JPS6216542B2 - - Google Patents
Info
- Publication number
- JPS6216542B2 JPS6216542B2 JP54122582A JP12258279A JPS6216542B2 JP S6216542 B2 JPS6216542 B2 JP S6216542B2 JP 54122582 A JP54122582 A JP 54122582A JP 12258279 A JP12258279 A JP 12258279A JP S6216542 B2 JPS6216542 B2 JP S6216542B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- molding
- mold
- flexible printed
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 10
- 229920005992 thermoplastic resin Polymers 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- -1 POLYPHENYLEN Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
- G04G17/04—Mounting of electronic components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Description
【発明の詳細な説明】
本発明はフレキシブルプリント板にワイヤーレ
スにてボンデイングされたICを熱可塑性の樹脂
にて封入成形した回路基体の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a circuit board in which an IC wirelessly bonded to a flexible printed board is encapsulated in a thermoplastic resin.
従来、ICの封入樹脂としては熱硬化性樹脂で
あり熱可塑性樹脂の例は見なかつた。熱硬化性樹
脂でも殆んどエポキシ樹脂であり、成形による封
入方式としてはトランスフアー成形機に依る低圧
封入方式が使われている。前記トランスフアー成
形機に依る低圧封入成形の場合には、成形時間が
長く１分半〜２分かかり、工数増加となつた。工
数低減の方法としてはエポキシ成形材料の硬化時
間を更に短かくするか又は金型を多数個取りにし
たものが考えられる。硬化時間を速めた速硬化タ
イプは現在開発中であるが上記速硬化タイプでも
硬化時間は約１分間はかかるし、金型を多数個取
りにする場合には相当の費用がかかるという欠点
があつた。 Conventionally, thermosetting resins have been used as the encapsulating resin for ICs, and there have been no examples of thermoplastic resins being used. Most of the thermosetting resins are epoxy resins, and the low-pressure encapsulation method using a transfer molding machine is used as the encapsulation method by molding. In the case of low-pressure encapsulation molding using the transfer molding machine, the molding time was long, taking 1 and a half to 2 minutes, resulting in an increase in the number of man-hours. Possible methods for reducing the number of steps include further shortening the curing time of the epoxy molding material or using multiple molds. A fast-curing type with a faster curing time is currently under development, but even with the above-mentioned fast-curing type, the curing time takes about 1 minute, and the disadvantage is that it costs a lot of money when molding multiple molds. Ta.
ICがワイヤーレスボンデイングされた可撓性
を有する回路基板を成形金型にインサートし、熱
可塑性樹脂のIC封入グレードを使用して封入成
形する際、ICと基板に金型としての何の規制も
加えず、フリーにした場合には、成形圧力で基板
が曲げられ、更に成形時の流れの関係でICその
ものが押し流されてしまい位置が安定しない。ま
た成形圧力でリードが曲げられた際には、リード
がICの接続用パツドの近くのエツジ部にて接触
するという現象（シヨルダータツチ）が発生し、
回路としては致命的な欠点となるものがあつた。 When inserting a flexible circuit board on which an IC is wirelessly bonded into a mold and encapsulating it using an IC encapsulation grade thermoplastic resin, there are no restrictions on the IC and the board as part of the mold. If the substrate is left free without any additional pressure, the molding pressure will bend the substrate, and the flow during molding will also wash away the IC itself, making it unstable in position. Furthermore, when the leads are bent by molding pressure, a phenomenon occurs in which the leads come into contact at the edges near the IC connection pads (shoulder touch).
The circuit had a fatal flaw.
本発明は上記数々の欠点を解決し、製造コスト
が廉く、信頼性高く、小型薄型の電子時計の提供
を目的としている。 The present invention aims to solve the above-mentioned drawbacks and to provide an electronic timepiece that is inexpensive to manufacture, highly reliable, and small and thin.
