JPS59190846A - Continuous manufacture of metallic foil lined laminated board - Google Patents
Continuous manufacture of metallic foil lined laminated boardInfo
- Publication number
- JPS59190846A JPS59190846A JP58066203A JP6620383A JPS59190846A JP S59190846 A JPS59190846 A JP S59190846A JP 58066203 A JP58066203 A JP 58066203A JP 6620383 A JP6620383 A JP 6620383A JP S59190846 A JPS59190846 A JP S59190846A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- metal foil
- resin
- epoxy resin
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Laminated Bodies (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は電気用プリント配線基板のための片面または両
面金属箔張り積層板の連続製造法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for the continuous production of single-sided or double-sided metal foil laminates for electrical printed wiring boards.
従来これらの金属箔張り積層板は、基材に樹脂ワニスを
含浸し、乾燥してプリプレグをつくり、所要枚のプリプ
レグと金属箔とを積層してプレスで加圧加熱して製造さ
れていた。この方式はバッチ式であるため多大の労力を
必要とし、生産性が低い。Conventionally, these metal foil-clad laminates have been manufactured by impregnating a base material with resin varnish and drying it to create a prepreg, laminating the required number of sheets of prepreg and metal foil, and pressing and heating with a press. Since this method is a batch method, it requires a lot of labor and has low productivity.
そこで本発明者らは特開昭55−4838等において金
属箔張り積層板の連続製造法を提案した。Therefore, the present inventors proposed a continuous manufacturing method for metal foil-clad laminates in Japanese Patent Application Laid-Open No. 55-4838.
該方法は、熱硬化性樹脂を含浸したシート状基材を連続
的に搬送しながら積層すると同時に、または積層した後
、該積層体の片面または両面に熱硬化性接着剤を塗布し
た長尺な金属箔を連続的に積層し、引続いて実質的に無
圧の条件で連続的に硬化せしめるものである。電気用プ
リント配線基板は複数枚の基材が積層された絶縁層の特
性が重要であることは勿論であるが、金属箔と接着剤層
の半田耐熱性や剥離強度も重要な特性である。従って前
記連続法において金属箔に接着剤を塗布し、必要あれば
それを張合わせ前に半硬化させる工程はこれら要請を満
足させるような条件で実施されなければならない。This method involves laminating sheet-like substrates impregnated with a thermosetting resin while continuously conveying them, or at the same time or after the lamination, a long sheet is coated with a thermosetting adhesive on one or both sides of the laminate. Metal foils are successively laminated and then continuously cured under substantially pressureless conditions. For electrical printed wiring boards, it goes without saying that the properties of the insulating layer formed by laminating multiple base materials are important, but the solder heat resistance and peel strength of the metal foil and adhesive layer are also important properties. Therefore, in the continuous method, the step of applying an adhesive to the metal foil and, if necessary, semi-curing it before bonding, must be carried out under conditions that satisfy these requirements.
本発明は、前記連続法において、すなわち片面に接着剤
を塗布した長尺な金属箔と、樹脂を含浸した所要枚数の
基材とを連続的に搬送しながら債3一
層し、硬化せしめる金属箔張り積層板の連続製造方法に
おいて、あらかじめ別工程において金属箔に接着剤を塗
布しロール状に巻き取つ゛た長尺な接着剤プレコート金
属箔を用いることを特徴とする。The present invention is directed to the continuous method, in which a long metal foil coated with an adhesive on one side and a required number of resin-impregnated base materials are layered and cured while continuously conveying the metal foil. The continuous manufacturing method for stretched laminates is characterized by using a long adhesive-precoated metal foil which is coated with an adhesive in advance in a separate step and wound into a roll.
