JPS6328607Y2 - - Google Patents
Info
- Publication number
- JPS6328607Y2 JPS6328607Y2 JP1983041669U JP4166983U JPS6328607Y2 JP S6328607 Y2 JPS6328607 Y2 JP S6328607Y2 JP 1983041669 U JP1983041669 U JP 1983041669U JP 4166983 U JP4166983 U JP 4166983U JP S6328607 Y2 JPS6328607 Y2 JP S6328607Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- sealing lid
- hole
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007789 sealing Methods 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 description 9
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4166983U JPS59146954U (ja) | 1983-03-22 | 1983-03-22 | 混成集積回路の封止構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4166983U JPS59146954U (ja) | 1983-03-22 | 1983-03-22 | 混成集積回路の封止構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59146954U JPS59146954U (ja) | 1984-10-01 |
| JPS6328607Y2 true JPS6328607Y2 (de) | 1988-08-02 |
Family
ID=30172241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4166983U Granted JPS59146954U (ja) | 1983-03-22 | 1983-03-22 | 混成集積回路の封止構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59146954U (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013165140A (ja) * | 2012-02-10 | 2013-08-22 | Honda Motor Co Ltd | 電子部品ユニットの封止構造及び製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4841395A (de) * | 1971-09-30 | 1973-06-16 | ||
| JPS52103677A (en) * | 1976-02-25 | 1977-08-31 | Sanyo Electric Co | Method of sealing hybrid integrated circuit |
-
1983
- 1983-03-22 JP JP4166983U patent/JPS59146954U/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4841395A (de) * | 1971-09-30 | 1973-06-16 | ||
| JPS52103677A (en) * | 1976-02-25 | 1977-08-31 | Sanyo Electric Co | Method of sealing hybrid integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59146954U (ja) | 1984-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR930024140A (ko) | 반도체장치 및 그 제조방법 | |
| JPS6328607Y2 (de) | ||
| JPH0228261B2 (de) | ||
| JPH07263618A (ja) | 混成集積回路装置 | |
| JP2593867Y2 (ja) | 複合半導体装置 | |
| JPS629730Y2 (de) | ||
| JPS5837694B2 (ja) | 半導体装置 | |
| JPH0436121Y2 (de) | ||
| JPS629729Y2 (de) | ||
| JPS6311735Y2 (de) | ||
| JPH087638Y2 (ja) | 半導体装置のパッケージ | |
| JPH0530377Y2 (de) | ||
| JPS6225891Y2 (de) | ||
| JPS5835377B2 (ja) | 電子機器の製造方法 | |
| JPS609147A (ja) | 混合集積回路 | |
| JPH03108364A (ja) | パワーｉｃ装置 | |
| KR950006836Y1 (ko) | 반도체 패키지 | |
| JPH06163747A (ja) | 混成集積回路装置 | |
| JPH0351299B2 (de) | ||
| JPS59138236U (ja) | 混成集積回路装置 | |
| JPS5989544U (ja) | 混成集積回路 | |
| JPS6279637A (ja) | 半導体集積回路装置 | |
| JPH08306744A (ja) | 電子部品 | |
| JPS62193268A (ja) | ハイブリツド集積回路 | |
| JPS6014509B2 (ja) | 半導体装置 |