JPS6182996A - 複合ろう材の製造方法 - Google Patents
複合ろう材の製造方法Info
- Publication number
- JPS6182996A JPS6182996A JP20510784A JP20510784A JPS6182996A JP S6182996 A JPS6182996 A JP S6182996A JP 20510784 A JP20510784 A JP 20510784A JP 20510784 A JP20510784 A JP 20510784A JP S6182996 A JPS6182996 A JP S6182996A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler metal
- brazing filler
- composite
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20510784A JPS6182996A (ja) | 1984-09-29 | 1984-09-29 | 複合ろう材の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20510784A JPS6182996A (ja) | 1984-09-29 | 1984-09-29 | 複合ろう材の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6182996A true JPS6182996A (ja) | 1986-04-26 |
JPH0433558B2 JPH0433558B2 (enrdf_load_stackoverflow) | 1992-06-03 |
Family
ID=16501533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20510784A Granted JPS6182996A (ja) | 1984-09-29 | 1984-09-29 | 複合ろう材の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6182996A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5916520A (en) * | 1996-03-12 | 1999-06-29 | Kabushiki Kaisha Toshiba | Brazing fillers for sealing vacuum-tight vessels, vacuum-tight vessels and method for manufacturing vacuum-tight vessels |
US7771838B1 (en) * | 2004-10-12 | 2010-08-10 | Boston Scientific Neuromodulation Corporation | Hermetically bonding ceramic and titanium with a Ti-Pd braze interface |
US8329314B1 (en) | 2004-10-12 | 2012-12-11 | Boston Scientific Neuromodulation Corporation | Hermetically bonding ceramic and titanium with a palladium braze |
-
1984
- 1984-09-29 JP JP20510784A patent/JPS6182996A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5916520A (en) * | 1996-03-12 | 1999-06-29 | Kabushiki Kaisha Toshiba | Brazing fillers for sealing vacuum-tight vessels, vacuum-tight vessels and method for manufacturing vacuum-tight vessels |
US7771838B1 (en) * | 2004-10-12 | 2010-08-10 | Boston Scientific Neuromodulation Corporation | Hermetically bonding ceramic and titanium with a Ti-Pd braze interface |
US8329314B1 (en) | 2004-10-12 | 2012-12-11 | Boston Scientific Neuromodulation Corporation | Hermetically bonding ceramic and titanium with a palladium braze |
Also Published As
Publication number | Publication date |
---|---|
JPH0433558B2 (enrdf_load_stackoverflow) | 1992-06-03 |