JPS6211784B2 - - Google Patents
Info
- Publication number
- JPS6211784B2 JPS6211784B2 JP56176057A JP17605781A JPS6211784B2 JP S6211784 B2 JPS6211784 B2 JP S6211784B2 JP 56176057 A JP56176057 A JP 56176057A JP 17605781 A JP17605781 A JP 17605781A JP S6211784 B2 JPS6211784 B2 JP S6211784B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- layer
- tin
- semiconductor device
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W70/457—
-
- H10W72/07251—
-
- H10W72/20—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56176057A JPS57103342A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56176057A JPS57103342A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4595474A Division JPS5731298B2 (enExample) | 1974-04-25 | 1974-04-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57103342A JPS57103342A (en) | 1982-06-26 |
| JPS6211784B2 true JPS6211784B2 (enExample) | 1987-03-14 |
Family
ID=16006959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56176057A Granted JPS57103342A (en) | 1981-11-02 | 1981-11-02 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57103342A (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2511765Y2 (ja) * | 1990-01-23 | 1996-09-25 | 株式会社三井ハイテック | リ―ドフレ―ム |
| JP4260263B2 (ja) * | 1999-01-28 | 2009-04-30 | 株式会社ルネサステクノロジ | 半導体装置 |
| KR20000057810A (ko) | 1999-01-28 | 2000-09-25 | 가나이 쓰토무 | 반도체 장치 |
| JP2006269903A (ja) * | 2005-03-25 | 2006-10-05 | Shinko Electric Ind Co Ltd | 半導体装置用リードフレーム |
| CN102575369B (zh) * | 2009-06-29 | 2015-08-05 | Om产业股份有限公司 | 电气元件的制造方法和电气元件 |
-
1981
- 1981-11-02 JP JP56176057A patent/JPS57103342A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57103342A (en) | 1982-06-26 |
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