JPS6146097A - 多層回路基板 - Google Patents
多層回路基板Info
- Publication number
- JPS6146097A JPS6146097A JP59168362A JP16836284A JPS6146097A JP S6146097 A JPS6146097 A JP S6146097A JP 59168362 A JP59168362 A JP 59168362A JP 16836284 A JP16836284 A JP 16836284A JP S6146097 A JPS6146097 A JP S6146097A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- layer
- tungsten
- circuit board
- multilayer circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 35
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 25
- 229910052721 tungsten Inorganic materials 0.000 claims description 25
- 239000010937 tungsten Substances 0.000 claims description 25
- 239000000463 material Substances 0.000 claims description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 16
- 239000011521 glass Substances 0.000 claims description 16
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical group [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 15
- 229910052750 molybdenum Inorganic materials 0.000 claims description 14
- 239000011733 molybdenum Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 7
- 229910000510 noble metal Inorganic materials 0.000 claims description 6
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 38
- 239000002245 particle Substances 0.000 description 11
- 239000000758 substrate Substances 0.000 description 8
- 238000010304 firing Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052707 ruthenium Inorganic materials 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000000306 component Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59168362A JPS6146097A (ja) | 1984-08-10 | 1984-08-10 | 多層回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59168362A JPS6146097A (ja) | 1984-08-10 | 1984-08-10 | 多層回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6146097A true JPS6146097A (ja) | 1986-03-06 |
| JPH0137878B2 JPH0137878B2 (enrdf_load_stackoverflow) | 1989-08-09 |
Family
ID=15866674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59168362A Granted JPS6146097A (ja) | 1984-08-10 | 1984-08-10 | 多層回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6146097A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63283558A (ja) * | 1987-05-13 | 1988-11-21 | Shoei Pack:Kk | 貝類のレトルト食品製造法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873195A (ja) * | 1981-10-28 | 1983-05-02 | 株式会社日立製作所 | セラミツク多層配線基板 |
| JPS58133826A (ja) * | 1982-01-28 | 1983-08-09 | ロレアル | 脂肪酸又はタンパク質縮合物と、ポリオキシエチレンステロールと、ホスフアチドを主成分とする新規な乳化系、及び該系を含有する化粧品又は薬品組成物 |
-
1984
- 1984-08-10 JP JP59168362A patent/JPS6146097A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5873195A (ja) * | 1981-10-28 | 1983-05-02 | 株式会社日立製作所 | セラミツク多層配線基板 |
| JPS58133826A (ja) * | 1982-01-28 | 1983-08-09 | ロレアル | 脂肪酸又はタンパク質縮合物と、ポリオキシエチレンステロールと、ホスフアチドを主成分とする新規な乳化系、及び該系を含有する化粧品又は薬品組成物 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63283558A (ja) * | 1987-05-13 | 1988-11-21 | Shoei Pack:Kk | 貝類のレトルト食品製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0137878B2 (enrdf_load_stackoverflow) | 1989-08-09 |
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