JPS6214038B2 - - Google Patents
Info
- Publication number
- JPS6214038B2 JPS6214038B2 JP54158213A JP15821379A JPS6214038B2 JP S6214038 B2 JPS6214038 B2 JP S6214038B2 JP 54158213 A JP54158213 A JP 54158213A JP 15821379 A JP15821379 A JP 15821379A JP S6214038 B2 JPS6214038 B2 JP S6214038B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- tin
- copper
- bath
- ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 29
- 229910052751 metal Inorganic materials 0.000 claims description 29
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 22
- 229910001431 copper ion Inorganic materials 0.000 claims description 22
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 21
- 238000007747 plating Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 238000004140 cleaning Methods 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 16
- 238000009713 electroplating Methods 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 14
- 229910001432 tin ion Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 8
- 239000002699 waste material Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 150000002500 ions Chemical class 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 6
- 238000011282 treatment Methods 0.000 claims description 5
- 239000002659 electrodeposit Substances 0.000 claims description 2
- 239000003792 electrolyte Substances 0.000 claims description 2
- 238000000151 deposition Methods 0.000 claims 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 7
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 6
- 239000002351 wastewater Substances 0.000 description 6
- 238000004070 electrodeposition Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- PPIIGEJBVZHNIN-UHFFFAOYSA-N [Cu].[Sn].[Pb] Chemical compound [Cu].[Sn].[Pb] PPIIGEJBVZHNIN-UHFFFAOYSA-N 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/10—Bearings
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/20—Regeneration of process solutions of rinse-solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/005,602 US4187166A (en) | 1979-01-22 | 1979-01-22 | Method of removing copper ions from a bath containing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55100992A JPS55100992A (en) | 1980-08-01 |
| JPS6214038B2 true JPS6214038B2 (en, 2012) | 1987-03-31 |
Family
ID=21716702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15821379A Granted JPS55100992A (en) | 1979-01-22 | 1979-12-07 | Electrodeposition of leaddtin covering layer to bearing structure |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US4187166A (en, 2012) |
| JP (1) | JPS55100992A (en, 2012) |
| KR (1) | KR850000304B1 (en, 2012) |
| AU (1) | AU527503B2 (en, 2012) |
| BR (1) | BR7908545A (en, 2012) |
| CA (1) | CA1153728A (en, 2012) |
| DE (1) | DE2947998A1 (en, 2012) |
| FR (1) | FR2446872A1 (en, 2012) |
| GB (1) | GB2039955B (en, 2012) |
| IN (1) | IN152023B (en, 2012) |
| IT (1) | IT1120140B (en, 2012) |
| MX (1) | MX153508A (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0288847A (ja) * | 1988-09-26 | 1990-03-29 | Oyo Kikaku:Kk | 二重床構築方法 |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4405412A (en) * | 1982-03-29 | 1983-09-20 | Dart Industries Inc. | Removal of copper contamination from tin plating baths |
| DE3502278C2 (de) * | 1985-01-24 | 1987-05-07 | MTU Motoren- und Turbinen-Union München GmbH, 8000 München | Vorrichtung zur Erfassung von Meßwerten in rotierenden Anordnungen |
| JPH0293096A (ja) * | 1988-09-30 | 1990-04-03 | Daiwa Kasei Kenkyusho:Kk | 滑り軸受の表面合金層の製造法 |
| JPH0491712U (en, 2012) * | 1990-12-28 | 1992-08-10 | ||
| US6143146A (en) * | 1998-08-25 | 2000-11-07 | Strom; Doug | Filter system |
| US6332973B1 (en) * | 2000-01-25 | 2001-12-25 | Advanced Micro Devices, Inc. | CMOS chemical bath purification |
| US6740221B2 (en) | 2001-03-15 | 2004-05-25 | Applied Materials Inc. | Method of forming copper interconnects |
| US7239747B2 (en) * | 2002-01-24 | 2007-07-03 | Chatterbox Systems, Inc. | Method and system for locating position in printed texts and delivering multimedia information |
| WO2003085713A1 (en) * | 2002-04-03 | 2003-10-16 | Applied Materials, Inc. | Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects |
| JP4243985B2 (ja) * | 2002-09-24 | 2009-03-25 | 大日本スクリーン製造株式会社 | 金属イオンの除去方法及び基板処理装置 |
| US20040118699A1 (en) * | 2002-10-02 | 2004-06-24 | Applied Materials, Inc. | Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects |
| TWI820131B (zh) * | 2018-05-09 | 2023-11-01 | 美商應用材料股份有限公司 | 電鍍系統及用於去除電鍍系統內的含錫陰極電解液的銅汙染物之方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2734024A (en) * | 1956-02-07 | Method of making bearings | ||
| FR1334413A (fr) * | 1962-06-25 | 1963-08-09 | Coussinets Ste Indle | Procédés de préparation ou de régénération de bains mixtes de fluoborates de plomb et d'étain |
| US3812020A (en) * | 1969-08-11 | 1974-05-21 | Allied Chem | Electrolyte and method for electroplating an indium-copper alloy and printed circuits so plated |
| US3940319A (en) * | 1974-06-24 | 1976-02-24 | Nasglo International Corporation | Electrodeposition of bright tin-nickel alloy |
-
1979
- 1979-01-22 US US06/005,602 patent/US4187166A/en not_active Expired - Lifetime
- 1979-11-28 DE DE19792947998 patent/DE2947998A1/de active Granted
- 1979-11-30 CA CA000340975A patent/CA1153728A/en not_active Expired
- 1979-12-03 GB GB7941690A patent/GB2039955B/en not_active Expired
- 1979-12-04 IT IT50987/79A patent/IT1120140B/it active
- 1979-12-06 AU AU53560/79A patent/AU527503B2/en not_active Ceased
- 1979-12-07 JP JP15821379A patent/JPS55100992A/ja active Granted
- 1979-12-12 FR FR7930466A patent/FR2446872A1/fr active Granted
- 1979-12-27 BR BR7908545A patent/BR7908545A/pt not_active IP Right Cessation
-
1980
- 1980-01-01 IN IN10/CAL/80A patent/IN152023B/en unknown
- 1980-01-15 MX MX180807A patent/MX153508A/es unknown
- 1980-01-19 KR KR1019800000192A patent/KR850000304B1/ko not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0288847A (ja) * | 1988-09-26 | 1990-03-29 | Oyo Kikaku:Kk | 二重床構築方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| MX153508A (es) | 1986-11-10 |
| JPS55100992A (en) | 1980-08-01 |
| BR7908545A (pt) | 1980-09-02 |
| DE2947998A1 (de) | 1980-07-31 |
| IN152023B (en, 2012) | 1983-10-01 |
| CA1153728A (en) | 1983-09-13 |
| IT7950987A0 (it) | 1979-12-04 |
| KR830002066A (ko) | 1983-05-21 |
| GB2039955B (en) | 1983-01-26 |
| FR2446872A1 (fr) | 1980-08-14 |
| KR850000304B1 (ko) | 1985-03-18 |
| US4187166A (en) | 1980-02-05 |
| IT1120140B (it) | 1986-03-19 |
| GB2039955A (en) | 1980-08-20 |
| FR2446872B1 (en, 2012) | 1983-01-14 |
| DE2947998C2 (en, 2012) | 1988-10-27 |
| AU5356079A (en) | 1981-07-02 |
| AU527503B2 (en) | 1983-03-10 |
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