本発明によれば、樹脂を含浸した基材の積層体に金属箔
を積層し、引き続き硬化させるメインの金属箔張り積層
板生産ラインとは別個のラインにおいて、あらかじめ長
尺な金属箔に接着剤を塗布し、必要に応じ接着剤を半硬
化させてロール状に巻き取って接着剤プレコート金属箔
を準備し、これをメインの生産ラインにおいて使用する
ものである。従って金属箔に接着剤をプレコートする工
程と、金属箔張り積層板を硬化させる工程とを切り離し
て別個に実施することができるから、それぞれの工程を
最適のラインスピードをもって実施することができ、塗
布する接着剤の厚みやその硬化の程度を厳密にコントロ
ールすることが可能となり、さらに半田耐熱性や金属箔
剥離強度を向上させる目的で金属箔へ接着剤を塗布する
前に金属箔表面を例えばシランカップリング剤で表面処
理す4−
る如き工程の付加も容易となる。また二つの工程に区分
されて単純化されるため、工程トラブルが減少し、トー
タルの生産効率が向上する。特に両面金属箔張り積層板
を製造する場合に効果が顕著である。何となればこの場
合塗布した接着剤層は両面とも均一でなければならない
が、接着剤プレコート金属箔を使用すればこれを容易に
達成することができるからである。According to the present invention, in a line separate from the main metal foil-clad laminate production line in which metal foil is laminated onto a laminate of resin-impregnated base materials and subsequently cured, adhesive is applied to a long length of metal foil in advance. The adhesive is applied, semi-cured if necessary, and wound up into a roll to prepare adhesive pre-coated metal foil, which is used in the main production line. Therefore, the process of pre-coating the metal foil with adhesive and the process of curing the metal foil-clad laminate can be carried out separately, so each process can be carried out at the optimum line speed. It is now possible to strictly control the thickness of the adhesive and the degree of curing, and the surface of the metal foil can be coated with silane, for example, before applying the adhesive to the metal foil in order to improve the soldering heat resistance and peel strength of the metal foil. It becomes easy to add steps such as surface treatment with a coupling agent. Furthermore, since the process is divided into two processes and simplified, process troubles are reduced and total production efficiency is improved. The effect is particularly remarkable when producing a double-sided metal foil-clad laminate. This is because in this case the applied adhesive layer must be uniform on both sides, and this can be easily achieved using adhesive pre-coated metal foil.
本発明に用いる金属箔は、アルミニウム、鉄、真ちゅう
、銅等の厚さ7−100μmの長尺の箔である。特に厚
さ18〜40/1mの電解銅箔および圧延銅箔はプリン
ト配線板用金属箔として最適である。The metal foil used in the present invention is a long foil made of aluminum, iron, brass, copper, etc. and having a thickness of 7 to 100 μm. In particular, electrolytic copper foil and rolled copper foil with a thickness of 18 to 40/1 m are most suitable as metal foils for printed wiring boards.
本発明に用いる基材は、アスベスト紙、またはテトロン
等の有機繊維の布もしくは不織布を用いることもできる
が、一般にはセルロース繊維を主成分とするクラフト紙
、リンター紙、綿布、およびガラスクロス、ガラスマッ
ト、ガラスペーパー等が多く用いられる。As the base material used in the present invention, asbestos paper, cloth or non-woven fabric made of organic fibers such as Tetron can also be used, but in general, kraft paper, linter paper, cotton cloth, glass cloth, glass cloth, etc., whose main component is cellulose fiber, Matte, glass paper, etc. are often used.
基材がセルロース繊維の場合、積層板の電気特性や、耐
熱性および機織的特性を向上させるため、基材を尿素樹
脂、環状尿素樹脂、メラミン樹脂、グアナミン樹脂、N
−メチロールアクリルアミド等でプレ含浸することか有
効である。また本発明者らが特開昭55−144159
および特開昭56−43329で提案している上記樹脂
を改質変性した樹脂も有効である。When the base material is cellulose fiber, in order to improve the electrical properties, heat resistance and weaving properties of the laminate, the base material may be urea resin, cyclic urea resin, melamine resin, guanamine resin, N
- Pre-impregnation with methylol acrylamide etc. is effective. In addition, the present inventors have published JP-A-55-144159.
Also effective are resins obtained by modifying the above-mentioned resins as proposed in JP-A No. 56-43329.
基材がガラス繊維の場合は、基材に含浸する樹脂に適し
たシランカップリング剤で該基材を処理することが金属
箔張り積層板の電気特性、耐熱性、機械特性の面から好
ましい。When the base material is glass fiber, it is preferable to treat the base material with a silane coupling agent suitable for the resin with which the base material is impregnated, from the viewpoint of electrical properties, heat resistance, and mechanical properties of the metal foil-clad laminate.
