JPS6211253A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS6211253A
JPS6211253A JP60296893A JP29689385A JPS6211253A JP S6211253 A JPS6211253 A JP S6211253A JP 60296893 A JP60296893 A JP 60296893A JP 29689385 A JP29689385 A JP 29689385A JP S6211253 A JPS6211253 A JP S6211253A
Authority
JP
Japan
Prior art keywords
layer
bump
wiring
stress relaxation
relaxation region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60296893A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6223462B2 (enExample
Inventor
Susumu Sato
奨 佐藤
Hideo Tsunemitsu
常光　秀男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP60296893A priority Critical patent/JPS6211253A/ja
Publication of JPS6211253A publication Critical patent/JPS6211253A/ja
Publication of JPS6223462B2 publication Critical patent/JPS6223462B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Wire Bonding (AREA)
JP60296893A 1985-12-27 1985-12-27 半導体装置 Granted JPS6211253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60296893A JPS6211253A (ja) 1985-12-27 1985-12-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60296893A JPS6211253A (ja) 1985-12-27 1985-12-27 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12631877A Division JPS5459080A (en) 1977-10-19 1977-10-19 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6211253A true JPS6211253A (ja) 1987-01-20
JPS6223462B2 JPS6223462B2 (enExample) 1987-05-22

Family

ID=17839525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60296893A Granted JPS6211253A (ja) 1985-12-27 1985-12-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS6211253A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120066044A (ko) * 2009-09-17 2012-06-21 네덜란제 오르가니자티에 포오르 토에게파스트-나투우르베텐샤펠리즈크 온데르조에크 테엔오 전자 장치들 내의 취약한 무기 층들에서의 콘택 위치들의 기하 구조

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120066044A (ko) * 2009-09-17 2012-06-21 네덜란제 오르가니자티에 포오르 토에게파스트-나투우르베텐샤펠리즈크 온데르조에크 테엔오 전자 장치들 내의 취약한 무기 층들에서의 콘택 위치들의 기하 구조
JP2013505570A (ja) * 2009-09-17 2013-02-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 電子デバイスの脆弱な無機層におけるコンタクトサイト構成
US9449939B2 (en) 2009-09-17 2016-09-20 Koninklijke Philips N.V. Geometry of contact sites at brittle inorganic layers in electronic devices

Also Published As

Publication number Publication date
JPS6223462B2 (enExample) 1987-05-22

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