JPS62127437A - 半導体素子用ボンデイング線 - Google Patents

半導体素子用ボンデイング線

Info

Publication number
JPS62127437A
JPS62127437A JP60265620A JP26562085A JPS62127437A JP S62127437 A JPS62127437 A JP S62127437A JP 60265620 A JP60265620 A JP 60265620A JP 26562085 A JP26562085 A JP 26562085A JP S62127437 A JPS62127437 A JP S62127437A
Authority
JP
Japan
Prior art keywords
wire
bonding
gold
copper
thin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60265620A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222130B2 (enExample
Inventor
Takatoki Fukuda
福田　孝祝
Eiichi Fujimoto
栄一 藤本
Toshitake Otaki
大滝　俊武
Harumichi Okamoto
岡本　晴道
Takashi Ogata
緒方　俊
Norimichi Matsusue
松末　則道
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Eneos Corp
Original Assignee
Nippon Mining Co Ltd
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining Co Ltd, Tatsuta Electric Wire and Cable Co Ltd filed Critical Nippon Mining Co Ltd
Priority to JP60265620A priority Critical patent/JPS62127437A/ja
Publication of JPS62127437A publication Critical patent/JPS62127437A/ja
Publication of JPH0222130B2 publication Critical patent/JPH0222130B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01565—Thermally treating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]

Landscapes

  • Wire Bonding (AREA)
JP60265620A 1985-11-26 1985-11-26 半導体素子用ボンデイング線 Granted JPS62127437A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60265620A JPS62127437A (ja) 1985-11-26 1985-11-26 半導体素子用ボンデイング線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60265620A JPS62127437A (ja) 1985-11-26 1985-11-26 半導体素子用ボンデイング線

Publications (2)

Publication Number Publication Date
JPS62127437A true JPS62127437A (ja) 1987-06-09
JPH0222130B2 JPH0222130B2 (enExample) 1990-05-17

Family

ID=17419663

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60265620A Granted JPS62127437A (ja) 1985-11-26 1985-11-26 半導体素子用ボンデイング線

Country Status (1)

Country Link
JP (1) JPS62127437A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6365035A (ja) * 1986-09-05 1988-03-23 Furukawa Electric Co Ltd:The 銅細線とその製造方法
JPH02232327A (ja) * 1989-03-06 1990-09-14 Nippon Mining Co Ltd 加工性，耐熱性の優れた高導電性銅合金

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049706A (ja) * 1983-08-30 1985-03-19 ヤンマー農機株式会社 収穫機の刈高さ自動調節装置
JPS60194032A (ja) * 1984-03-15 1985-10-02 Sumitomo Metal Mining Co Ltd 軟化温度の低い高導電用銅材
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61221335A (ja) * 1985-03-27 1986-10-01 Mitsubishi Metal Corp 極軟質銅材の製造法
JPS61259558A (ja) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS62102551A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049706A (ja) * 1983-08-30 1985-03-19 ヤンマー農機株式会社 収穫機の刈高さ自動調節装置
JPS60194032A (ja) * 1984-03-15 1985-10-02 Sumitomo Metal Mining Co Ltd 軟化温度の低い高導電用銅材
JPS6199645A (ja) * 1984-10-20 1986-05-17 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS61221335A (ja) * 1985-03-27 1986-10-01 Mitsubishi Metal Corp 極軟質銅材の製造法
JPS61259558A (ja) * 1985-05-14 1986-11-17 Mitsubishi Metal Corp 半導体装置用Ｃｕ合金製ボンディングワイヤ
JPS62102551A (ja) * 1985-10-30 1987-05-13 Toshiba Corp 半導体装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6321841A (ja) * 1986-07-16 1988-01-29 Toshiba Corp 半導体装置
JPS6365035A (ja) * 1986-09-05 1988-03-23 Furukawa Electric Co Ltd:The 銅細線とその製造方法
JPH02232327A (ja) * 1989-03-06 1990-09-14 Nippon Mining Co Ltd 加工性，耐熱性の優れた高導電性銅合金

Also Published As

Publication number Publication date
JPH0222130B2 (enExample) 1990-05-17

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees