JPS6211005Y2 - - Google Patents
Info
- Publication number
- JPS6211005Y2 JPS6211005Y2 JP1981070335U JP7033581U JPS6211005Y2 JP S6211005 Y2 JPS6211005 Y2 JP S6211005Y2 JP 1981070335 U JP1981070335 U JP 1981070335U JP 7033581 U JP7033581 U JP 7033581U JP S6211005 Y2 JPS6211005 Y2 JP S6211005Y2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit board
- sealing material
- device hole
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003566 sealing material Substances 0.000 claims description 14
- 239000008393 encapsulating agent Substances 0.000 claims description 5
- 239000011241 protective layer Substances 0.000 claims description 3
- 239000002759 woven fabric Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981070335U JPS6211005Y2 (de) | 1981-05-15 | 1981-05-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981070335U JPS6211005Y2 (de) | 1981-05-15 | 1981-05-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57183756U JPS57183756U (de) | 1982-11-20 |
JPS6211005Y2 true JPS6211005Y2 (de) | 1987-03-16 |
Family
ID=29866165
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981070335U Expired JPS6211005Y2 (de) | 1981-05-15 | 1981-05-15 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6211005Y2 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0747913Y2 (ja) * | 1988-03-09 | 1995-11-01 | ミノルタ株式会社 | フレキシブルプリント配線板の取付構造 |
US7557489B2 (en) * | 2007-07-10 | 2009-07-07 | Siemens Medical Solutions Usa, Inc. | Embedded circuits on an ultrasound transducer and method of manufacture |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5333576B2 (de) * | 1972-08-09 | 1978-09-14 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5333576U (de) * | 1976-08-23 | 1978-03-24 |
-
1981
- 1981-05-15 JP JP1981070335U patent/JPS6211005Y2/ja not_active Expired
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5333576B2 (de) * | 1972-08-09 | 1978-09-14 |
Also Published As
Publication number | Publication date |
---|---|
JPS57183756U (de) | 1982-11-20 |
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