JPH0433558B2 - - Google Patents

Info

Publication number
JPH0433558B2
JPH0433558B2 JP20510784A JP20510784A JPH0433558B2 JP H0433558 B2 JPH0433558 B2 JP H0433558B2 JP 20510784 A JP20510784 A JP 20510784A JP 20510784 A JP20510784 A JP 20510784A JP H0433558 B2 JPH0433558 B2 JP H0433558B2
Authority
JP
Japan
Prior art keywords
brazing
thickness
strip
composite
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP20510784A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6182996A (ja
Inventor
Hidekazu Yanagisawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP20510784A priority Critical patent/JPS6182996A/ja
Publication of JPS6182996A publication Critical patent/JPS6182996A/ja
Publication of JPH0433558B2 publication Critical patent/JPH0433558B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils
    • B23K35/0238—Sheets, foils layered

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP20510784A 1984-09-29 1984-09-29 複合ろう材の製造方法 Granted JPS6182996A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20510784A JPS6182996A (ja) 1984-09-29 1984-09-29 複合ろう材の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20510784A JPS6182996A (ja) 1984-09-29 1984-09-29 複合ろう材の製造方法

Publications (2)

Publication Number Publication Date
JPS6182996A JPS6182996A (ja) 1986-04-26
JPH0433558B2 true JPH0433558B2 (enrdf_load_stackoverflow) 1992-06-03

Family

ID=16501533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20510784A Granted JPS6182996A (ja) 1984-09-29 1984-09-29 複合ろう材の製造方法

Country Status (1)

Country Link
JP (1) JPS6182996A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3512940B2 (ja) * 1996-03-12 2004-03-31 株式会社東芝 真空気密容器用封着ろう材および真空気密容器の製造方法
US7771838B1 (en) * 2004-10-12 2010-08-10 Boston Scientific Neuromodulation Corporation Hermetically bonding ceramic and titanium with a Ti-Pd braze interface
US8329314B1 (en) 2004-10-12 2012-12-11 Boston Scientific Neuromodulation Corporation Hermetically bonding ceramic and titanium with a palladium braze

Also Published As

Publication number Publication date
JPS6182996A (ja) 1986-04-26

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