JPS62128721A - 樹脂成形方法 - Google Patents

樹脂成形方法

Info

Publication number
JPS62128721A
JPS62128721A JP27003385A JP27003385A JPS62128721A JP S62128721 A JPS62128721 A JP S62128721A JP 27003385 A JP27003385 A JP 27003385A JP 27003385 A JP27003385 A JP 27003385A JP S62128721 A JPS62128721 A JP S62128721A
Authority
JP
Japan
Prior art keywords
resin
gate
cavity
product
runner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27003385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0531448B2 (enrdf_load_stackoverflow
Inventor
Yoshinori Uemoto
植本　良典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP27003385A priority Critical patent/JPS62128721A/ja
Publication of JPS62128721A publication Critical patent/JPS62128721A/ja
Publication of JPH0531448B2 publication Critical patent/JPH0531448B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP27003385A 1985-11-29 1985-11-29 樹脂成形方法 Granted JPS62128721A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27003385A JPS62128721A (ja) 1985-11-29 1985-11-29 樹脂成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27003385A JPS62128721A (ja) 1985-11-29 1985-11-29 樹脂成形方法

Publications (2)

Publication Number Publication Date
JPS62128721A true JPS62128721A (ja) 1987-06-11
JPH0531448B2 JPH0531448B2 (enrdf_load_stackoverflow) 1993-05-12

Family

ID=17480595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27003385A Granted JPS62128721A (ja) 1985-11-29 1985-11-29 樹脂成形方法

Country Status (1)

Country Link
JP (1) JPS62128721A (enrdf_load_stackoverflow)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02165644A (ja) * 1988-12-20 1990-06-26 Sanyo Electric Co Ltd 半導体装置の樹脂モールド方法
US5266259A (en) * 1991-09-17 1993-11-30 Ford Motor Company Molding a reinforced plastics component
US5275546A (en) * 1991-12-30 1994-01-04 Fierkens Richard H J Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor
US5445995A (en) * 1991-12-20 1995-08-29 Sgs-Thomson Microelectronics, S.R.L. Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink
US5578261A (en) * 1993-05-17 1996-11-26 Lucent Technologies Inc. Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling
US5637273A (en) * 1993-11-30 1997-06-10 Anam Industrial Co., Ltd. Method for molding of integrated circuit package
JP2018192760A (ja) * 2017-05-22 2018-12-06 三菱電機株式会社 インサート樹脂成形品

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02165644A (ja) * 1988-12-20 1990-06-26 Sanyo Electric Co Ltd 半導体装置の樹脂モールド方法
US5266259A (en) * 1991-09-17 1993-11-30 Ford Motor Company Molding a reinforced plastics component
US5445995A (en) * 1991-12-20 1995-08-29 Sgs-Thomson Microelectronics, S.R.L. Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink
US5275546A (en) * 1991-12-30 1994-01-04 Fierkens Richard H J Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor
US5578261A (en) * 1993-05-17 1996-11-26 Lucent Technologies Inc. Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling
US5637273A (en) * 1993-11-30 1997-06-10 Anam Industrial Co., Ltd. Method for molding of integrated circuit package
JP2018192760A (ja) * 2017-05-22 2018-12-06 三菱電機株式会社 インサート樹脂成形品

Also Published As

Publication number Publication date
JPH0531448B2 (enrdf_load_stackoverflow) 1993-05-12

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