JPS6215622B2 - - Google Patents

Info

Publication number
JPS6215622B2
JPS6215622B2 JP58233702A JP23370283A JPS6215622B2 JP S6215622 B2 JPS6215622 B2 JP S6215622B2 JP 58233702 A JP58233702 A JP 58233702A JP 23370283 A JP23370283 A JP 23370283A JP S6215622 B2 JPS6215622 B2 JP S6215622B2
Authority
JP
Japan
Prior art keywords
weight
alloy
copper
strength
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58233702A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59145749A (ja
Inventor
Masahiro Tsuji
Michiharu Yamamoto
Original Assignee
Nippon Mining Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16959204&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS6215622(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nippon Mining Co filed Critical Nippon Mining Co
Priority to JP23370283A priority Critical patent/JPS59145749A/ja
Publication of JPS59145749A publication Critical patent/JPS59145749A/ja
Publication of JPS6215622B2 publication Critical patent/JPS6215622B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Conductive Materials (AREA)
JP23370283A 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金 Granted JPS59145749A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23370283A JPS59145749A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23370283A JPS59145749A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP606182A Division JPS58124254A (ja) 1982-01-20 1982-01-20 半導体機器のリ−ド材用銅合金

Publications (2)

Publication Number Publication Date
JPS59145749A JPS59145749A (ja) 1984-08-21
JPS6215622B2 true JPS6215622B2 (enrdf_load_stackoverflow) 1987-04-08

Family

ID=16959204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23370283A Granted JPS59145749A (ja) 1983-12-13 1983-12-13 半導体機器のリ−ド材用銅合金

Country Status (1)

Country Link
JP (1) JPS59145749A (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5949293B2 (ja) * 1982-06-05 1984-12-01 株式会社神戸製鋼所 電気電子部品用銅合金及びその製造法
JPS61157651A (ja) * 1984-12-28 1986-07-17 Hitachi Metals Ltd リ−ドフレ−ム用銅合金
JPS60218440A (ja) * 1984-04-13 1985-11-01 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
US4656003A (en) * 1984-10-20 1987-04-07 Kabushiki Kaisha Kobe Seiko Sho Copper alloy and production of the same
US4692192A (en) * 1984-10-30 1987-09-08 Ngk Insulators, Ltd. Electroconductive spring material
US4594221A (en) * 1985-04-26 1986-06-10 Olin Corporation Multipurpose copper alloys with moderate conductivity and high strength
US4606889A (en) * 1985-11-07 1986-08-19 Cabot Corporation Copper-titanium-beryllium alloy
JPS6396232A (ja) * 1986-10-09 1988-04-27 Kobe Steel Ltd プラスチツク．ピン・グリツド・アレイｉｃリ−ドピン用銅合金およびその製造方法
US7182823B2 (en) 2002-07-05 2007-02-27 Olin Corporation Copper alloy containing cobalt, nickel and silicon

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5278621A (en) * 1975-12-26 1977-07-02 Tamagawa Kikai Kinzoku Kk Copper alloy for lead frames of semiconductor elements
JPS54402A (en) * 1977-06-02 1979-01-05 Kokusai Kikou Kk Work of protecting normal plane suitable for planting and its method of construction
JPS54100257A (en) * 1978-01-25 1979-08-07 Toshiba Corp Lead frame
JPS5616642A (en) * 1979-07-20 1981-02-17 Furukawa Kinzoku Kogyo Kk High-strength corrosion-resistant copper alloy
JPS5834536B2 (ja) * 1980-06-06 1983-07-27 日本鉱業株式会社 半導体機器のリ−ド材用の銅合金
JPS5895850A (ja) * 1981-12-02 1983-06-07 Kobe Steel Ltd 集積回路のリ−ドフレ−ム用銅合金
JPH05106A (ja) * 1991-06-25 1993-01-08 Matsushita Electric Works Ltd ミラーキヤビネツト

Also Published As

Publication number Publication date
JPS59145749A (ja) 1984-08-21

Similar Documents

Publication Publication Date Title
JP3550233B2 (ja) 高強度高導電性銅基合金の製造法
JPS6239213B2 (enrdf_load_stackoverflow)
JPS6314056B2 (enrdf_load_stackoverflow)
JPS5834537B2 (ja) 耐熱性の良好な高力導電用銅合金
JPS6215622B2 (enrdf_load_stackoverflow)
JPS6215621B2 (enrdf_load_stackoverflow)
JPS6239218B2 (enrdf_load_stackoverflow)
JPS59170231A (ja) 高力導電銅合金
JPS6231059B2 (enrdf_load_stackoverflow)
JP3049137B2 (ja) 曲げ加工性が優れた高力銅合金及びその製造方法
JPS594493B2 (ja) 半導体機器のリ−ド材用銅合金
JPS6256937B2 (enrdf_load_stackoverflow)
JPS6157379B2 (enrdf_load_stackoverflow)
JPH0218376B2 (enrdf_load_stackoverflow)
JPS6311418B2 (enrdf_load_stackoverflow)
JPH01165733A (ja) 高強度高導電性銅合金
JPS5853700B2 (ja) 半導体機器のリ−ド材用銅合金
JPS59145748A (ja) 半導体機器のリ−ド材用銅合金
JPH02129326A (ja) 高力銅合金
JPS6393835A (ja) 半導体機器のリ−ド材用銅合金
JPH0230727A (ja) 半導体機器リード材又は導電性ばね材用高力高導電銅合金
JPH0219432A (ja) 半導体機器リード材又は導電性ばね材用高力高導電銅合金
JP2534917B2 (ja) 高強度高導電性銅基合金
JPS6338545A (ja) 高力伝導性銅合金
JP3273193B2 (ja) 半田耐熱剥離性に優れた高強度高導電性銅基合金