JPH0433558B2 - - Google Patents
Info
- Publication number
- JPH0433558B2 JPH0433558B2 JP20510784A JP20510784A JPH0433558B2 JP H0433558 B2 JPH0433558 B2 JP H0433558B2 JP 20510784 A JP20510784 A JP 20510784A JP 20510784 A JP20510784 A JP 20510784A JP H0433558 B2 JPH0433558 B2 JP H0433558B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- thickness
- strip
- composite
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005219 brazing Methods 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002131 composite material Substances 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 11
- 238000007747 plating Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 claims 2
- 239000011253 protective coating Substances 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 description 30
- 239000010936 titanium Substances 0.000 description 28
- 239000000919 ceramic Substances 0.000 description 10
- 238000000034 method Methods 0.000 description 8
- 238000005304 joining Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 3
- 229910000905 alloy phase Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 238000005097 cold rolling Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
- B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0233—Sheets, foils
- B23K35/0238—Sheets, foils layered
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明はTi帯材表面にろう帯材を層状に接合
して、ろう複合帯材を製造する方法に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to a method for manufacturing a brazed composite strip by bonding a solder strip in layers to the surface of a Ti strip.
（従来技術とその問題点）
一般にセラミツクスとセラミツクス、金属とセ
ラミツクスの接合にはTiの活性な性質を利用し
て、Tiを含むろう材が使用されているが、Tiを
含むこれらの合金は脆い合金相を形成する為、板
状、線状に塑性加工するとクラツクが入つたり破
壊したりする。(Prior art and its problems) Generally, brazing filler metals containing Ti are used to bond ceramics to ceramics and metals to ceramics, taking advantage of the active properties of Ti, but these alloys containing Ti are brittle. Because an alloy phase is formed, cracks may appear or break when plastically worked into a plate or wire shape.
従つて薄いシートリボン、および細線を製造す
ることは困難であり形状、使用方法に制限が加え
られてきた。 Therefore, it is difficult to manufacture thin sheet ribbons and thin wires, and restrictions have been placed on their shapes and usage methods.
又、これらの脆い合金相をさける為にTiとろ
う材とを接合し複合材料として使用する方法もと
られているがTiが活性で表面に酸化被膜を生成
しやすい為、ろう材との接合が困難で充分な密着
強度が得にくく実用に供しない等の問題があつ
た。 In addition, in order to avoid these brittle alloy phases, a method of bonding Ti and a brazing metal and using it as a composite material has been taken, but since Ti is active and tends to form an oxide film on the surface, it is difficult to bond it with a brazing metal. However, it was difficult to obtain sufficient adhesion strength, making it unusable.
（発明の目的）
本発明は、この様な脆い合金相を形成すること
なく、ろう付に適したTiを含んだ接合強度の高
い複合ろう材を得る製造方法を提供せんとするも
のである。(Object of the Invention) The present invention aims to provide a manufacturing method for obtaining a Ti-containing composite brazing filler metal suitable for brazing and having high bonding strength without forming such a brittle alloy phase.
（発明の構成）
次に本発明による複合ろう材の製造方法を述べ
ると、先ずTi帯材表面にめつき法により２〜10μ
程度の化学的に安定な層をもうける。この層をも
うける理由は活性なTi表面の酸化を防止する保
護被膜を形成し、次工程でのろう材との接合を容
易ならしめ、且つ強固な接合強度を得る為であ
る。(Structure of the Invention) Next, the method for manufacturing a composite brazing filler metal according to the present invention will be described. First, a titanium strip with a thickness of 2 to 10 μm is coated on the surface of a titanium strip by a plating method.
Creates a chemically stable layer of about 100%. The reason for forming this layer is to form a protective film that prevents oxidation of the active Ti surface, to facilitate bonding with the brazing material in the next step, and to obtain strong bonding strength.
従つてめつき層の厚さは厚い程効果が大である
が、2μ以上あれば充分にその目的を達せられ、
又厚い層をもうけるには長い処理時間を要し経済
的にもメリツトが少なくなるので10μ迄が適当で
ある。Ti表面へのめつき方法は先ずサンドブラ
ストで表面を研摩さ、次に弗化物系薬品で表面処
理し、次にめつきをほどこす。 Therefore, the thicker the plating layer, the greater the effect, but if it is 2 μ or more, it will be sufficient to achieve the purpose.
Furthermore, forming a thick layer requires a long processing time and is economically less advantageous, so a thickness of up to 10 μm is appropriate. The method for plating the Ti surface is to first polish the surface with sandblasting, then treat the surface with a fluoride-based chemical, and then apply plating.
尚、Ti表面にめつきする材料は、酸化被膜を
生成しにくく、化学的安定で、且つ接合を容易な
らしめる材料であればかまわず、Ag、Au、Pd、
Ptが適当である。 The material to be plated on the Ti surface may be any material that does not easily form an oxide film, is chemically stable, and facilitates bonding, such as Ag, Au, Pd,
Pt is appropriate.
