD PRODUCED BY THE METHOD
DE3801352A1 (en) * 1988-01-19 1989-07-27 Standard Elektrik Lorenz Ag Printed circuit board
DE3836405A1 (en) * 1988-10-26 1990-05-03 Teves Gmbh Alfred Board arrangement, especially for a valve block of an anti-skid (skid-controlled) hydraulic braking system
KR20060029629A (en) 2003-06-23 2006-04-06 아이이이 인터내셔날 일렉트로닉스 앤드 엔지니어링 에스.에이. Seat occupancy sensor

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS445657Y1 (en) * 1966-12-22 1969-02-28

Also Published As

Publication number Publication date
FR2363260A1 (en) 1978-03-24
ZA775017B (en) 1978-07-26
DE2734819A1 (en) 1978-03-02
AU2743477A (en) 1979-03-08
AU506055B2 (en) 1979-12-13
IT1079835B (en) 1985-05-13
ES461902A1 (en) 1978-06-01
AR213322A1 (en) 1979-01-15
SE7709349L (en) 1978-02-27
JPS5326967A (en) 1978-03-13
NL7709361A (en) 1978-02-28

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