上記目的を達成する為、本発明に於いては、
IC実装方式としてワイヤーレスボンデイング
（例えばミニモツド法）された基板を使い、IC封
入樹脂としては熱硬化性樹脂を使わず、生産性抜
群の熱可塑性樹脂を使用し、構造的にはICの封
入と同時に他のエレメントの収納部を一体成形
し、ICの配線パターン側にあるボンデイング部
を成形金型の凸起部で受け、また樹脂の流れ方を
該凸起部にてICを受けるが如くしてある。 In order to achieve the above object, in the present invention,
As the IC mounting method, a wireless bonding (for example, MiniMotsudo method) substrate is used, and as the IC encapsulation resin, a thermoplastic resin with excellent productivity is used instead of a thermosetting resin. At the same time, the storage parts for other elements are integrally molded, and the bonding part on the wiring pattern side of the IC is received by the protrusion of the mold, and the flow of resin is adjusted so that the IC is received by the protrusion. There is.
以下図面に依り本発明の実施例を時計用回路基
体を例にとつて詳記する。第１図は本発明に於け
る時計用回路基体の平面図であり、第２図は第１
図の時計用回路基体に表示セル、電池、コネクタ
ー等を組込んだデジタル電子時計用モジユールの
Ａ―Ａ断面であり、第３図はリードが成形圧力に
より曲げられ、シヨルダータツチが発生している
図であり、第４図はフレキシブルプリント基板を
金型にインサートした時の金型とフレキシブル基
板の位置関係を示し、第５図はインサート成形し
た後、成形品のICの配線パターン側の凹部にポ
ツテイングした状態図、第６図は他の実施例で、
該凹部にプラスチツクの成形品を嵌合させた状態
を示す図である。 Embodiments of the present invention will be described in detail below with reference to the drawings, taking a circuit board for a watch as an example. FIG. 1 is a plan view of a circuit board for a timepiece according to the present invention, and FIG.
This is an A-A cross section of a digital electronic watch module that incorporates display cells, batteries, connectors, etc. into the watch circuit board shown in the figure, and Figure 3 is a diagram where the leads are bent by molding pressure and shoulder touch occurs. Figure 4 shows the positional relationship between the mold and the flexible printed circuit board when the flexible printed circuit board is inserted into the mold, and Figure 5 shows the positional relationship between the flexible printed circuit board and the mold after insert molding. The state diagram shown in FIG. 6 is another embodiment,
FIG. 6 is a diagram showing a state in which a plastic molded product is fitted into the recess.
第１、第２図に於いて、１はIC２をミニモツ
ド法にて塔載したフレキシブルプリント基板３を
成形金型にインサートし低圧封入成形可能な熱可
塑性樹脂にて封入成形した時計用回路基体であ
り、該時計用回路基体１には表示セルとの接続の
役目をなすコネクターを収納する為のコネクター
収納部３０、電池を収納する為の電池収納部４、
水晶振動子を収納する為の水晶振動子収納部５、
昇圧用チツプコンデンサーを収納する為の昇圧用
チツプコンデンサー収納部６及び他のエレメント
を収納する為の各収納部７，８が同時成形されて
いる。 In Figures 1 and 2, 1 is a watch circuit board in which a flexible printed circuit board 3 on which an IC 2 is mounted using the minimod method is inserted into a mold and encapsulated with a thermoplastic resin that can be molded under low pressure. The watch circuit board 1 includes a connector storage part 30 for storing a connector serving as a connection with a display cell, a battery storage part 4 for storing a battery,
a crystal oscillator storage section 5 for storing a crystal oscillator;
A boosting chip capacitor accommodating section 6 for accommodating a boosting chip capacitor and respective accommodating sections 7 and 8 for accommodating other elements are simultaneously molded.
