JPS6160846A - 半導体装置用銅合金リ−ド材 - Google Patents

半導体装置用銅合金リ−ド材

Info

Publication number
JPS6160846A
JPS6160846A JP59183594A JP18359484A JPS6160846A JP S6160846 A JPS6160846 A JP S6160846A JP 59183594 A JP59183594 A JP 59183594A JP 18359484 A JP18359484 A JP 18359484A JP S6160846 A JPS6160846 A JP S6160846A
Authority
JP
Japan
Prior art keywords
lead material
semiconductor device
lead
copper alloy
conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59183594A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6254852B2 (Sortimente
Inventor
Rensei Futatsuka
二塚　錬成
Tadao Sakakibara
直男 榊原
Shunichi Chiba
俊一 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP59183594A priority Critical patent/JPS6160846A/ja
Priority to DE19853530736 priority patent/DE3530736A1/de
Publication of JPS6160846A publication Critical patent/JPS6160846A/ja
Priority to US07/032,976 priority patent/US4750029A/en
Publication of JPS6254852B2 publication Critical patent/JPS6254852B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper

Landscapes

  • Conductive Materials (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP59183594A 1984-08-31 1984-08-31 半導体装置用銅合金リ−ド材 Granted JPS6160846A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP59183594A JPS6160846A (ja) 1984-08-31 1984-08-31 半導体装置用銅合金リ−ド材
DE19853530736 DE3530736A1 (de) 1984-08-31 1985-08-28 Leitermaterial auf kupferbasis fuer anschluesse von halbleitervorrichtungen
US07/032,976 US4750029A (en) 1984-08-31 1987-03-26 Copper base lead material for leads of semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59183594A JPS6160846A (ja) 1984-08-31 1984-08-31 半導体装置用銅合金リ−ド材

Publications (2)

Publication Number Publication Date
JPS6160846A true JPS6160846A (ja) 1986-03-28
JPS6254852B2 JPS6254852B2 (Sortimente) 1987-11-17

Family

ID=16138548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59183594A Granted JPS6160846A (ja) 1984-08-31 1984-08-31 半導体装置用銅合金リ−ド材

Country Status (3)

Country Link
US (1) US4750029A (Sortimente)
JP (1) JPS6160846A (Sortimente)
DE (1) DE3530736A1 (Sortimente)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6160846A (ja) * 1984-08-31 1986-03-28 Tamagawa Kikai Kinzoku Kk 半導体装置用銅合金リ−ド材
JPS6396947A (ja) * 1986-10-13 1988-04-27 Mitsubishi Electric Corp 半導体装置用リ−ドフレ−ム
JP2511289B2 (ja) * 1988-03-30 1996-06-26 株式会社日立製作所 半導体装置
JPH0793400B2 (ja) * 1990-03-06 1995-10-09 株式会社東芝 半導体装置
US5508001A (en) * 1992-11-13 1996-04-16 Mitsubishi Sindoh Co., Ltd. Copper based alloy for electrical and electronic parts excellent in hot workability and blankability
US6455937B1 (en) 1998-03-20 2002-09-24 James A. Cunningham Arrangement and method for improved downward scaling of higher conductivity metal-based interconnects
US6241831B1 (en) 1999-06-07 2001-06-05 Waterbury Rolling Mills, Inc. Copper alloy
US6521532B1 (en) 1999-07-22 2003-02-18 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance
US6551872B1 (en) 1999-07-22 2003-04-22 James A. Cunningham Method for making integrated circuit including interconnects with enhanced electromigration resistance using doped seed layer and integrated circuits produced thereby
US6441492B1 (en) 1999-09-10 2002-08-27 James A. Cunningham Diffusion barriers for copper interconnect systems
DE102015219183B4 (de) * 2015-10-05 2019-06-06 Infineon Technologies Ag Leistungshalbleiterbauelement, Halbleitermodul, Verfahren zum Verarbeiten eines Leistungshalbleiterbauelements

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2171697A (en) * 1939-03-09 1939-09-05 Mallory & Co Inc P R Alloy
JPS5853057A (ja) * 1981-09-24 1983-03-29 Hitachi Ltd スタイラスカ−トリツジの動特性自動測定装置
GB2123032B (en) * 1982-06-28 1985-10-02 Bicc Plc Copper-base alloys
JPS6160846A (ja) * 1984-08-31 1986-03-28 Tamagawa Kikai Kinzoku Kk 半導体装置用銅合金リ−ド材

Also Published As

Publication number Publication date
DE3530736C2 (Sortimente) 1987-09-24
JPS6254852B2 (Sortimente) 1987-11-17
US4750029A (en) 1988-06-07
DE3530736A1 (de) 1986-03-06

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees