JPS6214120B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a cylindrical leadless electronic component mounting apparatus, which is adapted to continuously and automatically mount cylindrical leadless electronic components onto a printed wiring board.

Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments. In FIGS. 1 to 4, 1 is a frame;
2 is a cylindrical leadless electronic component, 3 is this component 2
It is a chute that supplies Reference numeral 4 denotes a component catch portion for positioning the component 2 supplied from the chute 3 by vacuum pressure, and is attached to the frame 1 via a bracket 5. Reference numeral 6 is a simple structure that is supported at the tip of the frame 1 so as to be slidable back and forth. 7
is a connecting rod for driving the rack 6, which is supported on the base side of the frame 1 so as to be able to move up and down. There is. The bell crank 8 is swingably supported by the frame 1 via a pivot 12, and is also supported by the slider 1.
0 is inserted and supported between the frame 1 and the holding plate 13 so as to be slidable back and forth. The operating link 11 has an operating shaft 14 at its tip, and the operating shaft 14 is connected to an inverted L-shaped guide groove 15 formed in the frame 1 and to the rack 1.
It is slidably inserted into an elongated hole 16 in the vertical direction formed in 6, is provided with a pusher 17 at one end, and is restricted from relative rotation by a guide lever 18. Reference numeral 19 denotes a mounting device for receiving the component 2 from the component catch portion 4 and mounting it on the printed wiring board 20. The mounting device 19 has a suction hole that can communicate with a vacuum source, and is fitted to the tip of the slider 21 via a spring 22. has been done. The slider 21 is held in a bifurcated holder 23 so as to be rotatable around its axis and slidable in its axial direction, and its head on the side opposite to the attachment element 19 is opposed to the pusher 17 and has a spring. The pusher 1 by 24
It is biased toward the 7 side. Reference numeral 25 denotes a bevel gear for rotating the slider 21 around its axis, which is rotatably supported by the holder 23 and fitted onto the slider 21 so as to be relatively slidable in the axial direction. Due to the ball 26 and spring 27 fitted in the
It is positioned at a 90° rotated position. The holder 23 is mounted on a cylindrical transverse shaft 29 equipped with a pinion 28 that engages the rack 6. The horizontal shaft 29 is rotatably supported by the frame 1 via a bearing case 30 etc. about the horizontal axis, and a brake shaft 31 is fitted inside the horizontal shaft 29 so as to be relatively rotatable. The brake shaft 31 has a direction changing brake 32 at one end, and a bevel gear 33 that meshes with the bevel gear 25 at the other end. 34 is a tank for storing adhesive 35, and is attached to the frame 1 via a bracket 36. A fixed shaft 37 is fixed to the frame 1 below the tank 34, and a pinion 38 which engages the rack 6 is rotatably fitted onto the fixed shaft 37, as shown in FIG. The pinion 38 is integrally provided with a flange portion 39, and a disc 40 for applying adhesive is attached to the flange portion 39. As shown in FIG. 11, the outer peripheral edge of the disk 40 is opposed to the opening 41 at the lower end of the tank 34, and the adhesive 35 is applied substantially uniformly as the disk rotates.

Next, the action will be explained. When the components 2 are to be continuously and automatically mounted on the printed wiring board 20, the components 2 are first supplied into the component catch section 4 through the chute 3 and positioned at a predetermined position by vacuum pressure. When the positioning is completed, the component 2 is suctioned by the mounting member 19 facing the component catch portion 4 under vacuum pressure. This is the condition shown in FIG. 5, in which the rack 6 is in the retracted position. Next, when the connecting rod 7 is vertically raised in the direction of the arrow a, the rack 6 is moved along the upper horizontal part of the guide groove 15 via the bell crank 8, the link 9, the slider 10, the operating link 11, and the operating shaft 14. Move in the direction of the arrow. At this time, the horizontal shaft 29 rotates in the direction of arrow c via the pinion 28 that engages with the rack 6, and the
9 is in the state where part 2 is still adsorbed at the tip, and the 6th
As shown in the figure and FIG. 7, it rotates approximately 150 degrees.
On the other hand, since the pinion 38 that supports the disc 40 is engaged with the rack 6, the disc 40 rotates in the direction indicated by the arrow d at the same time that the mounting element 19 starts its reversing operation, and its outer peripheral edge As shown in FIG. 11, it passes through the adhesive 35 stored in the tank 34 and adheres to the outer peripheral edge of the disc 40.
This adhesive 35 is applied so that the disk 40 is attached to the end surface 4 of the tank 34.
2, the end face 42 limits the thickness to a substantially uniform thickness. When the rack 6 further moves in the direction of the arrow b, the mounting element 19 and the disc 40 further rotate in opposite directions, and as shown in FIG. The component 2 attracted to the tip of the mounting element 19 comes into contact with the disk 40 side, and the adhesive 35 attached to the outer periphery of the component 2 is first removed.
As shown in Figure 2, a certain amount is applied to the approximately central portion of the component 2 in the axial direction. This is the state shown in FIG.

