JPS6185829A - 半導体素子のトランスフア樹脂モ−ルド成形方法 - Google Patents
半導体素子のトランスフア樹脂モ−ルド成形方法Info
- Publication number
- JPS6185829A JPS6185829A JP20884384A JP20884384A JPS6185829A JP S6185829 A JPS6185829 A JP S6185829A JP 20884384 A JP20884384 A JP 20884384A JP 20884384 A JP20884384 A JP 20884384A JP S6185829 A JPS6185829 A JP S6185829A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- resin material
- mold
- transfer
- transfer path
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 66
- 239000011347 resin Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000000465 moulding Methods 0.000 title claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 57
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000010309 melting process Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000872 buffer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/34—Moulds having venting means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20884384A JPS6185829A (ja) | 1984-10-03 | 1984-10-03 | 半導体素子のトランスフア樹脂モ−ルド成形方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20884384A JPS6185829A (ja) | 1984-10-03 | 1984-10-03 | 半導体素子のトランスフア樹脂モ−ルド成形方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6185829A true JPS6185829A (ja) | 1986-05-01 |
| JPH0418464B2 JPH0418464B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-03-27 |
Family
ID=16563019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20884384A Granted JPS6185829A (ja) | 1984-10-03 | 1984-10-03 | 半導体素子のトランスフア樹脂モ−ルド成形方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185829A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637638A (ja) * | 1986-06-27 | 1988-01-13 | Mitsubishi Electric Corp | 樹脂封止形半導体の製造方法 |
| FR2615037A1 (fr) * | 1987-05-06 | 1988-11-10 | Radiotechnique Compelec | Procede et moule pour l'encapsulation d'un dispositif semi-conducteur par injection de resine |
| JPWO2008093511A1 (ja) * | 2007-01-30 | 2010-05-20 | コニカミノルタオプト株式会社 | 光学素子の成形装置及び光学素子の成形方法 |
| EP2474401A3 (en) * | 2011-01-11 | 2012-10-24 | Apic Yamada Corporation | Method of resin molding and resin molding apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868940A (ja) * | 1981-10-20 | 1983-04-25 | Oki Electric Ind Co Ltd | 樹脂封止型半導体のトランスフア成形装置 |
| JPS58155727A (ja) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
| JPS5911232A (ja) * | 1982-07-12 | 1984-01-20 | Hitachi Ltd | 樹脂封止方法 |
-
1984
- 1984-10-03 JP JP20884384A patent/JPS6185829A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5868940A (ja) * | 1981-10-20 | 1983-04-25 | Oki Electric Ind Co Ltd | 樹脂封止型半導体のトランスフア成形装置 |
| JPS58155727A (ja) * | 1982-03-10 | 1983-09-16 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型 |
| JPS5911232A (ja) * | 1982-07-12 | 1984-01-20 | Hitachi Ltd | 樹脂封止方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637638A (ja) * | 1986-06-27 | 1988-01-13 | Mitsubishi Electric Corp | 樹脂封止形半導体の製造方法 |
| FR2615037A1 (fr) * | 1987-05-06 | 1988-11-10 | Radiotechnique Compelec | Procede et moule pour l'encapsulation d'un dispositif semi-conducteur par injection de resine |
| JPWO2008093511A1 (ja) * | 2007-01-30 | 2010-05-20 | コニカミノルタオプト株式会社 | 光学素子の成形装置及び光学素子の成形方法 |
| EP2474401A3 (en) * | 2011-01-11 | 2012-10-24 | Apic Yamada Corporation | Method of resin molding and resin molding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0418464B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-03-27 |