一方Tiと張り合わせるろう材としてはの適度
の厚さ、巾に調整された表面平滑で清浄な面をも
つた材料で準備する。このろう材はろう付温度に
達し溶融したときに、ろう材と接合しているTi
と溶け合つて、Ti含有のろう材組成を形成し、
この状態で被ろう接材とのろう接作用の働きをす
る為、溶融してTiを含有したときのろう材の化
学組成は、ろう付に適した組成になつていること
が望ましく、複合材を形成しているTi材とろう
材の厚によつてコントロールする。 On the other hand, as a brazing material to be laminated with Ti, a material with a smooth and clean surface adjusted to an appropriate thickness and width is prepared. When this brazing filler metal reaches the brazing temperature and melts, the Ti bonded to the brazing filler metal
and forms a Ti-containing brazing filler metal composition.
In this state, it acts as a brazing agent with the overlying soldering material, so it is desirable that the chemical composition of the soldering material when melted and containing Ti be suitable for brazing. It is controlled by the thickness of the Ti material and brazing material that make up the material.
ろう材とTi材との接合方法は上に述べた様な
処理をほどこしたTi帯材に相対向する様にろう
帯材をセツトして重ねて接合する。 The method of joining the brazing material and the Ti material is to set the brazing material so as to face the Ti strip material which has been treated as described above, overlap it, and join it.
接合方法として熱間圧延法、シーム溶接法、熱
間圧接法と色々の方法がとれ、形状に合わして決
めることが出来る。 Various joining methods can be used, including hot rolling, seam welding, and hot pressure welding, and can be determined according to the shape.
又この接合の際にはアルゴン、窒素等不活性の
雰囲気で行うことが望ましい。 Further, it is desirable to perform this bonding in an inert atmosphere such as argon or nitrogen.
層状に張り合わされた複合ろう材はその後、冷
間圧延、焼鈍をくり返し薄板、シートリボン状に
仕上げる。 The composite brazing filler metal laminated in layers is then repeatedly cold-rolled and annealed to form a thin plate or sheet ribbon.
この様にして得られたろう材は所望の寸法形状
の容易に仕上げることが出来、且つセラミツクス
のろう付にはTiの活性な性質を利用して良好な
ろう付状態を得ることが出来る。 The brazing filler metal thus obtained can be easily finished into desired dimensions and shapes, and the active properties of Ti can be used to obtain a good brazed state when brazing ceramics.
次に本発明を更に明瞭ならしめる為にその具体
的実施例及び比較例について説明する。 Next, in order to further clarify the present invention, specific examples and comparative examples thereof will be described.
実施例 １
巾15mm、厚さ0.2mmのTiテープ材にサンドブラ
スト処理、フツ化物系薬品処理を行つた後、湿式
Agめつきを行い、平均5μのAg被膜を得た。Example 1 A Ti tape material with a width of 15 mm and a thickness of 0.2 mm was sandblasted and treated with fluoride chemicals, and then wet-processed.
Ag plating was performed to obtain an Ag coating with an average thickness of 5μ.
このTiテープの両側に巾15mm、厚さ0.6mmのAg
−Cu28重量％のテープ材を相対向せしめて、３
層にして熱間圧着装置にてアルゴン雰囲気中で約
600℃に加熱しながら接合して複合ろうテープ材
を得た。このテープ材は充分な接合強さを持ち、
その後の冷間圧延により厚さ70μのテープ材を作
りセラミツクスとセラミツクスをろう付した結
果、ろう付強度の高い良好なろう付け状態が得ら
れた。 Ag with a width of 15 mm and a thickness of 0.6 mm is placed on both sides of this Ti tape.
−Cu28% by weight tape materials are placed facing each other, and 3
Layer it and heat it in an argon atmosphere using a hot-pressing machine.
A composite brazed tape material was obtained by joining while heating at 600°C. This tape material has sufficient bonding strength,
After that, a tape material with a thickness of 70 μm was made by cold rolling, and as a result of brazing the ceramics together, a good brazed state with high brazing strength was obtained.
実施例 ２
巾20mm、厚さ50μのTiテープ材をステンレス製
円筒ドラムに巻き蒸着装置の真空容器中にセツト
し、ドラムに平行に対向してAgターゲツトをセ
ツトしドラムを回転させ、装置内の真空度を３×
10-3Torrにしてスパツタリングを２回行いTiテ
ープの両面に夫々平均3μのAg被膜を得た。Example 2 A Ti tape material with a width of 20 mm and a thickness of 50 μm was wrapped around a stainless steel cylindrical drum and set in the vacuum container of a vapor deposition device. An Ag target was set parallel to and facing the drum, and the drum was rotated. Vacuum degree 3x
Sputtering was carried out twice at 10 -3 Torr to obtain an Ag film with an average thickness of 3 μm on each side of the Ti tape.
このTiのテープの両面に巾20mm、厚さ150μの
Ag―Cu28重量％のテープ材を相対向せしめて３
層にして熱間圧着装置にてアルコン雰囲気中で約
600℃に加熱しながら接合して複合テープ材を得
た。このテープ材は充分な接合強さを持ち、その
後冷間圧延し、厚さ70μのテープ材を作りセラミ
ツクスとセラミツクスをろう付した結果、ろう付
強度の高い良好なろう付状態が得られた。 Both sides of this Ti tape have a width of 20mm and a thickness of 150μ.
