JPS636734U - - Google Patents
Info
- Publication number
- JPS636734U JPS636734U JP1986100312U JP10031286U JPS636734U JP S636734 U JPS636734 U JP S636734U JP 1986100312 U JP1986100312 U JP 1986100312U JP 10031286 U JP10031286 U JP 10031286U JP S636734 U JPS636734 U JP S636734U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- semiconductor device
- electrode
- metal layer
- mark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/90—
-
- H10W72/07551—
-
- H10W72/50—
-
- H10W72/536—
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- H10W72/59—
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- H10W72/931—
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- H10W72/934—
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- H10W72/942—
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案に係る半導体装置の要部切欠
断面図、第２図は、従来の半導体装置の要部切欠
断面図である。 １２１……電極の金属層、１３１……絶縁膜。
断面図、第２図は、従来の半導体装置の要部切欠
断面図である。 １２１……電極の金属層、１３１……絶縁膜。
Claims (1)
- 電極の金属層上に、局部的に絶縁膜を設け、こ
の絶縁膜をボンデイング位置検出用マークとした
ことを特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986100312U JPS636734U (ja) | 1986-06-30 | 1986-06-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986100312U JPS636734U (ja) | 1986-06-30 | 1986-06-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS636734U true JPS636734U (ja) | 1988-01-18 |
Family
ID=30970020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986100312U Pending JPS636734U (ja) | 1986-06-30 | 1986-06-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS636734U (ja) |
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1986
- 1986-06-30 JP JP1986100312U patent/JPS636734U/ja active Pending