JPS62143302U - - Google Patents
Info
- Publication number
- JPS62143302U JPS62143302U JP3036486U JP3036486U JPS62143302U JP S62143302 U JPS62143302 U JP S62143302U JP 3036486 U JP3036486 U JP 3036486U JP 3036486 U JP3036486 U JP 3036486U JP S62143302 U JPS62143302 U JP S62143302U
- Authority
- JP
- Japan
- Prior art keywords
- slit
- integrated circuit
- lines
- microwave integrated
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
第１図はこの考案の一実施例によるマイクロ波
集積回路の実装法を示す図、第２図はこの考案の
他の実施例を示すマイクロ波集積回路の実装法を
示す図、第３図は従来のマイクロ波集積回路の実
装法を示す図である。図において、１はマイクロ
波集積回路、２はスリツト、３はエアブリツジ、
４はキヤリア、５は半田、６はスルーホール、７
は金ワイヤーである。なお、図中同一符号は同一
、又は相当部分を示す。
FIG. 1 is a diagram showing a method of mounting a microwave integrated circuit according to one embodiment of this invention, FIG. 2 is a diagram showing a method of mounting a microwave integrated circuit according to another embodiment of this invention, and FIG. 1 is a diagram showing a conventional microwave integrated circuit mounting method; FIG. In the figure, 1 is a microwave integrated circuit, 2 is a slit, 3 is an air bridge,
4 is carrier, 5 is solder, 6 is through hole, 7
is gold wire. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
子を形成するマイクロ波集積回路において、基板
上にスリツトを配し、スリツトを股ぐ線路をエア
ブリツジにて接続したことを特徴とするマイクロ
波集積回路。 A microwave integrated circuit in which strip lines and various circuit elements are formed on a dielectric substrate, characterized in that a slit is arranged on the substrate and the lines that cross the slit are connected by an air bridge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3036486U JPS62143302U (en) | 1986-03-03 | 1986-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3036486U JPS62143302U (en) | 1986-03-03 | 1986-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62143302U true JPS62143302U (en) | 1987-09-10 |
Family
ID=30835098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3036486U Pending JPS62143302U (en) | 1986-03-03 | 1986-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62143302U (en) |
-
1986
- 1986-03-03 JP JP3036486U patent/JPS62143302U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5895657U (en) | Lead frame for integrated circuits | |
| JPS62143302U (en) | ||
| JPS6395271U (en) | ||
| JPH036842U (en) | ||
| JPS6276542U (en) | ||
| JPS6166955U (en) | ||
| JPS6094836U (en) | semiconductor equipment | |
| JPS61149334U (en) | ||
| JPS6448907U (en) | ||
| JPS62118475U (en) | ||
| JPS61146977U (en) | ||
| JPS6260091U (en) | ||
| JPS61163418U (en) | ||
| JPS60125742U (en) | Lead frame for hybrid integrated circuits | |
| JPH02110360U (en) | ||
| JPH0296747U (en) | ||
| JPH0353854U (en) | ||
| JPS5883173U (en) | printed wiring board | |
| JPS6142861U (en) | semiconductor equipment | |
| JPS6196543U (en) | ||
| JPS5945930U (en) | Semiconductor element mounting structure | |
| JPH0434756U (en) | ||
| JPS59119025U (en) | Forming method for electronic components | |
| JPS5945929U (en) | Semiconductor element mounting structure | |
| JPS60127001U (en) | microwave integrated circuit |