JPS62144335A - 半導体装置の封止方法 - Google Patents
半導体装置の封止方法Info
- Publication number
- JPS62144335A JPS62144335A JP28516185A JP28516185A JPS62144335A JP S62144335 A JPS62144335 A JP S62144335A JP 28516185 A JP28516185 A JP 28516185A JP 28516185 A JP28516185 A JP 28516185A JP S62144335 A JPS62144335 A JP S62144335A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- ultraviolet
- resin
- potting
- curing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000007789 sealing Methods 0.000 title claims abstract description 13
- 239000011347 resin Substances 0.000 claims abstract description 47
- 229920005989 resin Polymers 0.000 claims abstract description 47
- 238000004382 potting Methods 0.000 claims abstract description 34
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 230000001678 irradiating effect Effects 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000000465 moulding Methods 0.000 abstract description 10
- 238000001723 curing Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000007796 conventional method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000005357 flat glass Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28516185A JPS62144335A (ja) | 1985-12-18 | 1985-12-18 | 半導体装置の封止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28516185A JPS62144335A (ja) | 1985-12-18 | 1985-12-18 | 半導体装置の封止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62144335A true JPS62144335A (ja) | 1987-06-27 |
| JPH0380341B2 JPH0380341B2 (enrdf_load_stackoverflow) | 1991-12-24 |
Family
ID=17687874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28516185A Granted JPS62144335A (ja) | 1985-12-18 | 1985-12-18 | 半導体装置の封止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62144335A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0189753U (enrdf_load_stackoverflow) * | 1987-12-07 | 1989-06-13 | ||
| JPH0449639A (ja) * | 1990-06-18 | 1992-02-19 | Sharp Corp | 半導体パッケージの封止方法及び封止装置 |
-
1985
- 1985-12-18 JP JP28516185A patent/JPS62144335A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0189753U (enrdf_load_stackoverflow) * | 1987-12-07 | 1989-06-13 | ||
| JPH0449639A (ja) * | 1990-06-18 | 1992-02-19 | Sharp Corp | 半導体パッケージの封止方法及び封止装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0380341B2 (enrdf_load_stackoverflow) | 1991-12-24 |
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