JPS6215622B2 - - Google Patents
Info
- Publication number
- JPS6215622B2 JPS6215622B2 JP58233702A JP23370283A JPS6215622B2 JP S6215622 B2 JPS6215622 B2 JP S6215622B2 JP 58233702 A JP58233702 A JP 58233702A JP 23370283 A JP23370283 A JP 23370283A JP S6215622 B2 JPS6215622 B2 JP S6215622B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- alloy
- copper
- strength
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910045601 alloy Inorganic materials 0.000 claims description 24
- 239000000956 alloy Substances 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 10
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- 239000012535 impurity Substances 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 229910052802 copper Inorganic materials 0.000 description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052790 beryllium Inorganic materials 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052749 magnesium Inorganic materials 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- 229910052725 zinc Inorganic materials 0.000 description 3
- 229910052726 zirconium Inorganic materials 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370283A JPS59145749A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23370283A JPS59145749A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP606182A Division JPS58124254A (ja) | 1982-01-20 | 1982-01-20 | 半導体機器のリ−ド材用銅合金 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59145749A JPS59145749A (ja) | 1984-08-21 |
| JPS6215622B2 true JPS6215622B2 (zh) | 1987-04-08 |
Family
ID=16959204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23370283A Granted JPS59145749A (ja) | 1983-12-13 | 1983-12-13 | 半導体機器のリ−ド材用銅合金 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59145749A (zh) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5949293B2 (ja) * | 1982-06-05 | 1984-12-01 | 株式会社神戸製鋼所 | 電気電子部品用銅合金及びその製造法 |
| JPS61157651A (ja) * | 1984-12-28 | 1986-07-17 | Hitachi Metals Ltd | リ−ドフレ−ム用銅合金 |
| JPS60218440A (ja) * | 1984-04-13 | 1985-11-01 | Furukawa Electric Co Ltd:The | リ−ドフレ−ム用銅合金 |
| US4656003A (en) * | 1984-10-20 | 1987-04-07 | Kabushiki Kaisha Kobe Seiko Sho | Copper alloy and production of the same |
| US4692192A (en) * | 1984-10-30 | 1987-09-08 | Ngk Insulators, Ltd. | Electroconductive spring material |
| US4594221A (en) * | 1985-04-26 | 1986-06-10 | Olin Corporation | Multipurpose copper alloys with moderate conductivity and high strength |
| US4606889A (en) * | 1985-11-07 | 1986-08-19 | Cabot Corporation | Copper-titanium-beryllium alloy |
| JPS6396232A (ja) * | 1986-10-09 | 1988-04-27 | Kobe Steel Ltd | プラスチツク．ピン・グリツド・アレイｉｃリ−ドピン用銅合金およびその製造方法 |
| US7182823B2 (en) | 2002-07-05 | 2007-02-27 | Olin Corporation | Copper alloy containing cobalt, nickel and silicon |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5278621A (en) * | 1975-12-26 | 1977-07-02 | Tamagawa Kikai Kinzoku Kk | Copper alloy for lead frames of semiconductor elements |
| JPS54402A (en) * | 1977-06-02 | 1979-01-05 | Kokusai Kikou Kk | Work of protecting normal plane suitable for planting and its method of construction |
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS5616642A (en) * | 1979-07-20 | 1981-02-17 | Furukawa Kinzoku Kogyo Kk | High-strength corrosion-resistant copper alloy |
| JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
| JPS5895850A (ja) * | 1981-12-02 | 1983-06-07 | Kobe Steel Ltd | 集積回路のリ−ドフレ−ム用銅合金 |
| JPH05106A (ja) * | 1991-06-25 | 1993-01-08 | Matsushita Electric Works Ltd | ミラーキヤビネツト |
-
1983
- 1983-12-13 JP JP23370283A patent/JPS59145749A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5278621A (en) * | 1975-12-26 | 1977-07-02 | Tamagawa Kikai Kinzoku Kk | Copper alloy for lead frames of semiconductor elements |
| JPS54402A (en) * | 1977-06-02 | 1979-01-05 | Kokusai Kikou Kk | Work of protecting normal plane suitable for planting and its method of construction |
| JPS54100257A (en) * | 1978-01-25 | 1979-08-07 | Toshiba Corp | Lead frame |
| JPS5616642A (en) * | 1979-07-20 | 1981-02-17 | Furukawa Kinzoku Kogyo Kk | High-strength corrosion-resistant copper alloy |
| JPS572851A (en) * | 1980-06-06 | 1982-01-08 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
| JPS5895850A (ja) * | 1981-12-02 | 1983-06-07 | Kobe Steel Ltd | 集積回路のリ−ドフレ−ム用銅合金 |
| JPH05106A (ja) * | 1991-06-25 | 1993-01-08 | Matsushita Electric Works Ltd | ミラーキヤビネツト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59145749A (ja) | 1984-08-21 |
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