本発明において基材に含浸する樹脂は、不飽和ポリエス
テル樹脂、ビニルエステル樹脂、ジアリルフタレート樹
脂、エポキシ樹脂等の常温で液状で、硬化反応過程で気
体や液体の反応副生物を発生しない樹脂が選ばれる。該
樹脂は連1読的に巻出され、搬送される長尺の基材に連
続的に含浸することかでき、引続き金属箔を積層した後
実質的に無圧の状態で硬化成形することができるから、
特にリジッドタイプの積層板を連続的に製造するために
好ましい。In the present invention, the resin to be impregnated into the base material is a resin that is liquid at room temperature and does not generate gas or liquid reaction by-products during the curing reaction process, such as unsaturated polyester resin, vinyl ester resin, diallyl phthalate resin, or epoxy resin. It will be done. The resin can be continuously impregnated into a long base material that is unwound and conveyed in a continuous manner, and subsequently, after laminating metal foil, it can be cured and molded under substantially no pressure. Because I can,
It is particularly preferred for continuously manufacturing rigid type laminates.
本発明において接着剤をプレコートした金属箔は、ロー
ルに巻き取る前に接着剤を少し硬化せしめてBステージ
まで硬化せしめるのが好ましい。In the present invention, it is preferable that the metal foil precoated with an adhesive be slightly cured to the B stage before being wound up into a roll.
これにより接着剤は粘着性がなくなり、離型紙等を中間
に挾むことなく巻き取ることができる。しかしながら接
着剤を塗布した後、溶媒を乾燥除去して得られる粘着性
の接着剤プレコート金属箔も、離型紙等を間に挾んで巻
き取れば接着剤が金属箔の接着剤イく塗布面に付着する
ことを防止し得る。As a result, the adhesive loses its tackiness and can be rolled up without sandwiching release paper or the like in between. However, even with adhesive pre-coated metal foil obtained by drying and removing the solvent after applying an adhesive, if you roll it up with release paper etc. in between, the adhesive will be able to reach the coated surface of the metal foil. Adhesion can be prevented.
本発明において用いる接着剤としては、ビスフエ/ −
ルA 型エポキシ樹脂、ビスフェノ−/l’ F 型エ
ポキシ樹脂、ノボラック型エポキシ樹脂、脂環型エポキ
シ樹脂等のエポキシ樹脂またはそれらの混合物を用いる
ことができる。該エポキシ樹脂の硬化剤としては、公知
のアミン系および酸無水物系硬化剤を用いることができ
る。特にBステージに硬化させた場合シェルフライフが
長いので、芳香族アミン系、酸無水物系およびジシアン
ジアミド系硬化剤が好ましい。紙フエノール金属箔張り
7−
積層板に広く使用されているフェノール系接着剤も使用
できる。に記以外にもポリウレタン系、ビニルエステル
系およびアクリル系接着剤も使用できる。これら接着剤
は充填剤、ニトリルゴム、ナイロン、フェノキシ樹脂、
ポリビニルアセクールのような町撓性伺与剤、着色剤、
難燃剤のような添加剤を含有することができる。The adhesive used in the present invention is Bisfe/-
Epoxy resins such as L-A type epoxy resin, bispheno-/L'F-type epoxy resin, novolak type epoxy resin, alicyclic type epoxy resin, or mixtures thereof can be used. As the curing agent for the epoxy resin, known amine-based and acid anhydride-based curing agents can be used. In particular, aromatic amine-based, acid anhydride-based, and dicyandiamide-based curing agents are preferred because they have a long shelf life when cured to the B stage. Paper phenol metal foiling 7 - Phenolic adhesives widely used for laminates can also be used. In addition to those mentioned above, polyurethane adhesives, vinyl ester adhesives, and acrylic adhesives can also be used. These adhesives include fillers, nitrile rubber, nylon, phenoxy resin,
Flexibility agents such as polyvinyl acecool, coloring agents,
Additives such as flame retardants may be included.
本発明によれば、長尺な金属箔の張合せ面を必要に応じ
シランカップリング剤で処理した後、前記接着剤を塗布
し、必要に応じ乾燥もしくはBステージまで硬化してロ
ールに巻取る。接着剤の厚みは10〜120/im、特
に20〜80jmであることが好ましい。最初に塗布し
た接着剤の上に異種の接着剤を塗布し、必要に応じ乾燥
もしくは熱硬化させることもできる。According to the present invention, after the bonded surfaces of long metal foils are treated with a silane coupling agent as necessary, the adhesive is applied, dried or cured to the B stage as necessary, and wound onto a roll. . The thickness of the adhesive is preferably 10 to 120 mm, particularly 20 to 80 mm. A different type of adhesive can be applied on top of the first applied adhesive and dried or heat cured as required.
