JPS6185829A - 半導体素子のトランスフア樹脂モ−ルド成形方法 - Google Patents

半導体素子のトランスフア樹脂モ−ルド成形方法

Info

Publication number
JPS6185829A
JPS6185829A JP20884384A JP20884384A JPS6185829A JP S6185829 A JPS6185829 A JP S6185829A JP 20884384 A JP20884384 A JP 20884384A JP 20884384 A JP20884384 A JP 20884384A JP S6185829 A JPS6185829 A JP S6185829A
Authority
JP
Japan
Prior art keywords
cavity
resin material
mold
transfer
transfer path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20884384A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0418464B2 (de
Inventor
Michio Osada
道男 長田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP20884384A priority Critical patent/JPS6185829A/ja
Publication of JPS6185829A publication Critical patent/JPS6185829A/ja
Publication of JPH0418464B2 publication Critical patent/JPH0418464B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP20884384A 1984-10-03 1984-10-03 半導体素子のトランスフア樹脂モ−ルド成形方法 Granted JPS6185829A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20884384A JPS6185829A (ja) 1984-10-03 1984-10-03 半導体素子のトランスフア樹脂モ−ルド成形方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20884384A JPS6185829A (ja) 1984-10-03 1984-10-03 半導体素子のトランスフア樹脂モ−ルド成形方法

Publications (2)

Publication Number Publication Date
JPS6185829A true JPS6185829A (ja) 1986-05-01
JPH0418464B2 JPH0418464B2 (de) 1992-03-27

Family

ID=16563019

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20884384A Granted JPS6185829A (ja) 1984-10-03 1984-10-03 半導体素子のトランスフア樹脂モ−ルド成形方法

Country Status (1)

Country Link
JP (1) JPS6185829A (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637638A (ja) * 1986-06-27 1988-01-13 Mitsubishi Electric Corp 樹脂封止形半導体の製造方法
FR2615037A1 (fr) * 1987-05-06 1988-11-10 Radiotechnique Compelec Procede et moule pour l'encapsulation d'un dispositif semi-conducteur par injection de resine
JPWO2008093511A1 (ja) * 2007-01-30 2010-05-20 コニカミノルタオプト株式会社 光学素子の成形装置及び光学素子の成形方法
EP2474401A3 (de) * 2011-01-11 2012-10-24 Apic Yamada Corporation Verfahren zur Harzformgebung und Harzformgebungsvorrichtung

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868940A (ja) * 1981-10-20 1983-04-25 Oki Electric Ind Co Ltd 樹脂封止型半導体のトランスフア成形装置
JPS58155727A (ja) * 1982-03-10 1983-09-16 Mitsubishi Electric Corp 半導体装置の樹脂封止金型
JPS5911232A (ja) * 1982-07-12 1984-01-20 Hitachi Ltd 樹脂封止方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5868940A (ja) * 1981-10-20 1983-04-25 Oki Electric Ind Co Ltd 樹脂封止型半導体のトランスフア成形装置
JPS58155727A (ja) * 1982-03-10 1983-09-16 Mitsubishi Electric Corp 半導体装置の樹脂封止金型
JPS5911232A (ja) * 1982-07-12 1984-01-20 Hitachi Ltd 樹脂封止方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS637638A (ja) * 1986-06-27 1988-01-13 Mitsubishi Electric Corp 樹脂封止形半導体の製造方法
FR2615037A1 (fr) * 1987-05-06 1988-11-10 Radiotechnique Compelec Procede et moule pour l'encapsulation d'un dispositif semi-conducteur par injection de resine
JPWO2008093511A1 (ja) * 2007-01-30 2010-05-20 コニカミノルタオプト株式会社 光学素子の成形装置及び光学素子の成形方法
EP2474401A3 (de) * 2011-01-11 2012-10-24 Apic Yamada Corporation Verfahren zur Harzformgebung und Harzformgebungsvorrichtung

Also Published As

Publication number Publication date
JPH0418464B2 (de) 1992-03-27

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