低圧封入可能な熱可塑性樹脂として本実施例で
はPPS（POLYPHENYLEN SU―LFIDE）樹脂
のIC封入グレードを使用した。成形時間は約20
秒で生産性は抜群である。ICはミニモツド法に
てボンデイングされているので、IC実装部の高
さは、ワイヤー使用時よりも低く出来、モジユー
ル厚として今迄より薄くすることが出来た。更に
ワイヤーよりもリードそのものの強度が強く、ボ
ンデイング強さも大なので、断線、剥離という現
象は起きなく、信頼性も向上した。また９は後述
する成形工程に於いてICの配線パターン側に設
けられた凹部にポツテイングにて埋めるかプラス
チツクの成形品を嵌合させてある。１１はコネク
ター、１２は表示セル、１３は電池、１４は昇圧
用チツプコンデンサーであり、１５は時計用回路
基体１に植設された電池接続用バネである。前記
各収納部３０，４，５，６，７，８にそれぞれコ
ネクター、電池、水晶振動子、昇圧用チツプコン
デンサー等の電気エレメントを収納し、更に表示
セル１２を塔載することに依りモジユールを完成
する。このことにより大巾に組立工数は低減され
た。 In this example, an IC encapsulation grade PPS (POLYPHENYLEN SU-LFIDE) resin was used as a thermoplastic resin that can be encapsulated at low pressure. Molding time is about 20
Productivity is outstanding in seconds. Since the IC is bonded using the MiniMod method, the height of the IC mounting part can be lower than when using wire, and the module thickness can be made thinner than before. Furthermore, the lead itself is stronger than the wire, and the bonding strength is also greater, so there is no disconnection or peeling, and reliability is improved. Further, in the molding process described later, a recess provided on the wiring pattern side of the IC is filled by potting or a plastic molded product is fitted into the recess. 11 is a connector, 12 is a display cell, 13 is a battery, 14 is a boosting chip capacitor, and 15 is a battery connection spring embedded in the watch circuit board 1. Electrical elements such as connectors, batteries, crystal oscillators, boosting chip capacitors, etc. are housed in each of the housing sections 30, 4, 5, 6, 7, and 8, and the display cell 12 is mounted thereon to form a module. Complete. This greatly reduced assembly man-hours.
第３図に於いて、１６はフレキシブルプリント
板３上の配線パターンがデバイスホール部に延び
たICボンデイング用のリードであり、Ｂ部はリ
ード１６が成形圧力に依りIC２の肩部に接触す
るシヨルダータツチを示している。シヨルダータ
ツチ現象を無くす手段として、第４図に示すよう
に成形金型１７にフレキシブルプリント基板３を
インサートし、該フレキシブルプリント基板３上
のIC２の配線パターン側のボンデイング部１８
を成形金型１７の凸起部１９で受けるようにし、
更にリード部１６も該凸起部１９にて受けるよう
にした。また第４図内の矢印は樹脂の流れを示
す。このように樹脂を流すことに依り、IC２と
リード部１６は金型１７の凸起部１９に押しつけ
られるが如く封入成形されるのでリード部１６の
曲がりは無く、シヨルダータツチは完全に無くな
つた。またIC２の配線パターン側を金型で受け
るということには信頼性の面で不安が有つたが、
ICのボンデイング部１８を受けるようにし、配
線パターンそのものを受けるわけではないので問
題は無かつた。第４図はフレキシブルプリント基
板３を成形金型１７にインサートし、金型１７が
閉じた状態であるが、この状態に、PPS樹脂のIC
封入グレードを低圧にて成形した時の成形品を第
５図の斜線部２０にて示す。ポツテイング部２１
はICを保護すると共に信頼性を向上させてい
る。 In FIG. 3, 16 is a lead for IC bonding in which the wiring pattern on the flexible printed board 3 extends to the device hole part, and part B is a shoulder touch where the lead 16 contacts the shoulder part of the IC 2 due to the molding pressure. It shows. As a means to eliminate the shoulder touch phenomenon, the flexible printed circuit board 3 is inserted into the molding die 17 as shown in FIG.
is received by the convex portion 19 of the molding die 17,
Furthermore, the lead portion 16 is also received by the convex portion 19. Further, the arrows in FIG. 4 indicate the flow of resin. By pouring the resin in this manner, the IC 2 and the lead portion 16 are encapsulated and molded so as to be pressed against the convex portion 19 of the mold 17, so that the lead portion 16 does not bend and shoulder touch is completely eliminated. Also, I was worried about the reliability of having the wiring pattern side of IC2 supported by a mold.
There was no problem because the bonding part 18 of the IC was received and the wiring pattern itself was not received. Figure 4 shows a state in which the flexible printed circuit board 3 is inserted into the molding mold 17 and the mold 17 is closed.
The shaded area 20 in FIG. 5 shows a molded product obtained by molding the encapsulated grade at low pressure. Potting section 21
protects the IC and improves reliability.
