JPS62142389A - 印刷回路用銅箔およびその製造方法 - Google Patents

印刷回路用銅箔およびその製造方法

Info

Publication number
JPS62142389A
JPS62142389A JP60284774A JP28477485A JPS62142389A JP S62142389 A JPS62142389 A JP S62142389A JP 60284774 A JP60284774 A JP 60284774A JP 28477485 A JP28477485 A JP 28477485A JP S62142389 A JPS62142389 A JP S62142389A
Authority
JP
Japan
Prior art keywords
copper foil
nickel
layer
molybdenum
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60284774A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0426794B2 (enrdf_load_stackoverflow
Inventor
正人 高見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Metal Foil and Powder Co Ltd
Original Assignee
Fukuda Metal Foil and Powder Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fukuda Metal Foil and Powder Co Ltd filed Critical Fukuda Metal Foil and Powder Co Ltd
Priority to JP60284774A priority Critical patent/JPS62142389A/ja
Publication of JPS62142389A publication Critical patent/JPS62142389A/ja
Publication of JPH0426794B2 publication Critical patent/JPH0426794B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Conductive Materials (AREA)
JP60284774A 1985-12-17 1985-12-17 印刷回路用銅箔およびその製造方法 Granted JPS62142389A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60284774A JPS62142389A (ja) 1985-12-17 1985-12-17 印刷回路用銅箔およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60284774A JPS62142389A (ja) 1985-12-17 1985-12-17 印刷回路用銅箔およびその製造方法

Publications (2)

Publication Number Publication Date
JPS62142389A true JPS62142389A (ja) 1987-06-25
JPH0426794B2 JPH0426794B2 (enrdf_load_stackoverflow) 1992-05-08

Family

ID=17682838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60284774A Granted JPS62142389A (ja) 1985-12-17 1985-12-17 印刷回路用銅箔およびその製造方法

Country Status (1)

Country Link
JP (1) JPS62142389A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496393A (ja) * 1990-08-14 1992-03-27 Nikko Kyodo Co Ltd 印刷回路用銅箔の処理方法
JP2005206915A (ja) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔及びその製造方法
KR20200105705A (ko) 2018-03-27 2020-09-08 미쓰이금속광업주식회사 표면 처리 구리박, 동장 적층판 및 프린트 배선판의 제조 방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0496393A (ja) * 1990-08-14 1992-03-27 Nikko Kyodo Co Ltd 印刷回路用銅箔の処理方法
JP2005206915A (ja) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔及びその製造方法
KR20200105705A (ko) 2018-03-27 2020-09-08 미쓰이금속광업주식회사 표면 처리 구리박, 동장 적층판 및 프린트 배선판의 제조 방법

Also Published As

Publication number Publication date
JPH0426794B2 (enrdf_load_stackoverflow) 1992-05-08

Similar Documents

Publication Publication Date Title
US4387006A (en) Method of treating the surface of the copper foil used in printed wire boards
JP2717911B2 (ja) 印刷回路用銅箔及びその製造方法
US4619871A (en) Copper foil for printed circuit board
US4483906A (en) Copper foil for a printed circuit and a method for the production thereof
US5234573A (en) Method of surface treatment of copper foil for printed circuit boards and copper foil for printed circuit boards
JP2920083B2 (ja) 印刷回路用銅箔及びその製造方法
JP2717910B2 (ja) 印刷回路用銅箔及びその製造方法
JP4492434B2 (ja) プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液
JP3564460B2 (ja) プリント配線板用銅箔及びその製造方法
US5304428A (en) Copper foil for printed circuit boards
JPS5912039B2 (ja) 印刷回路用銅箔およびその製造方法
JPS62142389A (ja) 印刷回路用銅箔およびその製造方法
JP3709142B2 (ja) プリント配線板用銅箔及びその製造方法
JPH07188979A (ja) 印刷回路用銅箔及びその製造方法
JP2684164B2 (ja) 印刷回路用銅箔の表面処理方法
JPH0259639B2 (enrdf_load_stackoverflow)
JP3900116B2 (ja) 電子回路基板用の表面処理銅箔及びその製造方法
JPH06237078A (ja) 印刷回路用銅箔の製造方法
JP4034586B2 (ja) プリント配線板用銅箔及びその製造方法
JPS6133906B2 (enrdf_load_stackoverflow)
JPS61253886A (ja) プリント回路用銅箔
JPS5815950B2 (ja) 印刷回路用銅箔の表面処理方法
JPS6058698A (ja) 印刷回路用銅箔とその製造方法
KR840002495B1 (ko) 인쇄회로용 동박(銅箔)
JP2004162143A (ja) プリント配線板用銅箔の製造方法

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term