JPS6144640A - Method of preventing fouling of lower-surface metallic foil in manufacture of metallic-foil lined laminated board - Google Patents

Method of preventing fouling of lower-surface metallic foil in manufacture of metallic-foil lined laminated board

Info

Publication number
JPS6144640A
JPS6144640A JP59168211A JP16821184A JPS6144640A JP S6144640 A JPS6144640 A JP S6144640A JP 59168211 A JP59168211 A JP 59168211A JP 16821184 A JP16821184 A JP 16821184A JP S6144640 A JPS6144640 A JP S6144640A
Authority
JP
Japan
Prior art keywords
metal foil
foil
resin
metallic
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59168211A
Other languages
Japanese (ja)
Other versions
JPH0472692B2 (en
Inventor
文夫 山口
久永 昭紀
稲見 久男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP59168211A priority Critical patent/JPS6144640A/en
Publication of JPS6144640A publication Critical patent/JPS6144640A/en
Publication of JPH0472692B2 publication Critical patent/JPH0472692B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 皮ユ上至且朋分立 本発明は金属箔張り積層板の製造法、特に複数の長尺基
材を連続的に搬送しながら基材の含浸、金属箔の張り合
わせ、硬化を連続的に行う方法において下面金属箔両側
端より溢れ出る樹脂により下面金属箔が汚損されるのを
防止するための方法に関するものである。
[Detailed Description of the Invention] The present invention relates to a method for manufacturing a metal foil-clad laminate, in particular impregnation of the base material while continuously conveying a plurality of long base materials, lamination of the metal foil, The present invention relates to a method for preventing the lower metal foil from being soiled by resin overflowing from both ends of the lower metal foil in a continuous curing method.

従圭■肢玉 紙、ガラスマット、ガラスクロス等の基材に熱硬化性樹
脂を含浸し、これを複数枚積層してその片面または両面
に銅箔の如き金属箔を張り合わせた金属箔張り積層板は
プリント配線用基板等として使用されているが、従来、
これらの積層板はその製造法として基材に樹脂フェスを
含浸し、乾燥して得られるブリプレラグ数枚と金属箔と
を重ねてプレスで加熱加圧成型するバッチ式製造法が採
用されて来た。
■Metal foil laminate in which a base material such as paper, glass mat, or glass cloth is impregnated with thermosetting resin, and multiple sheets are laminated and metal foil such as copper foil is laminated on one or both sides. Boards are used as printed wiring boards, etc., but conventionally,
These laminates have been manufactured using a batch method in which the base material is impregnated with resin face, dried, and then several pieces of buripurerug and metal foil are stacked and molded under heat and pressure in a press. .

ところが、最近、長尺の基材を搬送しながら樹脂の含浸
、積層、金属箔の張り合わせ、硬化等を行う連続式製造
法が開発され(特開昭55−4838号、同57−57
626号、同59−55738号など参照)注目されて
いる。
However, recently, a continuous manufacturing method has been developed in which resin impregnation, lamination, metal foil lamination, curing, etc. are carried out while conveying a long base material (Japanese Patent Application Laid-open Nos. 55-4838 and 57-57).
626, 59-55738, etc.).

これら連続式製造法は含浸樹脂として品温で液状で、硬
化に際し気体や液体の副生物を発生しない硬化性樹脂、
例えば不飽和ポリエステル樹脂やエポキシアクリレート
樹脂(ビニルエステル樹脂)ジアリルフタレート樹脂、
エポキシ樹脂等が用いられ、樹脂液を含浸した基材は積
層され、片面張り合わせの場合には一方の側に金属箔、
他方の側にカバーシート、両面張り合わせの場合には両
側に金属箔を張り合わされ、その間に挟持された状態で
硬化炉を通過し実質上、無圧で硬化される。
These continuous manufacturing methods produce curable resins that are liquid at temperature as impregnated resins and do not generate gas or liquid byproducts during curing.
For example, unsaturated polyester resin, epoxy acrylate resin (vinyl ester resin), diallyl phthalate resin,
Epoxy resin or the like is used, and the base materials impregnated with resin liquid are laminated, and in the case of single-sided lamination, metal foil is placed on one side.
A cover sheet is placed on the other side, and in the case of double-sided lamination, metal foil is pasted on both sides, and the sheet is passed through a curing oven while being sandwiched between them, and is cured substantially without pressure.