上記ポツテイングの代わりにプラスチツクの成
形品２２を凹部に押し込んだ状態が第６図であ
る。 FIG. 6 shows a state in which a plastic molded product 22 is pushed into the recess instead of the above potting.
上記の如く、本発明は熱可塑性のIC封入グレ
ードをワイヤーレスボンデイングされたICの封
入として使いながら各エレメントの収納部まで形
成する際、成形金型に凸起を設け、該凸起にて
ICの配線パターン側のボンデイング部を受ける
ようにすることに依りシヨルダータツチ現象を無
くし、低廉化、薄型、小型化に加えて、大巾に信
頼性が向上した電子時計の製造を可能にした。 As described above, the present invention uses a thermoplastic IC encapsulating grade to encapsulate a wirelessly bonded IC and when forming up to the housing portion of each element, a protrusion is provided on the molding die, and the protrusion is
By receiving the bonding part on the wiring pattern side of the IC, the shoulder touch phenomenon was eliminated, making it possible to manufacture electronic watches that were not only cheaper, thinner, and more compact, but also greatly improved in reliability.
第１図は本発明に於ける時計用回路基体の平面
図、第２図は第１図の回路基体にエレメントを組
込んだ電子時計モジユールのＡ―Ａ断面図、第３
図はICボンデイング部の側面図、第４図はイン
サート成形に於けるICと成形金型及び樹脂の流
れの関係を示す説明図、第５図は本発明に於ける
時計用回路基体を実装した断面図、第６図は他の
実施例を示す実装断面図である。
１…時計用回路基体、２…IC、３…フレキシ
ブルプリント基板、１２…表示セル、１３…電
池。
FIG. 1 is a plan view of a circuit board for a timepiece according to the present invention, FIG. 2 is a sectional view taken along line AA of an electronic timepiece module incorporating elements into the circuit board of FIG. 1, and FIG.
The figure is a side view of the IC bonding part, Figure 4 is an explanatory diagram showing the relationship between the IC, the molding die, and the flow of resin during insert molding, and Figure 5 is a diagram showing the circuit board for a watch according to the present invention mounted. A cross-sectional view and FIG. 6 are mounting cross-sectional views showing another embodiment. 1... Clock circuit board, 2... IC, 3... Flexible printed circuit board, 12... Display cell, 13... Battery.
Claims (1)
ングしたフレキシブルプリント板を熱可塑性樹脂
によりインサートモールドしてなる回路基体の製
造方法に於いて、前記回路基体の成形時に成形用
金型に設けた凸起により前記ICの配線パターン
面を保持して前記ICの周囲を前記熱可塑性樹脂
にてモールドし、その後前記ICの配線パターン
面の側を保護部材により保護したことを特徴とす
る回路基体の製造方法。1. In a method for manufacturing a circuit board in which a flexible printed board on which an IC is wirelessly bonded by fingers is insert-molded with thermoplastic resin, the wiring of the IC is formed by protrusions provided on a molding die during molding of the circuit board. 1. A method of manufacturing a circuit board, comprising molding the periphery of the IC with the thermoplastic resin while holding the pattern surface, and then protecting the wiring pattern surface side of the IC with a protective member.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12258279A JPS5646540A (en) | 1979-09-26 | 1979-09-26 | Manufacture of circuit board for watch |
| CH40980A CH641626B (en) | 1979-01-18 | 1980-01-18 | METHOD OF MANUFACTURING ELECTRONIC CLOCK MODULES. |
| GB8001694A GB2042774B (en) | 1979-01-18 | 1980-01-18 | Fabricating method of electronic watch module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12258279A JPS5646540A (en) | 1979-09-26 | 1979-09-26 | Manufacture of circuit board for watch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5646540A JPS5646540A (en) | 1981-04-27 |
| JPS6216542B2 true JPS6216542B2 (en) | 1987-04-13 |
Family
ID=14839473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12258279A Granted JPS5646540A (en) | 1979-01-18 | 1979-09-26 | Manufacture of circuit board for watch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5646540A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2806476A1 (en) * | 2013-05-22 | 2014-11-26 | The Swatch Group Research and Development Ltd. | Electrochemical cell |
-
1979
- 1979-09-26 JP JP12258279A patent/JPS5646540A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5646540A (en) | 1981-04-27 |
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