JPS617656A - マルチチップパッケ−ジ - Google Patents

マルチチップパッケ−ジ

Info

Publication number
JPS617656A
JPS617656A JP59128918A JP12891884A JPS617656A JP S617656 A JPS617656 A JP S617656A JP 59128918 A JP59128918 A JP 59128918A JP 12891884 A JP12891884 A JP 12891884A JP S617656 A JPS617656 A JP S617656A
Authority
JP
Japan
Prior art keywords
pad
wiring
substrate
seal ring
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59128918A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365662B2 (enExample
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59128918A priority Critical patent/JPS617656A/ja
Publication of JPS617656A publication Critical patent/JPS617656A/ja
Publication of JPH0365662B2 publication Critical patent/JPH0365662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP59128918A 1984-06-22 1984-06-22 マルチチップパッケ−ジ Granted JPS617656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59128918A JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59128918A JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Publications (2)

Publication Number Publication Date
JPS617656A true JPS617656A (ja) 1986-01-14
JPH0365662B2 JPH0365662B2 (enExample) 1991-10-14

Family

ID=14996590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59128918A Granted JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Country Status (1)

Country Link
JP (1) JPS617656A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03113852U (enExample) * 1990-03-09 1991-11-21
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
US5315486A (en) * 1991-12-16 1994-05-24 General Electric Company Hermetically packaged HDI electronic system
US5359496A (en) * 1989-12-21 1994-10-25 General Electric Company Hermetic high density interconnected electronic system
US7120069B2 (en) * 1991-02-28 2006-10-10 Hitachi, Ltd. Electronic circuit package
JP2008502155A (ja) * 2004-06-04 2008-01-24 イーストマン コダック カンパニー イメージセンサの金属配線

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5359496A (en) * 1989-12-21 1994-10-25 General Electric Company Hermetic high density interconnected electronic system
JPH03113852U (enExample) * 1990-03-09 1991-11-21
US7120069B2 (en) * 1991-02-28 2006-10-10 Hitachi, Ltd. Electronic circuit package
US5315486A (en) * 1991-12-16 1994-05-24 General Electric Company Hermetically packaged HDI electronic system
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
WO1994007350A1 (en) * 1992-09-17 1994-03-31 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
JP2008502155A (ja) * 2004-06-04 2008-01-24 イーストマン コダック カンパニー イメージセンサの金属配線
JP4856064B2 (ja) * 2004-06-04 2012-01-18 オムニヴィジョン テクノロジーズ インコーポレイテッド イメージセンサの金属配線

Also Published As

Publication number Publication date
JPH0365662B2 (enExample) 1991-10-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term