JPS6144640A - 金属箔張り積層板の製造における下面金属箔の汚損防止方法 - Google Patents
金属箔張り積層板の製造における下面金属箔の汚損防止方法Info
- Publication number
- JPS6144640A JPS6144640A JP59168211A JP16821184A JPS6144640A JP S6144640 A JPS6144640 A JP S6144640A JP 59168211 A JP59168211 A JP 59168211A JP 16821184 A JP16821184 A JP 16821184A JP S6144640 A JPS6144640 A JP S6144640A
- Authority
- JP
- Japan
- Prior art keywords
- metal foil
- foil
- resin
- metallic
- laminate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011888 foil Substances 0.000 title claims description 70
- 238000000034 method Methods 0.000 title claims description 12
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 64
- 239000002184 metal Substances 0.000 claims description 64
- 229920005989 resin Polymers 0.000 claims description 37
- 239000011347 resin Substances 0.000 claims description 37
- 239000002390 adhesive tape Substances 0.000 claims description 19
- 239000007788 liquid Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 3
- 238000011109 contamination Methods 0.000 claims description 2
- 238000001723 curing Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- 238000010030 laminating Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000123 paper Substances 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 229920006337 unsaturated polyester resin Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005470 impregnation Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920001567 vinyl ester resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000003287 bathing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59168211A JPS6144640A (ja) | 1984-08-10 | 1984-08-10 | 金属箔張り積層板の製造における下面金属箔の汚損防止方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59168211A JPS6144640A (ja) | 1984-08-10 | 1984-08-10 | 金属箔張り積層板の製造における下面金属箔の汚損防止方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6144640A true JPS6144640A (ja) | 1986-03-04 |
| JPH0472692B2 JPH0472692B2 (enrdf_load_stackoverflow) | 1992-11-18 |
Family
ID=15863843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59168211A Granted JPS6144640A (ja) | 1984-08-10 | 1984-08-10 | 金属箔張り積層板の製造における下面金属箔の汚損防止方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6144640A (enrdf_load_stackoverflow) |
-
1984
- 1984-08-10 JP JP59168211A patent/JPS6144640A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0472692B2 (enrdf_load_stackoverflow) | 1992-11-18 |
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