ところで硬化炉に入った未硬化の積層板は、硬化の初期
、すなわちラミネートロール部より硬化炉の入口側にお
いては樹脂が未だ流動状態にあり、積層板の平面に対し
垂直方向から殆ど圧力を受けないとしても未硬化積層板
が実質上、水平を保って進行するときに樹脂は積層板の
両端に向かって流動する傾向を有する。そのため基材の
上下の両面に金属箔を張り合わせるときには、流動した
樹脂が積層板の両端に流れ上下の金属箔をほぼ同じ巾と
した場合には下面の金属箔より樹脂が溢れ、これが下面
金属箔の裏面側に廻って下面全圧箔面を汚染し、ひいて
は製品自体の品質の低下を招くという問題があった。
By the way, when an uncured laminate enters the curing oven, the resin is still in a fluid state at the beginning of curing, that is, from the laminating roll section to the entrance of the curing oven, and the laminate is subjected to almost no pressure in the direction perpendicular to the plane of the laminate. If not, the resin tends to flow toward the ends of the laminate as the uncured laminate advances substantially horizontally. Therefore, when attaching metal foil to both the upper and lower surfaces of the base material, the fluidized resin will flow to both ends of the laminate and if the upper and lower metal foils are made to have approximately the same width, the resin will overflow from the lower metal foil, and this will cause the resin to overflow from the lower metal foil. There is a problem in that the foil moves to the back side of the foil and contaminates the lower full-pressure foil surface, leading to a deterioration in the quality of the product itself.

、B (”−1しよ゛と る、q白 木発明は上述の如き実情に鑑み、下面金属箔の両端部に
粘着テープを利用することにより前記下面金属箔の両側
端より溢れ出る樹脂によって惹起される下面金属箔自体
の汚損を防止せんとするものである。
, B ("-1"), Q Shiraki's invention, in view of the above-mentioned circumstances, utilizes adhesive tape on both ends of the lower metal foil to prevent the resin from overflowing from both ends of the lower metal foil. This is intended to prevent the lower metal foil itself from becoming contaminated.

皿且謔t″° るための− すなわち本発明の特徴とするところは、前記金属箔張り
積層板の製造において、その未硬化積層板の少なくとも
張り合わせ部より硬化の初期に至る一定長さにわたり下
面金属箔の両側端部の上面または/および下面に金属箔
の両側端よりやや外方に張り出した幅をもって粘着テー
プを添着しておくことにある。
In other words, a feature of the present invention is that, in the production of the metal foil-clad laminate, the lower surface of the uncured laminate is removed over a certain length from at least the bonded portion of the uncured laminate until the initial stage of curing. The purpose is to attach adhesive tapes to the upper and/or lower surfaces of both ends of the metal foil with a width extending slightly outward from both ends of the metal foil.

こ\で添着は、あらかじめ下面金属箔の両側端の上面ま
たは下面もしくは上下両面に所要の重合部分をもって添
着しておいてもよく、また、張り合わせた時に下面金属
箔の送り込みに間開させて同時に送り込み、添着せしめ
るようにしてもよい。
In this case, the adhesive may be attached in advance to the upper or lower surface of both ends of the lower metal foil, or to both the upper and lower surfaces, with the required overlapping parts, or when laminated together, it may be attached at the same time by leaving a gap between the feeding of the lower metal foil. It may also be sent in and attached.

また、粘着テープは下面金属箔の両側端より溢れ出た未
硬化樹脂が下面金属箔の裏面側へ廻るのを阻止するよう
に定まればよく、例えば5〜lO値程度のもので十分で
ある。
In addition, the adhesive tape may be determined so as to prevent the uncured resin overflowing from both ends of the lower metal foil from going around to the back side of the lower metal foil; for example, a tape having a value of about 5 to 1 O is sufficient. .

そして、溢れ出た樹脂は粘着テープ上に保持さ″れて回
収されるかまたは硬化炉内を通過し、その後テープの剥
離または金属箔のトリミングにより除去される。
The overflowing resin is then collected on an adhesive tape or passed through a curing oven, and then removed by peeling off the tape or trimming the metal foil.

なお、下面金属箔下面にポリエステルフィルム等からな
るカバーシートが使用されている時は、カバーシートに
前記粘着テープをあらかじめ所要の位置に添着し金属箔
への添着とすることもできる。
Incidentally, when a cover sheet made of polyester film or the like is used on the lower surface of the lower metal foil, the adhesive tape can be attached to the cover sheet at a required position in advance and attached to the metal foil.