このようにしてロールに巻き取った接着剤プレコート金
属箔を別のラインにおいて樹脂含浸基材に積層するに際
し、積層直前に金属箔の接着剤層を乾燥またはさらに硬
化するため熱処理することが好ましい場合もある。例え
ば、紙フェノールプ8−
リント配線基板に広く使用されているポリビニルアセタ
ール変性フェノール樹脂の場合100°C〜160 ’
Cで1〜5分間加熱処理を行なうことにより半[口封熱
性が向上する。When the adhesive-precoated metal foil wound into a roll in this way is laminated onto a resin-impregnated substrate in a separate line, it is preferable to heat-treat the adhesive layer of the metal foil to dry or further harden it immediately before lamination. There is also. For example, in the case of polyvinyl acetal modified phenolic resin, which is widely used for paper phenol resin wiring boards, the temperature is 100°C to 160°C.
By performing heat treatment at C for 1 to 5 minutes, the heat sealing properties are improved by half.
また前記プレコート金属箔の積層直前における接着剤加
熱処理に先立ち、該接着剤の上にエポキシ系樹脂を塗布
することがより好ましい場合がある。−例を挙げると、
該接着剤と基材含浸樹脂の組み合わせがポリビニルアセ
タール変性フェノール樹脂および不飽和ポリエステル樹
脂である場合、該接着剤の上に室温で固体のエポキシ樹
脂、例えばエピコー)1004とアミン系硬化剤、およ
び必要に応じて可撓性付与剤の溶液を乾燥後1〜5μm
の厚みになるように塗布した後、100°C〜160°
Cで1〜5分加熱して溶剤の乾燥除去と接着剤の硬化を
進めることができる。この場合エポキシ樹脂はフェノー
ル系接着剤と不飽和ポリエステル樹脂との接着性をより
高め、金属箔張り積層板の金属箔剥離強度や半田耐熱性
をさらに向上させることができる。以上は一例であって
、接着剤樹脂の種類およびそれと組み合わせる柄材aθ
樹脂の種類に応じて、適宜エポキシ系樹脂、尿素系樹脂
、フェノール系樹脂、メラミン系樹脂、ニトリルブタジ
ェンゴム系、ポリビニルアセタール系樹脂、ポリウレタ
ン系樹脂なとから特定の組み合わせに最適なものを選ん
で使用することができる。Further, it may be more preferable to apply an epoxy resin on the adhesive prior to the adhesive heat treatment immediately before laminating the pre-coated metal foil. -For example,
When the combination of the adhesive and the base impregnating resin is a polyvinyl acetal-modified phenolic resin and an unsaturated polyester resin, an epoxy resin solid at room temperature, such as Epicor 1004, and an amine-based curing agent are added on top of the adhesive. 1 to 5 μm after drying the flexibility imparting agent solution depending on the
After coating to a thickness of 100°C to 160°
It is possible to dry and remove the solvent and cure the adhesive by heating at C for 1 to 5 minutes. In this case, the epoxy resin can further improve the adhesion between the phenolic adhesive and the unsaturated polyester resin, and can further improve the metal foil peel strength and solder heat resistance of the metal foil-clad laminate. The above is just an example, and the type of adhesive resin and handle material aθ to be combined with it
Depending on the type of resin, choose the most suitable one for the specific combination from epoxy resin, urea resin, phenol resin, melamine resin, nitrile butadiene rubber, polyvinyl acetal resin, polyurethane resin. It can be used in
本発明によって接着剤プレコーj・金属箔を使用する場
合、特に接着剤がBステージまで半硬化されている場合
、金属箔を張り合わせた後の情層体全体の硬化は、基材
含浸樹脂が粘着性を失ない、自己支持能を有するに至っ
た段階で−[b車続的搬送下で行なわれる硬化を中止し
、その時点で長尺の半製品を所要寸法に切断し、切断し
た半製品を多数枚同時に硬化炉に入れ、例えば80〜1
60°Cの湿度で1〜72時間、好ましくは100°C
〜140°Cで8〜30時間バッチ式に後硬化させるこ
とができる。これにより連続式硬[ヒに使用するトンイ
・ル式硬化炉を小型化し、またはラインスピードを高く
することができるので好ましい。When using the adhesive Preco-j and metal foil according to the present invention, especially when the adhesive is semi-cured to the B stage, the entire hardening of the layer after the metal foil is pasted is difficult because the base material impregnated resin is tacky. At the stage when it has reached the stage where it does not lose its elasticity and has self-supporting ability, the curing carried out under continuous transport is stopped, and at that point the long semi-finished product is cut to the required size, and the cut semi-finished product is cut into the required size. For example, 80 to 1
1-72 hours at 60°C humidity, preferably 100°C
It can be post-cured batchwise at ~140°C for 8-30 hours. This is preferable since it is possible to downsize the tunnel type hardening furnace used for continuous hardening or to increase the line speed.
