JPS62140838A - 多層プリント板 - Google Patents
多層プリント板Info
- Publication number
- JPS62140838A JPS62140838A JP28104985A JP28104985A JPS62140838A JP S62140838 A JPS62140838 A JP S62140838A JP 28104985 A JP28104985 A JP 28104985A JP 28104985 A JP28104985 A JP 28104985A JP S62140838 A JPS62140838 A JP S62140838A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- multilayer printed
- type epoxy
- printed board
- novolac type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims description 36
- 229920000647 polyepoxide Polymers 0.000 claims description 36
- 229920003986 novolac Polymers 0.000 claims description 19
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000003054 catalyst Substances 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 6
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 4
- 229930003836 cresol Natural products 0.000 claims description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000000470 constituent Substances 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000032798 delamination Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- -1 lithium hydroxide Chemical compound 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- OKIZCWYLBDKLSU-UHFFFAOYSA-M N,N,N-Trimethylmethanaminium chloride Chemical compound [Cl-].C[N+](C)(C)C OKIZCWYLBDKLSU-UHFFFAOYSA-M 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- 239000001110 calcium chloride Substances 0.000 description 1
- 229910001628 calcium chloride Inorganic materials 0.000 description 1
- 159000000007 calcium salts Chemical class 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 229910003002 lithium salt Inorganic materials 0.000 description 1
- 159000000002 lithium salts Chemical class 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28104985A JPS62140838A (ja) | 1985-12-16 | 1985-12-16 | 多層プリント板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28104985A JPS62140838A (ja) | 1985-12-16 | 1985-12-16 | 多層プリント板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62140838A true JPS62140838A (ja) | 1987-06-24 |
| JPH0586333B2 JPH0586333B2 (enrdf_load_stackoverflow) | 1993-12-10 |
Family
ID=17633590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28104985A Granted JPS62140838A (ja) | 1985-12-16 | 1985-12-16 | 多層プリント板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62140838A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05301980A (ja) * | 1992-04-24 | 1993-11-16 | Toshiba Chem Corp | 印刷配線板用プリプレグ |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3367990A (en) * | 1952-02-11 | 1968-02-06 | Dow Chemical Co | Epoxy resins formed by interacting a diglycidyl ether of a dihydric phenol, an epoxidized novolac and a dihydric phenolic compound |
| JPS59210946A (ja) * | 1983-04-29 | 1984-11-29 | ウエスチングハウス エレクトリック コ−ポレ−ション | 耐炎性積層板 |
| JPS603184A (ja) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | 樹脂結着炭素繊維基材 |
| JPS60135436A (ja) * | 1983-12-23 | 1985-07-18 | Matsushita Electric Works Ltd | エポキシ樹脂積層板の製法 |
| JPS61148226A (ja) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | 塗料用及び積層板用固体状エポキシ樹脂 |
| JPS61188413A (ja) * | 1985-02-18 | 1986-08-22 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
| JPS6360053A (ja) * | 1986-08-30 | 1988-03-16 | Tohoku Metal Ind Ltd | 超急冷金属薄帯の製造方法 |
| JPH0586333A (ja) * | 1991-03-29 | 1993-04-06 | Arakawa Chem Ind Co Ltd | 無色ロジンエステル誘導体およびその製造法 |
-
1985
- 1985-12-16 JP JP28104985A patent/JPS62140838A/ja active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3367990A (en) * | 1952-02-11 | 1968-02-06 | Dow Chemical Co | Epoxy resins formed by interacting a diglycidyl ether of a dihydric phenol, an epoxidized novolac and a dihydric phenolic compound |
| JPS59210946A (ja) * | 1983-04-29 | 1984-11-29 | ウエスチングハウス エレクトリック コ−ポレ−ション | 耐炎性積層板 |
| JPS603184A (ja) * | 1983-06-20 | 1985-01-09 | 松下電器産業株式会社 | 樹脂結着炭素繊維基材 |
| JPS60135436A (ja) * | 1983-12-23 | 1985-07-18 | Matsushita Electric Works Ltd | エポキシ樹脂積層板の製法 |
| JPS61148226A (ja) * | 1984-12-21 | 1986-07-05 | Toto Kasei Kk | 塗料用及び積層板用固体状エポキシ樹脂 |
| JPS61188413A (ja) * | 1985-02-18 | 1986-08-22 | Dainippon Ink & Chem Inc | エポキシ樹脂組成物 |
| JPS6360053A (ja) * | 1986-08-30 | 1988-03-16 | Tohoku Metal Ind Ltd | 超急冷金属薄帯の製造方法 |
| JPH0586333A (ja) * | 1991-03-29 | 1993-04-06 | Arakawa Chem Ind Co Ltd | 無色ロジンエステル誘導体およびその製造法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05301980A (ja) * | 1992-04-24 | 1993-11-16 | Toshiba Chem Corp | 印刷配線板用プリプレグ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0586333B2 (enrdf_load_stackoverflow) | 1993-12-10 |
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