JPS62122378U - - Google Patents
Info
- Publication number
- JPS62122378U JPS62122378U JP964886U JP964886U JPS62122378U JP S62122378 U JPS62122378 U JP S62122378U JP 964886 U JP964886 U JP 964886U JP 964886 U JP964886 U JP 964886U JP S62122378 U JPS62122378 U JP S62122378U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount component
- soldering
- hole
- iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 16
- 229910052742 iron Inorganic materials 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第３図は本考案の実施例を説明する
図であり、第１図ははんだ鏝の側面図、第２図は
第１図のはんだ鏝を用いて面実装部品を取り外す
状態を示す説明図、第３図は第１図のはんだ鏝で
面実装部品を吸引した状態を示す図である。また
、第４図及び第５図は本考案の変形例を示す説明
図である。第６図及び第７図は従来のはんだ鏝に
より面実装部品を取り外す状態を示す説明図であ
る。
１……チツプ部品（面実装部品）、３……印刷
配線板、１１……フラツトパツケージ型ＩＣ（面
実装部品）、１５……はんだ鏝、１９……鏝先部
、２３，２４……バキユーム管、２１……穴部、
２６……はんだ付け部分。
Figures 1 to 3 are diagrams explaining an embodiment of the present invention, with Figure 1 being a side view of a soldering iron, and Figure 2 showing a state in which a surface mount component is removed using the soldering iron shown in Figure 1. The explanatory diagram shown in FIG. 3 is a diagram showing a state in which a surface-mounted component is sucked with the soldering iron of FIG. 1. Moreover, FIGS. 4 and 5 are explanatory diagrams showing modifications of the present invention. FIGS. 6 and 7 are explanatory diagrams showing a state in which a surface-mounted component is removed using a conventional soldering iron. 1... Chip component (surface mount component), 3... Printed wiring board, 11... Flat package type IC (surface mount component), 15... Soldering iron, 19... Iron tip, 23, 24... Vacuum tube, 21... hole,
26...Soldering part.
Claims (1)
形成された鏝先部に空気吸引ポンプに接続される
穴部を設け、該穴部で前記面実装部品を吸引する
ことを特徴とするはんだ鏝。 A soldering iron characterized in that a hole connected to an air suction pump is provided in a tip of the iron formed in a shape to heat a soldering part of a surface mount component, and the surface mount component is sucked through the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP964886U JPS62122378U (en) | 1986-01-28 | 1986-01-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP964886U JPS62122378U (en) | 1986-01-28 | 1986-01-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62122378U true JPS62122378U (en) | 1987-08-03 |
Family
ID=30795158
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP964886U Pending JPS62122378U (en) | 1986-01-28 | 1986-01-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62122378U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678289A (en) * | 2017-05-30 | 2020-01-10 | 法国大陆汽车公司 | Heating device |
-
1986
- 1986-01-28 JP JP964886U patent/JPS62122378U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678289A (en) * | 2017-05-30 | 2020-01-10 | 法国大陆汽车公司 | Heating device |