次に実施例により本発明をさらに詳しく説明す実施例1
ポリビニルアセタール変性フェノール樹脂系接着剤を約
30/1mの厚さに塗布した長尺の接着剤プレコート電
HtH銅箔を巻物として入手した。Next, the present invention will be explained in more detail with reference to Examples.Example 1 A long adhesive precoated electric HtH copper foil coated with a polyvinyl acetal-modified phenolic resin adhesive to a thickness of about 30/1 m was obtained as a roll.
長尺なりラフト紙を5枚それぞれ連続的に繰り出して別
々に搬送しながら、メチロールメラミン系樹脂溶液をプ
レ含浸し、溶媒を乾燥して除去し、次いで不飽和ポリエ
ステル樹脂液を含浸し、引き続き連続的に樹脂き浸紙基
材を合体して積層し、次いで該偵層体の上面に前記接着
剤プレコート銅箔ヲ、下面にカバーシートとしてポリエ
ステルフィルムを悄j・1゛グし、l”シネル型硬化炉
内を通過させることによって100℃で10分(y、1
、次いで1.50°Cで10分間加熱硬化して片面銅箔
張り積層板を得た。該積層板のJIS C6481に
基づく半田耐熱性および銅箔剥離強度は、それぞれ44
秒および]、、 68 Kg /ひであった。Five long pieces of raft paper are continuously fed out and conveyed separately, pre-impregnated with a methylolmelamine resin solution, the solvent is dried and removed, then impregnated with an unsaturated polyester resin liquid, and then continuously fed. The resin-impregnated paper substrates were combined and laminated, and then the adhesive pre-coated copper foil was applied to the upper surface of the layered body, and a polyester film was applied to the lower surface as a cover sheet, and l"cinel was applied. By passing through a mold hardening furnace at 100°C for 10 minutes (y, 1
This was then heated and cured at 1.50°C for 10 minutes to obtain a single-sided copper foil-clad laminate. The solder heat resistance and copper foil peel strength of this laminate based on JIS C6481 are 44, respectively.
seconds and], 68 Kg/h.
実施例2
実施例1において、接着剤プレコート銅箔の接11−
着剤の上に、エピコート]、 004と、アミン系硬化
剤と、ポリアミド樹脂をメチルエチルケトンに溶解した
溶液を塗布し、145°Cで3分間乾燥便化する工程を
付加した。得られた積層板のJISC6481に基づく
半田耐熱性および銅箔剥離強度は83秒および1.85
Kg/cmであった。Example 2 In Example 1, a solution of Epicoat], 004, an amine curing agent, and a polyamide resin dissolved in methyl ethyl ketone was applied onto the adhesive and heated at 145°C. A step of drying the stool for 3 minutes was added. The solder heat resistance and copper foil peel strength of the obtained laminate based on JISC6481 were 83 seconds and 1.85.
Kg/cm.
