JPS6214120B2 - - Google Patents
Info
- Publication number
- JPS6214120B2 JPS6214120B2 JP54103433A JP10343379A JPS6214120B2 JP S6214120 B2 JPS6214120 B2 JP S6214120B2 JP 54103433 A JP54103433 A JP 54103433A JP 10343379 A JP10343379 A JP 10343379A JP S6214120 B2 JPS6214120 B2 JP S6214120B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- adhesive
- mounting
- catch
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10343379A JPS5626492A (en) | 1979-08-13 | 1979-08-13 | Device for mouting cylindrical leadless electronic part |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10343379A JPS5626492A (en) | 1979-08-13 | 1979-08-13 | Device for mouting cylindrical leadless electronic part |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5626492A JPS5626492A (en) | 1981-03-14 |
JPS6214120B2 true JPS6214120B2 (enrdf_load_stackoverflow) | 1987-03-31 |
Family
ID=14353896
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10343379A Granted JPS5626492A (en) | 1979-08-13 | 1979-08-13 | Device for mouting cylindrical leadless electronic part |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5626492A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0178225U (enrdf_load_stackoverflow) * | 1987-11-13 | 1989-05-25 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5853887A (ja) * | 1981-09-26 | 1983-03-30 | 富士機械製造株式会社 | リ−ドレス電子部品のプリント基板等への取付方法 |
US5678444A (en) * | 1996-01-23 | 1997-10-21 | Nagamori; Hachiro | Method of sequentially manufacturing hollow knock pins |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5343486Y2 (enrdf_load_stackoverflow) * | 1973-01-29 | 1978-10-19 | ||
JPS5377386A (en) * | 1976-12-21 | 1978-07-08 | Matsushita Electric Ind Co Ltd | Device for inserting electronic parts automatically |
JPS547575A (en) * | 1977-06-20 | 1979-01-20 | Tdk Electronics Co Ltd | Way of mounting electronic parts |
JPS5441078A (en) * | 1977-09-08 | 1979-03-31 | Kobatoron Kk | Device for inspecting semiconductor |
-
1979
- 1979-08-13 JP JP10343379A patent/JPS5626492A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0178225U (enrdf_load_stackoverflow) * | 1987-11-13 | 1989-05-25 |
Also Published As
Publication number | Publication date |
---|---|
JPS5626492A (en) | 1981-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0369650B2 (enrdf_load_stackoverflow) | ||
JPS6214120B2 (enrdf_load_stackoverflow) | ||
CN114192926B (zh) | 一种电子元件生产用引脚焊接装置 | |
JPS5911444B2 (ja) | タイヤのビ−ド部への潤滑剤塗布装置 | |
JP3067075B2 (ja) | 種子被覆加工装置の種子供給機構 | |
JP3022855B1 (ja) | 塗布装置のニードル硬化防止機構 | |
JPH0790193B2 (ja) | 接着剤塗布装置 | |
JPS597219B2 (ja) | ペレットボンデイング装置 | |
JP2864694B2 (ja) | スクリーン印刷装置 | |
JP3951117B2 (ja) | 導電性ボール搭載装置 | |
CN221178044U (zh) | 一种led铝基板印刷装置 | |
CN222179987U (zh) | 一种快速精准双面贴膜机构 | |
JPH0634673Y2 (ja) | 金属組織転写装置 | |
JPH0310669Y2 (enrdf_load_stackoverflow) | ||
JPH056124Y2 (enrdf_load_stackoverflow) | ||
JPH0530851Y2 (enrdf_load_stackoverflow) | ||
JPS5938134B2 (ja) | ラベル貼装置 | |
US3985270A (en) | Epoxy application apparatus | |
JPH0521986A (ja) | テープフイーダの駆動装置 | |
JP2502821B2 (ja) | 電子部品装着装置 | |
JPH073760Y2 (ja) | スピーカのサブコーン組込装置 | |
JPH0453025Y2 (enrdf_load_stackoverflow) | ||
JPS6214964A (ja) | 接着剤塗布装置 | |
JP2578935B2 (ja) | ダイボンディング装置 | |
JPH0738516B2 (ja) | 部品装着装置 |