JPS6198782A - 耐熱性接着剤組成物 - Google Patents

耐熱性接着剤組成物

Info

Publication number
JPS6198782A
JPS6198782A JP22179984A JP22179984A JPS6198782A JP S6198782 A JPS6198782 A JP S6198782A JP 22179984 A JP22179984 A JP 22179984A JP 22179984 A JP22179984 A JP 22179984A JP S6198782 A JPS6198782 A JP S6198782A
Authority
JP
Japan
Prior art keywords
adhesive composition
acid
bis
resin
resistant adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP22179984A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365837B2 (enExample
Inventor
Takao Takahashi
隆雄 高橋
Hideya Aoki
青木　秀哉
Tadao Iwata
岩田　忠雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Petrochemical Industries Ltd
Original Assignee
Mitsui Petrochemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Petrochemical Industries Ltd filed Critical Mitsui Petrochemical Industries Ltd
Priority to JP22179984A priority Critical patent/JPS6198782A/ja
Publication of JPS6198782A publication Critical patent/JPS6198782A/ja
Publication of JPH0365837B2 publication Critical patent/JPH0365837B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP22179984A 1984-10-22 1984-10-22 耐熱性接着剤組成物 Granted JPS6198782A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22179984A JPS6198782A (ja) 1984-10-22 1984-10-22 耐熱性接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22179984A JPS6198782A (ja) 1984-10-22 1984-10-22 耐熱性接着剤組成物

Publications (2)

Publication Number Publication Date
JPS6198782A true JPS6198782A (ja) 1986-05-17
JPH0365837B2 JPH0365837B2 (enExample) 1991-10-15

Family

ID=16772377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22179984A Granted JPS6198782A (ja) 1984-10-22 1984-10-22 耐熱性接着剤組成物

Country Status (1)

Country Link
JP (1) JPS6198782A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238930A (ja) * 1988-03-22 1989-09-25 Hitachi Chem Co Ltd 金属板ベース銅張積層板
US5268432A (en) * 1992-06-16 1993-12-07 Industrial Technology Research Institute Heat resistant modified bismaleimide adhesive composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238930A (ja) * 1988-03-22 1989-09-25 Hitachi Chem Co Ltd 金属板ベース銅張積層板
US5268432A (en) * 1992-06-16 1993-12-07 Industrial Technology Research Institute Heat resistant modified bismaleimide adhesive composition

Also Published As

Publication number Publication date
JPH0365837B2 (enExample) 1991-10-15

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