JPS6182452A - 電子部品の製造方法 - Google Patents

電子部品の製造方法

Info

Publication number
JPS6182452A
JPS6182452A JP59204729A JP20472984A JPS6182452A JP S6182452 A JPS6182452 A JP S6182452A JP 59204729 A JP59204729 A JP 59204729A JP 20472984 A JP20472984 A JP 20472984A JP S6182452 A JPS6182452 A JP S6182452A
Authority
JP
Japan
Prior art keywords
lead frame
oxide film
heat sink
exposed portion
appearance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59204729A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422340B2 (enExample
Inventor
Kazuhito Horikawa
和仁 堀川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP59204729A priority Critical patent/JPS6182452A/ja
Publication of JPS6182452A publication Critical patent/JPS6182452A/ja
Publication of JPH0422340B2 publication Critical patent/JPH0422340B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/045—
    • H10W72/0198—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP59204729A 1984-09-29 1984-09-29 電子部品の製造方法 Granted JPS6182452A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59204729A JPS6182452A (ja) 1984-09-29 1984-09-29 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59204729A JPS6182452A (ja) 1984-09-29 1984-09-29 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS6182452A true JPS6182452A (ja) 1986-04-26
JPH0422340B2 JPH0422340B2 (enExample) 1992-04-16

Family

ID=16495342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59204729A Granted JPS6182452A (ja) 1984-09-29 1984-09-29 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS6182452A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10478880B2 (en) 2015-04-28 2019-11-19 Aws Schaefer Technologie Gmbh Method for induction bend forming a compression-resistant pipe having a large wall thickness and a large diameter

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10478880B2 (en) 2015-04-28 2019-11-19 Aws Schaefer Technologie Gmbh Method for induction bend forming a compression-resistant pipe having a large wall thickness and a large diameter

Also Published As

Publication number Publication date
JPH0422340B2 (enExample) 1992-04-16

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