JPS6149816B2 - - Google Patents

Info

Publication number
JPS6149816B2
JPS6149816B2 JP60043891A JP4389185A JPS6149816B2 JP S6149816 B2 JPS6149816 B2 JP S6149816B2 JP 60043891 A JP60043891 A JP 60043891A JP 4389185 A JP4389185 A JP 4389185A JP S6149816 B2 JPS6149816 B2 JP S6149816B2
Authority
JP
Japan
Prior art keywords
whisker
lead
semiconductor substrate
metal layer
active region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP60043891A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6144448A (ja
Inventor
Toshuki Shikanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP60043891A priority Critical patent/JPS6144448A/ja
Publication of JPS6144448A publication Critical patent/JPS6144448A/ja
Publication of JPS6149816B2 publication Critical patent/JPS6149816B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
JP60043891A 1985-03-06 1985-03-06 半導体装置 Granted JPS6144448A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60043891A JPS6144448A (ja) 1985-03-06 1985-03-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60043891A JPS6144448A (ja) 1985-03-06 1985-03-06 半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3256377A Division JPS53117376A (en) 1977-03-23 1977-03-23 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6144448A JPS6144448A (ja) 1986-03-04
JPS6149816B2 true JPS6149816B2 (en, 2012) 1986-10-31

Family

ID=12676325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60043891A Granted JPS6144448A (ja) 1985-03-06 1985-03-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS6144448A (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02308752A (ja) * 1989-05-23 1990-12-21 Nakagawa Tekkosho:Kk 凍結魚体の表面処理方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5924282A (ja) * 1982-07-31 1984-02-07 Anritsu Corp 金属検出装置

Also Published As

Publication number Publication date
JPS6144448A (ja) 1986-03-04

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