JPS617656A - マルチチップパッケ−ジ - Google Patents

マルチチップパッケ−ジ

Info

Publication number
JPS617656A
JPS617656A JP59128918A JP12891884A JPS617656A JP S617656 A JPS617656 A JP S617656A JP 59128918 A JP59128918 A JP 59128918A JP 12891884 A JP12891884 A JP 12891884A JP S617656 A JPS617656 A JP S617656A
Authority
JP
Japan
Prior art keywords
pad
wiring
substrate
seal ring
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59128918A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365662B2 (enExample
Inventor
Yoshitaka Fukuoka
義孝 福岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59128918A priority Critical patent/JPS617656A/ja
Publication of JPS617656A publication Critical patent/JPS617656A/ja
Publication of JPH0365662B2 publication Critical patent/JPH0365662B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/60
    • H10W70/611
    • H10W70/685
    • H10W72/07551
    • H10W72/50
    • H10W72/884
    • H10W90/734
    • H10W90/754

Landscapes

  • Wire Bonding (AREA)
JP59128918A 1984-06-22 1984-06-22 マルチチップパッケ−ジ Granted JPS617656A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59128918A JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59128918A JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Publications (2)

Publication Number Publication Date
JPS617656A true JPS617656A (ja) 1986-01-14
JPH0365662B2 JPH0365662B2 (enExample) 1991-10-14

Family

ID=14996590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59128918A Granted JPS617656A (ja) 1984-06-22 1984-06-22 マルチチップパッケ−ジ

Country Status (1)

Country Link
JP (1) JPS617656A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03113852U (enExample) * 1990-03-09 1991-11-21
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
US5315486A (en) * 1991-12-16 1994-05-24 General Electric Company Hermetically packaged HDI electronic system
US5359496A (en) * 1989-12-21 1994-10-25 General Electric Company Hermetic high density interconnected electronic system
US7120069B2 (en) * 1991-02-28 2006-10-10 Hitachi, Ltd. Electronic circuit package
JP2008502155A (ja) * 2004-06-04 2008-01-24 イーストマン コダック カンパニー イメージセンサの金属配線

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5359496A (en) * 1989-12-21 1994-10-25 General Electric Company Hermetic high density interconnected electronic system
JPH03113852U (enExample) * 1990-03-09 1991-11-21
US7120069B2 (en) * 1991-02-28 2006-10-10 Hitachi, Ltd. Electronic circuit package
US5315486A (en) * 1991-12-16 1994-05-24 General Electric Company Hermetically packaged HDI electronic system
US5280413A (en) * 1992-09-17 1994-01-18 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
WO1994007350A1 (en) * 1992-09-17 1994-03-31 Ceridian Corporation Hermetically sealed circuit modules having conductive cap anchors
JP2008502155A (ja) * 2004-06-04 2008-01-24 イーストマン コダック カンパニー イメージセンサの金属配線
JP4856064B2 (ja) * 2004-06-04 2012-01-18 オムニヴィジョン テクノロジーズ インコーポレイテッド イメージセンサの金属配線

Also Published As

Publication number Publication date
JPH0365662B2 (enExample) 1991-10-14

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term