JPH0453025Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) This invention relates to an automatic application machine for adhesive for chip parts used for temporarily fixing chip parts with adhesive applied to a printed circuit board.

(Prior Art) An automatic chip component mounting machine used to transfer adhesive onto a printed circuit board and mount chip components before soldering has a horizontal shaft 2 attached to a head 1 illustrated in FIG. A turret 3 is provided which can rotate around the center in the arrow direction. This turret 3 is provided with a transfer pin 4 for transferring adhesive and a suction nozzle 5 for adsorbing chip parts, and the lower transfer pin 4 is inserted into an adhesive pot (not shown) to deposit adhesive. Transfer it to the printed circuit board. Next, the turret 3 is rotated 180 degrees to suck the chip component using the lower suction nozzle 5, and the chip component is mounted on the transferred adhesive on the printed circuit board and temporarily fixed. It is a structure.

(Problem to be solved by the invention) The conventional chip component automatic mounting machine described above has a head 1
The direction of the head 1 cannot be changed (rotated in a horizontal plane), and even if the direction could be changed, the head 1 would become larger.

In addition, there is usually only one transfer pin 4, but if two are required, it is necessary to replace the turret 3 in advance, and it is necessary to change between one and two transfer pins in the middle of the work. Cannot be replaced quickly.

This invention was proposed in order to solve the problems with conventional ones, and its purpose is to be able to transfer adhesive and attach chip parts with a single head. To provide an automatic mounting and coating machine devised so that the orientation of chip parts to be mounted can be freely changed while maintaining the same orientation on a chip feeder.

(Means for Solving the Problems) The structure of this invention to solve the problems in the conventional devices described above is to attach chip components to printed circuit boards using suction nozzles of heads that move back and forth and left and right in a horizontal plane. In an automatic chip component mounting machine that mounts chip components in a predetermined position, in order to mount chip components onto a printed circuit board, a transfer pin is removably attached to the lower end of the chip by suction action using a suction nozzle attached to the head. .

(Function) The work of transferring the adhesive onto the printed circuit board is carried out without any trouble by the transfer pin attached and fixed to the suction nozzle, so the transfer of the adhesive and the mounting of the chip parts can be done with a single head. can be done efficiently.

(Example) Next, an example of this invention will be described based on the drawings.

FIG. 9 shows a perspective view of the automatic mounting and applicator for adhesive for chip parts, and FIGS. 1 and 2 show front views of the head.

X of the X-direction drive section 12 along the left-right direction in FIG.
The Y-direction moving arm 14 attached to the direction guide 13 can be moved to a predetermined position in the X-direction along the X-direction guide 13 and the X-direction rail 15 by a drive mechanism (not shown) of the X-direction drive unit 12.

The head 11 can be moved to a predetermined position in the Y direction along a Y direction guide 16 of the Y direction moving arm 14 by a drive mechanism (not shown) provided on the Y direction moving arm 14. The movement in the Y direction is automatically controlled by a computer program.

A holder 17 is provided on the head 11 so as to be able to move up and down by a predetermined distance with respect to the head 11 by a vertical drive mechanism such as a solenoid (not shown).

A suction nozzle 18 is coupled to a piston 20 of a cylinder 19 in the holder 17 .
By engaging the rack 22 with the gear 21 provided in the holder and moving the rack 22 in a direction perpendicular to the plane of the paper of FIG. Allows rotation around the nozzle.

The middle portions of the pawls 23, 23 are pivotally connected to the holder 17 via a fulcrum pin 24, and the upper ends 2 of the pawls 23, 23 are attached to a hemispherical cam 25 formed in the suction nozzle 18.
3a and 23a are brought into contact by a spring 26.

As a result, when pressurized air is supplied to the lower surface of the piston 20, the suction nozzle 18 rises to the upper limit position shown in FIG.
3a, 23a come into contact with the small diameter part of the cam 25, so the claws 23, 23 are at the most open position. In this state, when pressurized air is supplied to the upper surface of the piston 20, the suction nozzle 18 becomes the lower limit position and reaches the first position. As shown in Figure 1, the upper end portions 23a, 23 are attached to the large diameter portion of the cam 25.
a comes into contact, the claws 23, 23 close, and the chip part 27 or the transfer pin 28 can be chucked.

The suction structure using the suction nozzle 18 is such that the suction nozzle 18 is provided with a vertical hole 29 and a blowing hole 30 that opens diagonally upward with respect to the vertical hole 29, and a ring groove 31 that communicates with the blowing hole 30 is provided in the suction nozzle 18. The air supply hole 33 of the air supply ring 32 that is rotatably fitted to the nozzle 18 is always communicated with the ring groove 31, and the air supply hole 33, the ring 31, and the suction are connected from the hose 34 attached to the air supply ring 32 to the air supply hole 33, the ring 31, and the suction. When pressurized air is blown upward into the vertical hole 29 via the hole 30, the vicinity of the lower end opening of the vertical hole 29 becomes a vacuum state, and the chip parts 2 are placed at the lower end 18a of the suction nozzle 18.
7, or the transfer pin 28 can be attracted, and when the blowing of pressurized air is stopped during the attraction, the attraction is released.