実施例 以下、さらに添付図面を参照し、本発明の具体的な態様
を詳述する。
EXAMPLES Hereinafter, specific embodiments of the present invention will be described in detail with further reference to the accompanying drawings.

第1図は本発明方法の実施状態を示した一例の斜視図で
あり、第2図は同方法を実施する積層板製造装置の概要
を示す。
FIG. 1 is a perspective view of an example of a state in which the method of the present invention is implemented, and FIG. 2 shows an outline of a laminate manufacturing apparatus that implements the method.

今、第2図において複数の長尺基材、例えば紙1がロー
ル巻2より繰り出され予備金浸浴3、乾燥室4を経て次
の樹脂含浸部5において前記硬化性樹脂で十分に含浸さ
れ、一対のラミネートロール6.6”からなるラミネー
トロール部においてその上下両面に接着剤が塗布された
各銅箔の如き金属箔7,7゛ と張り合わされ、積層板
Aとなって硬化炉8を通過しその間に硬化を受は硬化さ
れた積層板A°として爾後の工程に送られ図示しないカ
ッターによって所定寸法の製品に切断される。
Now, in FIG. 2, a plurality of long substrates, for example paper 1, are unwound from a roll 2, passed through a preliminary gold dipping bath 3, a drying chamber 4, and then sufficiently impregnated with the curable resin in the next resin impregnation section 5. In the laminating roll section consisting of a pair of laminating rolls 6.6'', each sheet of metal foil 7,7'', such as copper foil, coated with adhesive on both its upper and lower surfaces is laminated to form a laminate A, which is then sent to the curing furnace 8. The laminate A°, which is cured during the passage, is sent to a subsequent process as a cured laminate A°, and cut into products of predetermined dimensions by a cutter (not shown).

そして、上記の過程において下面側の金属箔7゜にはラ
ミネートロール部と硬化炉8の前半未硬化部との間に第
1図に示す如くその側端部に粘着テープ9がその一部所
要巾を重合させて添着されている。
In the above process, a portion of the adhesive tape 9 is required at the side end of the metal foil 7° on the lower side between the laminating roll part and the uncured part of the first half of the curing furnace 8, as shown in FIG. It is attached by polymerizing the width.

この粘着テープ9は図では一方の側のみをもって図示し
ているが、下面金属箔7゛の両側端部に添着されるもの
である。また、下面金属箔7゛の上下両面に添着されて
いるが、上下面の何れか一方の面のみとしてもよい。
Although only one side of the adhesive tape 9 is shown in the figure, it is attached to both ends of the lower metal foil 7'. Further, although it is attached to both the upper and lower surfaces of the lower metal foil 7', it may be attached to only one of the upper and lower surfaces.

なお、粘着テープ9の添着は下面金属箔7゛をロール巻
に巻装するときであっても差支えないが、接着剤を塗布
することを考慮すれば下面金属箔をラミネートロールに
送り込むときに同時に粘着テープを送り込み添着するの
が実際的である。
It should be noted that the adhesive tape 9 may be applied when the lower metal foil 7 is wound around the roll, but if adhesive is to be applied, the adhesive tape 9 may be applied at the same time as the lower metal foil is fed into the laminating roll. It is practical to send and attach adhesive tape.

図中、10.11はポリエステルフィルム等から1各ガ
バーシートである。
In the figure, reference numerals 10 and 11 are each cover sheet made of polyester film or the like.

かくして、ラミネートロール部で含浸基材と上下両面金
属箔7,7” とが合体され積層板Aを形成して硬化炉
8へ送給されるが、張り合わせ部より硬化炉の硬化初期
段階にある入口側までの間では樹脂12は未硬化状態と
して流動傾向を保有し、これにより樹脂12は流れて下
面金属箔7°の側端より溢れ出ようとする。
In this way, the impregnated base material and the upper and lower double-sided metal foils 7,7'' are combined at the laminating roll section to form the laminate A, which is sent to the curing furnace 8, but the laminating section is in the early stage of curing in the curing furnace. Up to the inlet side, the resin 12 is in an uncured state and has a tendency to flow, and as a result, the resin 12 flows and tends to overflow from the side edge of the lower metal foil 7°.

しかし、下面金属箔の両側端には、このとき粘着テープ
9が添着されているため樹脂は粘着テープ9上に止まり
、下面金属箔の裏面に廻るには至らず、下面金属箔7”
の裏面の汚換は防止される。
However, since the adhesive tape 9 is attached to both ends of the lower metal foil at this time, the resin remains on the adhesive tape 9 and does not reach the back side of the lower metal foil, and the resin does not reach the bottom metal foil 7''.
Contamination of the back side of is prevented.

