JPS6159534B2 - - Google Patents

Info

Publication number
JPS6159534B2
JPS6159534B2 JP58052944A JP5294483A JPS6159534B2 JP S6159534 B2 JPS6159534 B2 JP S6159534B2 JP 58052944 A JP58052944 A JP 58052944A JP 5294483 A JP5294483 A JP 5294483A JP S6159534 B2 JPS6159534 B2 JP S6159534B2
Authority
JP
Japan
Prior art keywords
chip carrier
chip
wiring
layer
alumina ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58052944A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59178759A (ja
Inventor
Toshihiko Watari
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP58052944A priority Critical patent/JPS59178759A/ja
Priority to CA000450758A priority patent/CA1229155A/en
Priority to DE8484103423T priority patent/DE3479463D1/de
Priority to EP84103423A priority patent/EP0120500B1/en
Publication of JPS59178759A publication Critical patent/JPS59178759A/ja
Priority to US06/758,951 priority patent/US4652970A/en
Priority to US06/896,348 priority patent/US4744007A/en
Publication of JPS6159534B2 publication Critical patent/JPS6159534B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP58052944A 1983-03-29 1983-03-29 マルチチツプパツケ−ジ Granted JPS59178759A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP58052944A JPS59178759A (ja) 1983-03-29 1983-03-29 マルチチツプパツケ−ジ
CA000450758A CA1229155A (en) 1983-03-29 1984-03-28 High density lsi package for logic circuits
DE8484103423T DE3479463D1 (en) 1983-03-29 1984-03-28 High density lsi package for logic circuits
EP84103423A EP0120500B1 (en) 1983-03-29 1984-03-28 High density lsi package for logic circuits
US06/758,951 US4652970A (en) 1983-03-29 1985-07-25 High density LSI package for logic circuits
US06/896,348 US4744007A (en) 1983-03-29 1986-08-14 High density LSI package for logic circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58052944A JPS59178759A (ja) 1983-03-29 1983-03-29 マルチチツプパツケ−ジ

Publications (2)

Publication Number Publication Date
JPS59178759A JPS59178759A (ja) 1984-10-11
JPS6159534B2 true JPS6159534B2 (Direct) 1986-12-17

Family

ID=12928975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58052944A Granted JPS59178759A (ja) 1983-03-29 1983-03-29 マルチチツプパツケ−ジ

Country Status (1)

Country Link
JP (1) JPS59178759A (Direct)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6269648A (ja) * 1985-09-24 1987-03-30 Nec Corp 多層配線基板
JP2561867Y2 (ja) * 1991-09-06 1998-02-04 株式会社三協精機製作所 小型発音装置
US5285018A (en) * 1992-10-02 1994-02-08 International Business Machines Corporation Power and signal distribution in electronic packaging

Also Published As

Publication number Publication date
JPS59178759A (ja) 1984-10-11

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