The illustrated transfer pin 28 includes two pins 35 and 3.
5, and the lower end 18 of the suction nozzle 18 is provided in the upper part.
A blind hole 28a is provided into which the transfer pin 28a can be inserted, and when not in use, the transfer pin 2 is inserted into the pin hole 36a of the pin receiver 36 in the state shown in FIG.
8 is retained.

As shown in FIG. 9, the chip parts 27 are placed in the rails 38 of the parts feeder 37 for each type.
The chip parts 27 are stored vertically and are constantly fed to the left in the figure, for example, by applying longitudinal vibration motion to the rails 38.

Table 3 of automatic adhesive applicator for chip parts
At the position of the printed circuit board 40 set on the
The adhesive 42 in the adhesive container 41 is transferred by the pins 35, 35 of the transfer pin 28.

The steps of the transfer and mounting operations will be explained based on FIGS. 3 to 8.

(a) Lower the holder 17 and insert the lower end 18a of the suction nozzle 18 into the blind hole 28a of the pin 28 resting on the pin receiver 36, and suck the transfer pin 28 to the lower end 18a by blowing in pressurized air. , holder 1
7 and raise the suction nozzle 18 (Fig. 3~
Figure 4).

(b) The head 11 is moved by the X-direction drive unit 12 and the Y-direction moving arm 14 to move the adhesive container 4.
1, the suction nozzle 18 is lowered together with the holder 17, the adhesive 42 is attached to the pins 35, 35, and the holder 17 is raised (FIG. 5).

(c) Move the head 11 to the center between the chip component mounting lands 43 and 43 on the printed circuit board 40, lower the holder 17, and apply the adhesive 42 to the pin 3.
5, 35 to a printed circuit board 40 (FIG. 6).

(d) Repeat the steps (a) to (c) above to finish transferring the adhesive 42 to the desired location, and then
When the head 11 is moved upward, the holder 17 is lowered, and the transfer pin 28 is placed on the pin receiver 36, and the blowing of the pressurized air is stopped, the transfer pin 28
is removed from the suction nozzle 18 (FIG. 7).

(e) Move the head 11 above the most advanced chip component 27 of a predetermined parts feeder 37, lower the suction nozzle 18 together with the holder 17, and lower the lower end 18.
8a is applied to the chip component 27, pressurized air is blown into the blow hole 30 to attract the chip component 27, and the holder 17 is raised (FIG. 8).

(f) Move the head 11 to the position on the printed circuit board 40 where the chip component 27 being sucked is to be mounted, lower the head 11, and mount the chip component 27 to the position where the adhesive has been applied.

To change the mounting direction of the chip part 27,
This is done by rotating the suction nozzle 18.

For example, in order to change the direction of the parts feeder 37 by 90° clockwise, lower the head 11 and move the chip parts 27 to the suction nozzle 1.
8 and moves the piston 20 downward to release the claws 23, 2.
3, the chip part 27 is checked. Next, operate the rack 22 to rotate the suction nozzle 18 90 degrees counterclockwise, move the piston 20 upward to open the pawls 23, 23, and operate the rack 22 in the opposite direction to the above. Turn the suction nozzle 18 to the right
When rotated by 90 degrees, the chip part 27 will be rotated by 90 degrees to the right relative to its initial orientation.

In this way, by rotating the suction nozzle 27, it becomes possible to easily adapt to the mounting orientation required for the chip component 27.

(Effects of the invention) As mentioned above, in the automatic application machine for adhesive for chip parts according to this invention, the transfer pin is detachable from the head by the suction action of the suction nozzle, so when transferring the adhesive, This is done by using a transfer pin, and when attaching a chip component, the chip component is suctioned to a suction nozzle.In this way, a single head can be used to transfer adhesive and attach the chip component efficiently. can do well.

[Brief explanation of drawings]

Figures 1 to 9 show an embodiment of this invention, and Figures 1 and 2 are partially vertical front views of the head;
Figures 3 to 8 are perspective views showing the process of adhesive transfer and chip component attachment, Figure 9 is a perspective view of an automatic adhesive applicator for chip components, and Figure 10 is a perspective view of a conventional head. It is a diagram. 1, 11... Head, 2... Horizontal axis, 3... Turret, 4, 28... Transfer pin, 5, 18... Suction nozzle, 12... X direction drive unit, 13... X direction guide, 14 ...Y direction moving arm, 15...
X-direction rail, 16...Y-direction guide, 17...
Holder, 18a... lower end, 19... cylinder,
20... Piston, 21... Gear, 22... Rack, 23... Claw, 23a... Upper end, 24... Fulcrum pin, 25... Cam, 26... Spring, 27...
Chip parts, 29...vertical hole, 30...blow hole,
31...Ring groove, 32...Air supply ring, 33...
...Intake hole, 34...Hose, 35...Pin, 36
Pin receiver, 36a...pin hole, 37...parts feeder, 38...rail, 39...table, 4
0...Printed circuit board, 41...Adhesive container.

Claims (1)

[Scope of Claim for Utility Model Registration] In an automatic chip component mounting machine that mounts chip components to a predetermined position on a printed circuit board using a suction nozzle of a head that moves back and forth and left and right in a horizontal plane, the chip components are mounted on a printed circuit board. An automatic adhesive applicator for chip parts, characterized in that a transfer pin is removably attached to the lower end of the head by suction action using a suction nozzle attached to the head.