カバーシートとしては、セロファンやポリニスレス箔、
アルミニウム箔などが使われるが金属箔をカバー用とし
て使う場合には、硬化後、その金属箔は剥離される。
As a cover sheet, cellophane or polyvinless foil,
Aluminum foil or the like is used, but if metal foil is used for the cover, the metal foil is peeled off after curing.

金属箔張として使用する金属箔としては電解銅箔、電解
鉄箔などの電解金属箔が好ましいが圧延鋼箔、圧延アル
ミ箔、圧延ステンレス箔なども使用できる。
As the metal foil used for the metal foil covering, electrolytic metal foils such as electrolytic copper foil and electrolytic iron foil are preferable, but rolled steel foil, rolled aluminum foil, rolled stainless steel foil, etc. can also be used.

金属箔張として使用する金属箔には接着剤を塗布し必要
なら該塗膜を加熱処理したものを用いることも出来る。
The metal foil used as the metal foil covering may be coated with an adhesive and, if necessary, the coated film may be heat-treated.

さらには、用いる接着剤が溶媒等の除去すべき成分を含
まず、かつ硬化反応過程で実質的に気体や液体等の反応
副生物を発生しないもので、実質無圧または低圧の条件
において成形可能なものが望ましい。たとえば不飽和ポ
リエステル樹脂、ビニルエステル樹脂、ジアリルフタレ
ート樹脂、エポキシ樹脂等をベースとした接着剤が好ま
しいものとしてあげられる。
Furthermore, the adhesive used does not contain solvents or other components that need to be removed, does not substantially generate reaction by-products such as gas or liquid during the curing reaction process, and can be molded under virtually no pressure or low pressure conditions. something is desirable. For example, adhesives based on unsaturated polyester resins, vinyl ester resins, diallyl phthalate resins, epoxy resins, etc. are preferred.

長尺シート基材としては、リンター紙やクラフト紙等の
紙又はガラス布、ガラス紙が好適である。
As the long sheet base material, paper such as linter paper or kraft paper, glass cloth, or glass paper is suitable.

またガラス混抄紙も使用できる。これらの基材を用いた
場合、樹脂と基材との間に強固な接合を形成することが
でき、強靭な製品を得ることが出来る。しかし本発明は
、これらに制限されるわけではなく、石綿布や有機繊維
、不織布等良く知られているものも適応可能である。
Glass mixed paper can also be used. When these base materials are used, a strong bond can be formed between the resin and the base material, and a strong product can be obtained. However, the present invention is not limited to these, and well-known fabrics such as asbestos cloth, organic fibers, and nonwoven fabrics can also be applied.

硬化性樹脂液としては、硬化反応の過程で気体や液体等
の反応副生物を実質的に発生しないものであって、かつ
硬化の際の成形圧が低圧、特に実質的に無圧の条件にお
いて可能なものであることが積層板を上記の方法によっ
て連続的に製造するために好ましい。例えば不飽和ポリ
エステル樹脂、ビニルステル樹脂、ジアリルフタレ−1
・樹脂、エポキシ樹脂等が適用可能である0品質および
コ 4゜スト、製造上の容易さ等から不飽和ポリエステ
ル樹脂、エポキシ樹脂等が特に好ましい。
The curable resin liquid must be one that does not substantially generate reaction by-products such as gas or liquid during the curing reaction, and that can be used under conditions where the molding pressure during curing is low, especially virtually no pressure. It is preferred that laminates be produced continuously by the method described above. For example, unsaturated polyester resin, vinyl stellate resin, diallylphthale-1
Unsaturated polyester resins, epoxy resins, etc. are particularly preferred from the viewpoint of low quality, cost, ease of production, etc.

光匪立訣果 本発明は以上のように、未硬化積層板の一定長さ部分に
おいて下面金属箔の両側端に粘着テープを添着せしめ、
移行させるものであるから、未硬化樹脂の流動傾向によ
り下面金属箔の側端より樹脂が溢れ出たとしても、これ
が粘着テープによって受は止められ、しかも粘着テープ
と下面金属箔の側端との間には全く間隙が形成されるこ
とがないため前記樹脂が下面金属箔の裏面に廻ることも
なく、浴出樹脂による下面金属箔の汚損を確実に防止す
ることができる。
As described above, the present invention attaches adhesive tape to both ends of the lower metal foil in a certain length portion of the uncured laminate,
Even if the resin overflows from the side edge of the lower metal foil due to the tendency of the uncured resin to flow, the adhesive tape will stop the resin from flowing out, and the adhesive tape and the side edge of the lower metal foil will Since no gap is formed therebetween, the resin does not flow to the back surface of the lower metal foil, and staining of the lower metal foil by the bathed resin can be reliably prevented.

