JPS6188243U - - Google Patents
Info
- Publication number
- JPS6188243U JPS6188243U JP1984172862U JP17286284U JPS6188243U JP S6188243 U JPS6188243 U JP S6188243U JP 1984172862 U JP1984172862 U JP 1984172862U JP 17286284 U JP17286284 U JP 17286284U JP S6188243 U JPS6188243 U JP S6188243U
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- laminated metal
- electrode
- bump electrode
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000013459 approach Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13016—Shape in side view
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は本考案の一実施例による半導体装置の
バンプ電極製作工程を順次示す断面図、第２図は
従来のバンプ電極製作工程の一部を示す断面図、
第３図は本考案の一実施例におけるバンプ電極と
隆起部との関係位置を示す平面図ずある。 １：シリコン基板、２，１１：酸化シリコン膜
、３：Ａｌ電極層、４：保護膜、５：密着金属層
、６：バリヤ金属層、７：フオトレジスト、８：
バンプ電極、１０：隆起部、１２：環状酸化膜。
バンプ電極製作工程を順次示す断面図、第２図は
従来のバンプ電極製作工程の一部を示す断面図、
第３図は本考案の一実施例におけるバンプ電極と
隆起部との関係位置を示す平面図ずある。 １：シリコン基板、２，１１：酸化シリコン膜
、３：Ａｌ電極層、４：保護膜、５：密着金属層
、６：バリヤ金属層、７：フオトレジスト、８：
バンプ電極、１０：隆起部、１２：環状酸化膜。
Claims (1)
- 半導体基板の電極層上に積層金属層を介してバ
ンプ電極が設けられるものにおいて、積層金属層
の最表面がバンプ電極の下面に接近して包囲する
隆起部を有することを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984172862U JPS6188243U (ja) | 1984-11-14 | 1984-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984172862U JPS6188243U (ja) | 1984-11-14 | 1984-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6188243U true JPS6188243U (ja) | 1986-06-09 |
Family
ID=30730521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984172862U Pending JPS6188243U (ja) | 1984-11-14 | 1984-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6188243U (ja) |
-
1984
- 1984-11-14 JP JP1984172862U patent/JPS6188243U/ja active Pending