JPS62120049A - 絶縁状の金属フイルムを用いて電気的接続を行う方法及び装置 - Google Patents

絶縁状の金属フイルムを用いて電気的接続を行う方法及び装置

Info

Publication number
JPS62120049A
JPS62120049A JP61270806A JP27080686A JPS62120049A JP S62120049 A JPS62120049 A JP S62120049A JP 61270806 A JP61270806 A JP 61270806A JP 27080686 A JP27080686 A JP 27080686A JP S62120049 A JPS62120049 A JP S62120049A
Authority
JP
Japan
Prior art keywords
substrate
film
conductors
conductive
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61270806A
Other languages
English (en)
Japanese (ja)
Inventor
ピーター　エル　ヤング
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OPTICAL MATEIRIARUZU Inc
Original Assignee
OPTICAL MATEIRIARUZU Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OPTICAL MATEIRIARUZU Inc filed Critical OPTICAL MATEIRIARUZU Inc
Publication of JPS62120049A publication Critical patent/JPS62120049A/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H10W20/068—
    • H10W20/492—
    • H10W70/641—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/128—Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49163—Manufacturing circuit on or in base with sintering of base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP61270806A 1985-11-14 1986-11-13 絶縁状の金属フイルムを用いて電気的接続を行う方法及び装置 Pending JPS62120049A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US799926 1985-11-14
US06/799,926 US4681778A (en) 1985-11-14 1985-11-14 Method and apparatus for making electrical connections utilizing a dielectric-like metal film

Publications (1)

Publication Number Publication Date
JPS62120049A true JPS62120049A (ja) 1987-06-01

Family

ID=25177102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61270806A Pending JPS62120049A (ja) 1985-11-14 1986-11-13 絶縁状の金属フイルムを用いて電気的接続を行う方法及び装置

Country Status (3)

Country Link
US (1) US4681778A (cg-RX-API-DMAC10.html)
JP (1) JPS62120049A (cg-RX-API-DMAC10.html)
DE (1) DE3638799A1 (cg-RX-API-DMAC10.html)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4847138A (en) * 1987-10-07 1989-07-11 Corning Glass Works Thermal writing on glass and glass-ceramic substrates
US4931323A (en) * 1987-12-10 1990-06-05 Texas Instruments Incorporated Thick film copper conductor patterning by laser
US4980225A (en) * 1988-07-12 1990-12-25 Sayles & Scheel Enterprises, Incorporated Conductive composition and method of use
US5122440A (en) * 1988-09-06 1992-06-16 Chien Chung Ping Ultraviolet curing of photosensitive polyimides
US5124238A (en) * 1988-09-06 1992-06-23 The Boeing Company Fabrication of microelectronics using photosensitive polyimides
US4931353A (en) * 1989-03-01 1990-06-05 The Boeing Company Structure and method for selectively producing a conductive region on a substrate
US4974048A (en) * 1989-03-10 1990-11-27 The Boeing Company Integrated circuit having reroutable conductive paths
FR2651083B1 (fr) * 1989-08-18 1995-12-29 Commissariat Energie Atomique Element de connexion ou deconnexion electrique, circuit integre comprenant de tels elements et procede de connexion ou de deconnexion correspondant
TW278229B (en) * 1994-12-29 1996-06-11 Siemens Ag Fuse structure for an integrated circuit device and method for manufacturing a fuse structure
US5793095A (en) * 1996-08-21 1998-08-11 Vlsi Technology, Inc. Custom laser conductor linkage for integrated circuits
JP2005129851A (ja) * 2003-10-27 2005-05-19 Disco Abrasive Syst Ltd レーザ光線を利用した加工方法
US8227278B2 (en) * 2008-09-05 2012-07-24 Semiconductor Energy Laboratory Co., Ltd. Methods for manufacturing thin film transistor and display device
US9133545B2 (en) * 2013-10-23 2015-09-15 Corning Incorporated Glass-ceramics substrates for graphene growth

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3801366A (en) * 1971-02-16 1974-04-02 J Lemelson Method of making an electrical circuit
GB1574699A (en) * 1975-10-10 1980-09-10 Luc Technologies Ltd Conductive connections
US4159414A (en) * 1978-04-25 1979-06-26 Massachusetts Institute Of Technology Method for forming electrically conductive paths
JPS5856355A (ja) * 1981-09-30 1983-04-04 Hitachi Ltd 半導体集積回路装置
JPS58115692A (ja) * 1981-12-28 1983-07-09 Fujitsu Ltd プログラマブル・リードオンリメモリのヒューズ切断方法
US4486464A (en) * 1982-09-27 1984-12-04 Sperry Corporation Method of making planarizing non-conductive layers employing conductive metals

Also Published As

Publication number Publication date
DE3638799C2 (cg-RX-API-DMAC10.html) 1989-10-26
DE3638799A1 (de) 1987-05-21
US4681778A (en) 1987-07-21

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