JPS62108545A - プリント基板型パッケ−ジ - Google Patents
プリント基板型パッケ−ジInfo
- Publication number
- JPS62108545A JPS62108545A JP60248654A JP24865485A JPS62108545A JP S62108545 A JPS62108545 A JP S62108545A JP 60248654 A JP60248654 A JP 60248654A JP 24865485 A JP24865485 A JP 24865485A JP S62108545 A JPS62108545 A JP S62108545A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- substrate
- lid
- cover body
- adhesives
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W76/60—
-
- H10W70/682—
-
- H10W70/685—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W90/754—
Landscapes
- Casings For Electric Apparatus (AREA)
- Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60248654A JPS62108545A (ja) | 1985-11-06 | 1985-11-06 | プリント基板型パッケ−ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60248654A JPS62108545A (ja) | 1985-11-06 | 1985-11-06 | プリント基板型パッケ−ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62108545A true JPS62108545A (ja) | 1987-05-19 |
| JPH0353779B2 JPH0353779B2 (cg-RX-API-DMAC10.html) | 1991-08-16 |
Family
ID=17181339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60248654A Granted JPS62108545A (ja) | 1985-11-06 | 1985-11-06 | プリント基板型パッケ−ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62108545A (cg-RX-API-DMAC10.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045664U (cg-RX-API-DMAC10.html) * | 1990-04-27 | 1992-01-20 | ||
| JPH0465451U (cg-RX-API-DMAC10.html) * | 1990-10-18 | 1992-06-08 | ||
| US5889323A (en) * | 1996-08-19 | 1999-03-30 | Nec Corporation | Semiconductor package and method of manufacturing the same |
-
1985
- 1985-11-06 JP JP60248654A patent/JPS62108545A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045664U (cg-RX-API-DMAC10.html) * | 1990-04-27 | 1992-01-20 | ||
| JPH0465451U (cg-RX-API-DMAC10.html) * | 1990-10-18 | 1992-06-08 | ||
| US5889323A (en) * | 1996-08-19 | 1999-03-30 | Nec Corporation | Semiconductor package and method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0353779B2 (cg-RX-API-DMAC10.html) | 1991-08-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |