JPS62118475U - - Google Patents
Info
- Publication number
- JPS62118475U JPS62118475U JP12073285U JP12073285U JPS62118475U JP S62118475 U JPS62118475 U JP S62118475U JP 12073285 U JP12073285 U JP 12073285U JP 12073285 U JP12073285 U JP 12073285U JP S62118475 U JPS62118475 U JP S62118475U
- Authority
- JP
- Japan
- Prior art keywords
- chip component
- insulating substrate
- opening
- electrode pattern
- around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例を示す混成集積回
路装置の要部断面図、第２図はこの考案の絶縁基
板加工段階での要部断面の概念図、第３図は従来
の混成集積回路装置を示す要部断面図である。
図中、１は絶縁基板、２は取付用電極、３はチ
ツプ部品、４ははんだ、４ａ，４ｂははんだペー
スト、５は基板の開孔部である。なお、各図中、
同一符号は同一又は相当部分を示す。
Figure 1 is a cross-sectional view of the main parts of a hybrid integrated circuit device showing an embodiment of this invention, Figure 2 is a conceptual diagram of a cross-section of the main parts of this invention at the insulating substrate processing stage, and Figure 3 is a conventional hybrid integrated circuit device. FIG. 2 is a cross-sectional view of the main parts of the circuit device. In the figure, 1 is an insulating substrate, 2 is a mounting electrode, 3 is a chip component, 4 is solder, 4a and 4b are solder paste, and 5 is an opening in the substrate. In addition, in each figure,
The same reference numerals indicate the same or equivalent parts.
Claims (1)
面寸法よりやや大きい寸法の複数個の開孔部とこ
の開孔部周辺に前記チツプ部品接続用の電極パタ
ーンとを有する絶縁基板とから構成され、前記絶
縁基板の開孔部周辺の電極パターン上にはんだペ
ーストを塗布後、前記絶縁基板の開孔部に前記チ
ツプ部品を挿入し、はんだを溶融固着させて電子
回路を形成したことを特徴とする混成集積回路装
置。 It is composed of a chip component, an insulating substrate having a plurality of openings having a size slightly larger than the cross-sectional dimension of the electrode portion of the chip component, and an electrode pattern for connecting the chip component around the opening, After applying solder paste on the electrode pattern around the opening of the insulating substrate, the chip component is inserted into the opening of the insulating substrate, and the solder is melted and fixed to form an electronic circuit. Integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12073285U JPS62118475U (en) | 1985-08-06 | 1985-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12073285U JPS62118475U (en) | 1985-08-06 | 1985-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118475U true JPS62118475U (en) | 1987-07-28 |
Family
ID=31009326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12073285U Pending JPS62118475U (en) | 1985-08-06 | 1985-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118475U (en) |
-
1985
- 1985-08-06 JP JP12073285U patent/JPS62118475U/ja active Pending