JPS54402A - Work of protecting normal plane suitable for planting and its method of construction - Google Patents
Work of protecting normal plane suitable for planting and its method of constructionInfo
- Publication number
- JPS54402A JPS54402A JP6394977A JP6394977A JPS54402A JP S54402 A JPS54402 A JP S54402A JP 6394977 A JP6394977 A JP 6394977A JP 6394977 A JP6394977 A JP 6394977A JP S54402 A JPS54402 A JP S54402A
- Authority
- JP
- Japan
- Prior art keywords
- planting
- construction
- work
- normal plane
- protecting normal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Pit Excavations, Shoring, Fill Or Stabilisation Of Slopes (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6394977A JPS54402A (en) | 1977-06-02 | 1977-06-02 | Work of protecting normal plane suitable for planting and its method of construction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6394977A JPS54402A (en) | 1977-06-02 | 1977-06-02 | Work of protecting normal plane suitable for planting and its method of construction |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54402A true JPS54402A (en) | 1979-01-05 |
Family
ID=13244087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6394977A Pending JPS54402A (en) | 1977-06-02 | 1977-06-02 | Work of protecting normal plane suitable for planting and its method of construction |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54402A (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5770245A (en) * | 1980-10-20 | 1982-04-30 | Mitsui Mining & Smelting Co Ltd | Highly electrically conductive copper alloy |
JPS57169047A (en) * | 1981-04-09 | 1982-10-18 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
JPS58123862A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Manufacture of copper alloy for lead material for semiconductor apparatus |
JPS58123846A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Lead material for semiconductor apparatus |
JPS59145745A (en) * | 1983-12-13 | 1984-08-21 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor apparatus |
JPS59145749A (en) * | 1983-12-13 | 1984-08-21 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor apparatus |
JPS59145746A (en) * | 1983-12-13 | 1984-08-21 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor apparatus |
JPS59153853A (en) * | 1983-02-21 | 1984-09-01 | Hitachi Metals Ltd | Matrial for lead frame |
JPS60215723A (en) * | 1985-03-19 | 1985-10-29 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
JPH01127636A (en) * | 1988-09-16 | 1989-05-19 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor apparatus |
GB2248064A (en) * | 1990-09-18 | 1992-03-25 | Chubb Nat Foam Inc | Method for applying a biodegradable protein foam to a substrate |
JPH0754079A (en) * | 1992-09-07 | 1995-02-28 | Toshiba Corp | Copper alloy commonly having conductivity and strength |
JPH0770674A (en) * | 1994-06-06 | 1995-03-14 | Toshiba Corp | Semiconductor device |
CN110122204A (en) * | 2019-05-06 | 2019-08-16 | 辽宁大学 | A kind of method on the steel slag mountain that original position restoration of the ecosystem northern area is piled based on discarded steel slag |
-
1977
- 1977-06-02 JP JP6394977A patent/JPS54402A/en active Pending
Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5921941B2 (en) * | 1980-10-20 | 1984-05-23 | 三井金属鉱業株式会社 | Highly conductive copper alloy |
JPS5770245A (en) * | 1980-10-20 | 1982-04-30 | Mitsui Mining & Smelting Co Ltd | Highly electrically conductive copper alloy |
JPS57169047A (en) * | 1981-04-09 | 1982-10-18 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
JPS5853700B2 (en) * | 1981-04-09 | 1983-11-30 | 日本鉱業株式会社 | Copper alloy for lead material of semiconductor equipment |
JPS6045698B2 (en) * | 1982-01-20 | 1985-10-11 | 日本鉱業株式会社 | Lead material for semiconductor equipment |
JPS58123862A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Manufacture of copper alloy for lead material for semiconductor apparatus |
JPS58123846A (en) * | 1982-01-20 | 1983-07-23 | Nippon Mining Co Ltd | Lead material for semiconductor apparatus |
JPS6058783B2 (en) * | 1982-01-20 | 1985-12-21 | 日本鉱業株式会社 | Method for manufacturing copper alloy for lead material of semiconductor equipment |
JPS6140290B2 (en) * | 1983-02-21 | 1986-09-08 | Hitachi Metals Ltd | |
JPS59153853A (en) * | 1983-02-21 | 1984-09-01 | Hitachi Metals Ltd | Matrial for lead frame |
JPS59145745A (en) * | 1983-12-13 | 1984-08-21 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor apparatus |
JPS59145746A (en) * | 1983-12-13 | 1984-08-21 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor apparatus |
JPS59145749A (en) * | 1983-12-13 | 1984-08-21 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor apparatus |
JPS6215621B2 (en) * | 1983-12-13 | 1987-04-08 | Nippon Mining Co | |
JPS6215622B2 (en) * | 1983-12-13 | 1987-04-08 | Nippon Mining Co | |
JPS6239218B2 (en) * | 1983-12-13 | 1987-08-21 | Nippon Mining Co | |
JPH0218376B2 (en) * | 1985-03-19 | 1990-04-25 | Nippon Mining Co | |
JPS60215723A (en) * | 1985-03-19 | 1985-10-29 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor device |
JPH01127636A (en) * | 1988-09-16 | 1989-05-19 | Nippon Mining Co Ltd | Copper alloy for lead material of semiconductor apparatus |
GB2248064A (en) * | 1990-09-18 | 1992-03-25 | Chubb Nat Foam Inc | Method for applying a biodegradable protein foam to a substrate |
US5133991A (en) * | 1990-09-18 | 1992-07-28 | Chubb National Foam, Inc. | Method for applying a biodegradable protein foam to a substrate |
GB2248064B (en) * | 1990-09-18 | 1994-09-21 | Chubb Nat Foam Inc | Method for applying a biodegradable protein foam to a substrate |
JPH0754079A (en) * | 1992-09-07 | 1995-02-28 | Toshiba Corp | Copper alloy commonly having conductivity and strength |
JPH0770674A (en) * | 1994-06-06 | 1995-03-14 | Toshiba Corp | Semiconductor device |
CN110122204A (en) * | 2019-05-06 | 2019-08-16 | 辽宁大学 | A kind of method on the steel slag mountain that original position restoration of the ecosystem northern area is piled based on discarded steel slag |
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