また、上記の如く粘着テープによって浴出樹脂を受止す
るので、両面金属箔張りにおいても、下面金属箔を上面
金属箔より広巾とする必要がなく、上下両面共に同じサ
イズの金属箔の使用を可能とする。なお、浴出樹脂は粘
着テープ上に保持されるので、テープを剥離すれば除去
も容易である。
In addition, since the adhesive tape absorbs the bathed resin as described above, even when applying metal foil on both sides, there is no need to make the lower metal foil wider than the upper metal foil, and it is possible to use the same size metal foil on both the upper and lower surfaces. possible. Note that since the bathing resin is retained on the adhesive tape, it can be easily removed by peeling off the tape.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明方法の実施の一態様を示す部分斜視図、
第2−は同方法を利用した金属箔張り積層板の製造過程
を示す概要図である。 1は基材、5は樹脂含浸部、6.6゛はラミネートロー
ル、7は上面金属箔、7゛は下面金属箔、8は硬化炉、
9は粘着テープ、12は樹脂、Aは未硬化積層板である
。 特許出願人  鐘淵化学工業株式会社 、代 理 人 
 弁理士 赤 岡 辿□゛、夫 。 第1図
FIG. 1 is a partial perspective view showing one embodiment of the method of the present invention;
2- is a schematic diagram showing the manufacturing process of a metal foil-clad laminate using the same method. 1 is a base material, 5 is a resin-impregnated part, 6.6 is a laminating roll, 7 is a top metal foil, 7 is a bottom metal foil, 8 is a curing furnace,
9 is an adhesive tape, 12 is a resin, and A is an uncured laminate. Patent applicant Kanebuchi Chemical Industry Co., Ltd., agent
Patent attorney Taku Akaoka□゛, husband. Figure 1

Claims (1)

【特許請求の範囲】[Claims] 硬化性樹脂液を含浸した複数枚の基材からなる含浸基材
の少なく下面に金属箔を張り合わせ、硬化炉内において
連続的に硬化させることよりなる金属箔張り積層板の製
造において、硬化炉内を実質上平面を保って搬送される
未硬化積層板に対し、少なくとも張り合わせ部より硬化
の初期段階に至る一定の長さ部分にわたり下面金属箔の
両側端部の上面または/および下面に、金属箔の両側端
よりやや外方に張り出した幅をもって粘着テープを添着
せしめることを特徴とする金属箔張り積層板の製造にお
ける下面金属箔の汚損防止方法。
In the production of metal foil-clad laminates, which consist of a plurality of substrates impregnated with a curable resin liquid, a metal foil is laminated on the lower surface of the impregnated substrate and continuously cured in a curing furnace. The uncured laminate is conveyed while maintaining a substantially flat surface, and the metal foil is applied to the upper and/or lower surfaces of both ends of the lower metal foil over a certain length from the bonded portion to the initial stage of curing. A method for preventing contamination of a lower metal foil in the production of a metal foil-clad laminate, characterized in that adhesive tape is attached with a width extending slightly outward from both ends of the metal foil.
JP59168211A 1984-08-10 1984-08-10 Method of preventing fouling of lower-surface metallic foil in manufacture of metallic-foil lined laminated board Granted JPS6144640A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59168211A JPS6144640A (en) 1984-08-10 1984-08-10 Method of preventing fouling of lower-surface metallic foil in manufacture of metallic-foil lined laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59168211A JPS6144640A (en) 1984-08-10 1984-08-10 Method of preventing fouling of lower-surface metallic foil in manufacture of metallic-foil lined laminated board

Publications (2)

Publication Number Publication Date
JPS6144640A true JPS6144640A (en) 1986-03-04
JPH0472692B2 JPH0472692B2 (en) 1992-11-18

Family

ID=15863843

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59168211A Granted JPS6144640A (en) 1984-08-10 1984-08-10 Method of preventing fouling of lower-surface metallic foil in manufacture of metallic-foil lined laminated board

Country Status (1)

Country Link
JP (1) JPS6144640A (en)

Also Published As

Publication number Publication date
JPH0472692B2 (en) 1992-11-18

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