JPS6156879B2 - - Google Patents
Info
- Publication number
- JPS6156879B2 JPS6156879B2 JP11385078A JP11385078A JPS6156879B2 JP S6156879 B2 JPS6156879 B2 JP S6156879B2 JP 11385078 A JP11385078 A JP 11385078A JP 11385078 A JP11385078 A JP 11385078A JP S6156879 B2 JPS6156879 B2 JP S6156879B2
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive resist
- metal film
- pattern
- forming
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 16
- 239000010931 gold Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 238000007740 vapor deposition Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 description 12
- 238000005530 etching Methods 0.000 description 12
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11385078A JPS5541708A (en) | 1978-09-16 | 1978-09-16 | Method of fabricating multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11385078A JPS5541708A (en) | 1978-09-16 | 1978-09-16 | Method of fabricating multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5541708A JPS5541708A (en) | 1980-03-24 |
| JPS6156879B2 true JPS6156879B2 (ko) | 1986-12-04 |
Family
ID=14622621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11385078A Granted JPS5541708A (en) | 1978-09-16 | 1978-09-16 | Method of fabricating multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5541708A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0236984U (ko) * | 1988-09-06 | 1990-03-12 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3371592D1 (en) * | 1983-06-01 | 1987-06-19 | Ibm Deutschland | Production method of printed circuits with one conductive layer |
| JPH0812720B2 (ja) * | 1992-05-29 | 1996-02-07 | 東邦瓦斯株式会社 | ガス遮断装置 |
-
1978
- 1978-09-16 JP JP11385078A patent/JPS5541708A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0236984U (ko) * | 1988-09-06 | 1990-03-12 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5541708A (en) | 1980-03-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR920005070B1 (ko) | 양면배선기판의 제조방법 | |
| JP4984855B2 (ja) | 薄膜チップ抵抗器、薄膜チップコンデンサおよび薄膜チップインダクタの製造方法 | |
| US4735694A (en) | Method for manufacture of printed circuit boards | |
| JPS6156879B2 (ko) | ||
| US3649392A (en) | Thin-film circuit formation | |
| JPH0139236B2 (ko) | ||
| JPS6155797B2 (ko) | ||
| JP2002076575A (ja) | 半導体装置用基板の製造方法 | |
| JPH08107263A (ja) | プリント配線板の製造方法 | |
| JPH05145230A (ja) | ガラスセラミツク基板の配線パターン形成方法 | |
| KR0162967B1 (ko) | 알루미나 기판 상에 박/후막 저항을 동시에 제조하는 방법 | |
| JPH0563340A (ja) | 機能素子を有する配線板の製造法 | |
| JPH05259615A (ja) | 回路導体の形成方法 | |
| JPH07254534A (ja) | 電子部品の外部電極形成方法 | |
| JPH07161712A (ja) | パターン形成方法 | |
| JPH03225894A (ja) | プリント配線板の製造方法 | |
| JPS6155799B2 (ko) | ||
| JPH0143476B2 (ko) | ||
| JPS6285496A (ja) | 回路基板の製造方法 | |
| JP2517277B2 (ja) | プリント配線板の製造方法 | |
| JPS6155800B2 (ko) | ||
| JPH05251848A (ja) | プリント配線板の製造方法 | |
| JPS6097691A (ja) | 厚膜薄膜配線基板の製造方法 | |
| JPS6123390A (ja) | 回路基板およびその製造方法 | |
| JPH04363093A (ja) | プリント基板の製造方法 |