Ag--Cu 28% by weight tape material facing each other 3
Layered and hot bonded in Alcon atmosphere for approx.
A composite tape material was obtained by joining while heating at 600°C. This tape material had sufficient bonding strength, and was then cold-rolled to create a tape material with a thickness of 70 μm. As a result of brazing ceramics to ceramics, a good brazed state with high brazing strength was obtained.
（比較例）
巾15mm、厚さ0.2mmのTiテープ材にサンドブラ
スト処理し、フツ化物系薬品処理を行つた。(Comparative Example) A Ti tape material with a width of 15 mm and a thickness of 0.2 mm was sandblasted and treated with fluoride chemicals.
このTiテープの両面に巾15mm、厚さ0.6mmのAg
―Cu28重量％のテープ材を相対向せしめて、３
層にして熱間圧着装置にてアルゴン雰囲気中で約
600℃に加熱しながら接合を試みたが、密着強度
が弱くその後の冷間圧延で剥離を生じ、複合ろう
材を得ることが出来なかつた。 Ag with a width of 15 mm and a thickness of 0.6 mm is on both sides of this Ti tape.
- Place the Cu28wt% tape materials facing each other, 3
Layer it and heat it in an argon atmosphere using a hot-pressing machine.
Attempts were made to join while heating to 600°C, but the adhesion strength was weak and peeling occurred during subsequent cold rolling, making it impossible to obtain a composite brazing filler metal.
なお、実施例ではTi表面のめつきを湿式めつ
き及びスパツタリングについて述べたが、本発明
はこれに限るものではなく、イオンプレーテイン
グ、蒸着等でもよいものである。 In the examples, wet plating and sputtering were described for plating the Ti surface, but the present invention is not limited to this, and ion plating, vapor deposition, etc. may also be used.
（発明の効果）
以上詳記した通り本発明の製造方法は湿式又は
乾式めつき法により保護被膜を形成し、この被膜
を介してろう材と接合し、複合材としたもので接
合が強固であり、且つ、脆い合金層を形成するこ
ともなく充分な加工性を有するので、ろう付に適
した寸法形状のろう材を容易に得ることが出来
る。(Effects of the Invention) As detailed above, the manufacturing method of the present invention forms a protective film by wet or dry plating, and bonds with a brazing material through this film to form a composite material, which provides strong bonding. Moreover, since it has sufficient workability without forming a brittle alloy layer, it is possible to easily obtain a brazing material having a size and shape suitable for brazing.
又、接合前の素材の成分、厚さを変えることに
より必要とする化学組成の材料を容易に得ること
が出来、セラミツクスとセラミツクス、セラミツ
クスと金属をろう付した時に良好な接合状態を得
ることが出来ると云う効果がある。 In addition, by changing the components and thickness of the materials before joining, it is possible to easily obtain materials with the required chemical composition, and it is possible to obtain good joining conditions when brazing ceramics to ceramics or ceramics to metals. There is an effect that says it can be done.
Claims (1)
定なAg、Au、Pd、Ptの保護被膜層をもうけし
かる後、Ti帯材にろう帯材を重ね合わせ接合し、
層状の複合帯材を形成することを特徴とする複合
ろう材の製造方法。 ２ 化学的に安定なAg、Au、Pd、Ptの保護被
膜層の厚さが２〜10μである特許請求の範囲第１
項記載の複合ろう材の製造方法。[Claims] 1. After forming a chemically stable protective coating layer of Ag, Au, Pd, or Pt on the surface of the Ti strip by plating, a brazing strip is overlaid and bonded to the Ti strip. ,
A method for producing a composite brazing filler metal, which comprises forming a layered composite strip. 2. Claim 1, in which the chemically stable protective coating layer of Ag, Au, Pd, and Pt has a thickness of 2 to 10μ.
A method for producing a composite brazing filler metal as described in Section 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20510784A JPS6182996A (en) | 1984-09-29 | 1984-09-29 | Production of composite brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20510784A JPS6182996A (en) | 1984-09-29 | 1984-09-29 | Production of composite brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6182996A JPS6182996A (en) | 1986-04-26 |
| JPH0433558B2 true JPH0433558B2 (en) | 1992-06-03 |
Family
ID=16501533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20510784A Granted JPS6182996A (en) | 1984-09-29 | 1984-09-29 | Production of composite brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6182996A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3512940B2 (en) * | 1996-03-12 | 2004-03-31 | 株式会社東芝 | Sealing brazing material for vacuum hermetic container and method for producing vacuum hermetic container |
| US8329314B1 (en) | 2004-10-12 | 2012-12-11 | Boston Scientific Neuromodulation Corporation | Hermetically bonding ceramic and titanium with a palladium braze |
| US7771838B1 (en) * | 2004-10-12 | 2010-08-10 | Boston Scientific Neuromodulation Corporation | Hermetically bonding ceramic and titanium with a Ti-Pd braze interface |
-
1984
- 1984-09-29 JP JP20510784A patent/JPS6182996A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6182996A (en) | 1986-04-26 |
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