JPS62116654A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物

Info

Publication number
JPS62116654A
JPS62116654A JP22421185A JP22421185A JPS62116654A JP S62116654 A JPS62116654 A JP S62116654A JP 22421185 A JP22421185 A JP 22421185A JP 22421185 A JP22421185 A JP 22421185A JP S62116654 A JPS62116654 A JP S62116654A
Authority
JP
Japan
Prior art keywords
epoxy resin
group
formula
copolymer
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22421185A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6360070B2 (fr
Inventor
Kunio Ito
邦雄 伊藤
Toshio Shiobara
利夫 塩原
Koji Futatsumori
二ツ森 浩二
Kazutoshi Tomiyoshi
富吉 和俊
Hisashi Shimizu
久司 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Priority to JP22421185A priority Critical patent/JPS62116654A/ja
Priority to EP86113812A priority patent/EP0218228B1/fr
Priority to DE86113812T priority patent/DE3689022T2/de
Publication of JPS62116654A publication Critical patent/JPS62116654A/ja
Priority to US07/179,538 priority patent/US4877822A/en
Publication of JPS6360070B2 publication Critical patent/JPS6360070B2/ja
Priority to US07/397,739 priority patent/US5053445A/en
Priority to DE4006450A priority patent/DE4006450A1/de
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
JP22421185A 1985-10-07 1985-10-07 エポキシ樹脂組成物 Granted JPS62116654A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP22421185A JPS62116654A (ja) 1985-10-07 1985-10-07 エポキシ樹脂組成物
EP86113812A EP0218228B1 (fr) 1985-10-07 1986-10-06 Composition à base de résine époxyde
DE86113812T DE3689022T2 (de) 1985-10-07 1986-10-06 Epoxyharzzusammensetzung.
US07/179,538 US4877822A (en) 1985-10-07 1988-04-08 Epoxy resin composition
US07/397,739 US5053445A (en) 1985-10-07 1989-08-23 Epoxy resin composition
DE4006450A DE4006450A1 (de) 1985-10-07 1990-03-01 Polyimidharzmassen und damit eingekapselte halbleiterbauelemente

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22421185A JPS62116654A (ja) 1985-10-07 1985-10-07 エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS62116654A true JPS62116654A (ja) 1987-05-28
JPS6360070B2 JPS6360070B2 (fr) 1988-11-22

Family

ID=16810260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22421185A Granted JPS62116654A (ja) 1985-10-07 1985-10-07 エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS62116654A (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5131799A (ja) * 1974-09-13 1976-03-18 Hitachi Ltd Netsukokaseijushisoseibutsu
JPS5160299A (ja) * 1974-11-25 1976-05-26 Sumitomo Bakelite Co Ehokishijushokokazaisoseibutsu
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS5869244A (ja) * 1981-10-21 1983-04-25 Toray Silicone Co Ltd 成形用エポキシ樹脂組成物

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5131799A (ja) * 1974-09-13 1976-03-18 Hitachi Ltd Netsukokaseijushisoseibutsu
JPS5160299A (ja) * 1974-11-25 1976-05-26 Sumitomo Bakelite Co Ehokishijushokokazaisoseibutsu
JPS56136816A (en) * 1980-03-31 1981-10-26 Shin Etsu Chem Co Ltd Epoxy resin composition
JPS5821417A (ja) * 1981-07-29 1983-02-08 Shin Etsu Chem Co Ltd 硬化性エポキシ樹脂組成物
JPS5869244A (ja) * 1981-10-21 1983-04-25 Toray Silicone Co Ltd 成形用エポキシ樹脂組成物

Also Published As

Publication number Publication date
JPS6360070B2 (fr) 1988-11-22

Similar Documents

Publication Publication Date Title
US5053445A (en) Epoxy resin composition
US6162878A (en) Semiconductor encapsulating epoxy resin composition and semiconductor device
JPH0617458B2 (ja) エポキシ樹脂組成物
JP3582576B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPS6355532B2 (fr)
JPS6284147A (ja) エポキシ樹脂組成物
JPS62212417A (ja) エポキシ樹脂組成物
US6297306B1 (en) Semiconductor encapsulating epoxy resin composition and semiconductor device
JP2002003577A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH02302421A (ja) エポキシ樹脂組成物
JPS62116654A (ja) エポキシ樹脂組成物
JPS62187721A (ja) エポキシ樹脂組成物
JPH06256364A (ja) 有機ケイ素化合物、その製法及びそれを含有する樹脂組成物
JPS63238123A (ja) エポキシ樹脂組成物
JPH02302426A (ja) エポキシ樹脂組成物
JPH03296526A (ja) エポキシ樹脂組成物
JP2987180B2 (ja) 硬化性エポキシ樹脂組成物
JP2541015B2 (ja) 半導体装置封止用エポキシ樹脂組成物及び半導体装置
JP2714451B2 (ja) エポキシ樹脂組成物
JP3056634B2 (ja) 半導体封止用エポキシ樹脂組成物
JPH0267312A (ja) エポキシ樹脂組成物
JPH0339319A (ja) エポキシ樹脂組成物及び半導体装置
JP2987179B2 (ja) 硬化性エポキシ樹脂組成物
JP2002037983A (ja) エポキシ樹脂組成物
JPH0841292A (ja) エポキシ樹脂組成物の製造法及び半導体封止用エポキシ樹脂組成物

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term