When the mounting element 19 is reversed to the mounting position shown in FIG. 7 and reaches the vertical state, the operating link 1
Since the operating shaft 14 of No. 1 is located on the upper end side of the vertical part from the upper horizontal part of the guide groove 15, the rack 6 is already immovable, and the movement of the operating link 11 moves the operating shaft 14 into the guide groove. 15 and the elongated hole 16, and the pusher 17 presses the slider 21 downward (in the direction of arrow e). For this reason, as shown in FIG.
descends vertically downward and presses the component 2 at the tip of the mounting element 19 onto the printed wiring board 20 while resisting the springs 22 and 24. At the same time, the component suction air of the mounting element 19 is cut off, and the component 2 is moved to the adhesive 35. It is fixed onto the printed wiring board 20 by using. Connecting rod 7
When the slider 17 shifts to a lowering operation, the pusher 17 rises, and the slider 21 rises due to the action of the spring 24.

The mounting element 19 that has attracted the component 2 in this way
By reciprocating up and down movement of the connecting rod 7, adhesive 35 is applied to the part 2 during the reversal, and after the reversal is completed,
The component 2 is mounted on the printed wiring board 20 by vertically descending operation.

The above operation moves component 2 onto the printed wiring board 20.
This is a case where the component 2 is mounted in the axial direction, but when the mounting direction of the component 2 is changed to the X-axis direction, the brake 32
All you have to do is activate it. That is, when the brake 32 is activated, the bevel gear 33 is fixed, and when the mounting element 19 is reversed, the bevel gear 25 rotates 90 degrees around the axis of the slider 21. Rotate the part 2 by 90 degrees,
Rotate ° to change direction in the X-axis direction. The positioning lock at this time is the ball 26 and the spring 27.
This is done according to the following.

According to the present invention, as detailed in the embodiments above,
Since the adhesive is applied to the component while the component is received from the component catch and flipped onto the printed wiring board, the adhesive can be applied and the component installed at the same time, reducing the installation time. can be significantly shortened. Furthermore, since the adhesive application process is carried out mechanically and continuously, the amount of adhesive applied to the parts is uniform, and the fixing force of the parts after being mounted on the printed wiring board can be stabilized. Moreover, since a direction changing section is provided for changing the mounting direction of the component during the reversal operation of the component, the mounting direction of the component can be changed arbitrarily. In addition, the above component catch section does not simply use vacuum pressure to catch components, but instead applies vacuum pressure from above, allowing the component to catch under its own weight despite having an opening below the component catch section. The device is held in a well-positioned state for the next operation, the delivery of the component to the mounting section, without falling, and there is no need to provide a shutter mechanism to prevent the component from falling in the component catch section, and the device as a whole is This makes it possible to downsize and reduce costs.

Furthermore, since the adhesive is taken out from the bottom of the storage tank by a transfer disk and transferred to the parts, it is possible to prevent the adhesive from becoming stringy and to apply a small amount uniformly. It is easy to control the level of the agent supply amount, and it is also easy to unify the component mounting operation and the adhesive application operation, and the mounting speed can be increased.

[Brief explanation of the drawing]

The drawings show one embodiment of the present invention, in which Fig. 1 is a schematic sketch, Fig. 2 is a front sectional view, Fig. 3 is a side sectional view, Fig. 4 is a plan view, and Figs. 5 to 8 are installation views. Fig. 9 is a sectional view of the adhesion part, Fig. 10 is a cross-sectional view of the adhesion part.
11 is an enlarged cross-sectional view of the adhesive portion, and FIG. 12 is an explanatory diagram when applying the adhesive. 1 is a frame, 2 is a cylindrical leadless electronic component, 3 is a chute, 4 is a component catch part, 6 is a rack, 7 is a connecting rod, 11 is an operating link, 17
is a pusher, 19 is a mounting element, 20 is a printed wiring board, 21 is a slider, 25, 33 are bevel gears, 28, 38 are pinions, 34 is a tank, 3
5 is adhesive, 40 is a disk.

Claims (1)

[Claims] 1. A cylindrical leadless electronic component mounting device that automatically mounts cylindrical leadless electronic components onto a printed wiring board, including a component catch section that has an opening at the bottom and that sucks and holds the components using vacuum pressure from above. a chute for dropping parts into the catch part, a mounting part for inverting the parts received from the opening of the part catch part and mounting them on a printed wiring board, and a storage tank for a gel adhesive. A transfer disk is provided in the bottom opening in contact with the adhesive without leaking, and an adhesive part is provided to apply adhesive to the component during the reversal operation, and a transfer disk is provided to apply the adhesive to the component during the reversal operation, and to control the mounting direction of the component during the reversal operation. A cylindrical leadless electronic component mounting device characterized by comprising a direction changing section for switching.