JPS6154169B2 - - Google Patents
Info
- Publication number
- JPS6154169B2 JPS6154169B2 JP55121979A JP12197980A JPS6154169B2 JP S6154169 B2 JPS6154169 B2 JP S6154169B2 JP 55121979 A JP55121979 A JP 55121979A JP 12197980 A JP12197980 A JP 12197980A JP S6154169 B2 JPS6154169 B2 JP S6154169B2
- Authority
- JP
- Japan
- Prior art keywords
- knife
- polishing
- ridge line
- ultramicrotome
- chemical polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/28—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools
- B23P15/40—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass cutting tools shearing tools
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
- G01N1/06—Devices for withdrawing samples in the solid state, e.g. by cutting providing a thin slice, e.g. microtome
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/02—Devices for withdrawing samples
- G01N1/04—Devices for withdrawing samples in the solid state, e.g. by cutting
- G01N1/06—Devices for withdrawing samples in the solid state, e.g. by cutting providing a thin slice, e.g. microtome
- G01N2001/061—Blade details
Landscapes
- Analytical Chemistry (AREA)
- Immunology (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55121979A JPS5746141A (en) | 1980-09-03 | 1980-09-03 | Knife for ultramicrotome formed of alpha-alumina single crystal and manufacture thereof |
PCT/JP1981/000177 WO1982000890A1 (en) | 1980-09-03 | 1981-08-14 | Ultramicrotome knife of alpha-alumina single crystal |
EP19810902249 EP0059220A4 (en) | 1980-09-03 | 1981-08-14 | ULTRAMICROTOME KNIFE COMPOSED OF AN ALPHA-ALUMIN MONOCRYSTAL. |
IT8123709A IT8123709A0 (it) | 1980-09-03 | 1981-09-01 | Lama di monocristallo di alfa allumina per l'ultramicrotomia. |
CA000385042A CA1163888A (en) | 1980-09-03 | 1981-09-02 | KNIFE FOR ULTRAMICROTOMY OF .alpha.-ALUMINA SINGLE CRYSTAL |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP55121979A JPS5746141A (en) | 1980-09-03 | 1980-09-03 | Knife for ultramicrotome formed of alpha-alumina single crystal and manufacture thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5746141A JPS5746141A (en) | 1982-03-16 |
JPS6154169B2 true JPS6154169B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1986-11-21 |
Family
ID=14824571
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55121979A Granted JPS5746141A (en) | 1980-09-03 | 1980-09-03 | Knife for ultramicrotome formed of alpha-alumina single crystal and manufacture thereof |
Country Status (5)
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0111290A2 (en) * | 1982-12-08 | 1984-06-20 | Du Pont | Corundum cutting element for a histological knife. |
US6003419A (en) * | 1997-02-28 | 1999-12-21 | Nikon Corporation | Microcutting device and incising method |
CN110449847B (zh) * | 2019-05-22 | 2021-02-09 | 长春理工大学 | 一种铝合金集雾表面结构及其制备方法 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3834265A (en) * | 1973-02-16 | 1974-09-10 | Gillette Co | Ceramic cutting instruments |
-
1980
- 1980-09-03 JP JP55121979A patent/JPS5746141A/ja active Granted
-
1981
- 1981-08-14 WO PCT/JP1981/000177 patent/WO1982000890A1/ja not_active Application Discontinuation
- 1981-08-14 EP EP19810902249 patent/EP0059220A4/en not_active Withdrawn
- 1981-09-01 IT IT8123709A patent/IT8123709A0/it unknown
- 1981-09-02 CA CA000385042A patent/CA1163888A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
CA1163888A (en) | 1984-03-20 |
IT8123709A0 (it) | 1981-09-01 |
EP0059220A1 (en) | 1982-09-08 |
WO1982000890A1 (en) | 1982-03-18 |
EP0059220A4 (en) | 1983-01-14 |
JPS5746141A (en) | 1982-03-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI249785B (en) | Method of chamfering semiconductor wafer | |
US4697489A (en) | Ultramicrotome tool | |
US4581969A (en) | Ultramicrotome diamond knife | |
WO2003094215A1 (en) | Semiconductor wafer manufacturing method and wafer | |
JP2006222453A (ja) | シリコンウエーハの製造方法及びシリコンウエーハ並びにsoiウエーハ | |
DE202009002734U1 (de) | Nitridhalbleiterbauelement | |
KR20060017614A (ko) | 실리콘 웨이퍼의 가공 방법 | |
CN104136182B (zh) | 划线轮及其制造方法 | |
CN109290853B (zh) | 一种超薄蓝宝石片的制备方法 | |
JP2972830B1 (ja) | 磁気記録媒体用ガラス基板の製造方法 | |
JPS6154169B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JPH03177023A (ja) | エピタキシャル・ウェーハの調製方法 | |
JP3619442B2 (ja) | テープクリーナ | |
JPS59112249A (ja) | 超ミクロト−ムナイフ用ダイヤモンド切断要素 | |
JPH05172709A (ja) | ミクロトーム用ダイヤモンドナイフおよびその製造方法 | |
JPS5811829A (ja) | 人工のシリコン単結晶からなるミクロト−ム及び超ミクロト−ム用ナイフ並びにその製造法 | |
JPH0513388A (ja) | 半導体ウエーハの製造方法 | |
JP2003260641A (ja) | ウエハー加工方法 | |
Turley et al. | The nature of mechanically polished surfaces of copper: polishing with fine diamond abrasives | |
JP4952474B2 (ja) | 断面観察試料の作製方法 | |
JPH10244449A (ja) | GaAsウェハの加工方法 | |
JPS6320668B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
JP2003100575A (ja) | 半導体ウェハの劈開方法および半導体ウェハ | |
JPS59112250A (ja) | 組織学ナイフ用コランダム切断要素 | |
JP2001110755A (ja) | 半導体チップ製造方法 |