JPS6223461B2 - - Google Patents

Info

Publication number
JPS6223461B2
JPS6223461B2 JP60296892A JP29689285A JPS6223461B2 JP S6223461 B2 JPS6223461 B2 JP S6223461B2 JP 60296892 A JP60296892 A JP 60296892A JP 29689285 A JP29689285 A JP 29689285A JP S6223461 B2 JPS6223461 B2 JP S6223461B2
Authority
JP
Japan
Prior art keywords
bump
wiring
layer
insulating film
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60296892A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6211252A (ja
Inventor
Susumu Sato
Hideo Tsunemitsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60296892A priority Critical patent/JPS6211252A/ja
Publication of JPS6211252A publication Critical patent/JPS6211252A/ja
Publication of JPS6223461B2 publication Critical patent/JPS6223461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking

Landscapes

  • Wire Bonding (AREA)
JP60296892A 1985-12-27 1985-12-27 半導体装置 Granted JPS6211252A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60296892A JPS6211252A (ja) 1985-12-27 1985-12-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60296892A JPS6211252A (ja) 1985-12-27 1985-12-27 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12631877A Division JPS5459080A (en) 1977-10-19 1977-10-19 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6211252A JPS6211252A (ja) 1987-01-20
JPS6223461B2 true JPS6223461B2 (enExample) 1987-05-22

Family

ID=17839511

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60296892A Granted JPS6211252A (ja) 1985-12-27 1985-12-27 半導体装置

Country Status (1)

Country Link
JP (1) JPS6211252A (enExample)

Also Published As

Publication number Publication date
JPS6211252A (ja) 1987-01-20

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