実施例3
エポキシ樹脂(エピコート828.シェル化学製)10
0重量部、無水メチルナジック酸80重量部、ベンジル
ジメチルアミン0.5重it部、カルボキシリックNB
R40重量部、メチルエチルケトン150重量部からな
るエポキシ樹脂系接着剤を厚さ35)1mの電解銅箔に
ロールコータ−にて塗布し、150°Cで10分間トン
ネル炉で加熱を行ない、溶剤を除去するとともに、接着
剤をBステージまで硬化し、ロール状に巻き取った。こ
の接着剤プレコート銅箔を用いて実施例1と同様の条件
で片面銅箔張り積層板を得た。得られた積層板のJIS
C6481に基づく半田耐熱性および銅箔剥離強度
は、67秒および1.77に7/mであ12−
った。Example 3 Epoxy resin (Epicote 828. Shell Chemical Co., Ltd.) 10
0 parts by weight, 80 parts by weight of methylnadic anhydride, 0.5 parts by weight of benzyldimethylamine, carboxylic NB
An epoxy resin adhesive consisting of 40 parts by weight of R and 150 parts by weight of methyl ethyl ketone was applied to a 35) 1 m thick electrolytic copper foil using a roll coater, heated at 150°C for 10 minutes in a tunnel furnace, and the solvent was removed. At the same time, the adhesive was cured to the B stage and wound up into a roll. Using this adhesive pre-coated copper foil, a single-sided copper foil-clad laminate was obtained under the same conditions as in Example 1. JIS of the obtained laminate
Solder heat resistance and copper foil peel strength based on C6481 were 12-7/m at 67 seconds and 1.77.
実施例4
エポキシ層脂(エビコー)828.シェル化学fJJ
) 100 重を部、4.4−ジアミノジフェニルスル
ホン30 重n、BF3−モノエチルアミン0.8重量
部、アルコール可溶性ナイロン40重量部、トリクロル
エチレン100 重量!、エタノール100重量部、メ
チルエチルケトン60重量部からなるエポキシ樹脂接着
剤を用いて実施例3と同様の方法で1.6 mm厚の片
面銅箔張り積層板を得た。Example 4 Epoxy resin (Ebiko) 828. shell chemistry fjj
) 100 parts by weight, 30 parts by weight of 4,4-diaminodiphenylsulfone, 0.8 parts by weight of BF3-monoethylamine, 40 parts by weight of alcohol-soluble nylon, 100 parts by weight of trichlorethylene! A single-sided copper foil-clad laminate having a thickness of 1.6 mm was obtained in the same manner as in Example 3 using an epoxy resin adhesive consisting of 100 parts by weight of ethanol and 60 parts by weight of methyl ethyl ketone.
得られた積層板のJIS C6481に基づく半田耐
熱性および銅箔剥離強度は、それぞれ53秒および]、
、 96 K9/礪であった。The solder heat resistance and copper foil peel strength of the obtained laminate based on JIS C6481 were 53 seconds and ], respectively.
, 96 K9/太.
特許出願人 鐘淵化学工業株式会社 代理人 弁理士 赤 岡 辿 夫Patent applicant Kanebuchi Chemical Industry Co., Ltd. Agent Patent Attorney Aka Oka Akio
Claims (1)
含浸した所要枚数の基材とを連続的に搬送しながら積層
し、硬化せしめる金属箔張り積層板の連続製造方法にお
いて、あらかじめ別工程において金属箔に接着剤を塗布
しロール状に巻き取った長尺な接着剤プレコート金属箔
を用いることを特徴とする金属箔張り積層板の連続製造
方法。 (2)あらかじめ金属箔に塗布された接着剤がBステー
ジに半硬化されている特許請求の範囲第1項の方法。 (3)接着剤がエポキシ樹脂系接着剤である特許請求の
範囲第1項または第2項の方法。 (4) エポキシ樹脂の硬化剤が芳香族アミンである
特許請求の範囲第3項の方法。 (5)エポキシ樹脂の硬化剤が酸無水物である特許請求
の範囲第3項の方法。 (6)エポキシ樹脂の硬化剤がジシアンジアミドである
特許請求の範囲第3項の方法。 (7)接着剤がフェノール樹脂系接着剤である特許請求
の範囲第1項または第2項の方法。 (8)樹脂を含浸した基材と積層する直前に、接着剤プ
レコート金属箔の接着剤層を連続的に加熱する特許請求
の範囲第1項ないし第7項のいずれかの方法。 (9)樹脂を含浸した基材と積層する直前に、接着剤プ
レコート金属箔の接着剤層の上に連続的にエポキシ系樹
脂を塗布し、加熱する特許請求の範囲第1項ないし第7
項のいずれかの方法。 00 基材を含浸する樹脂が常温で液状であり、硬化
反応過程で気体や液体の副生物を発生しない樹脂である
特許請求の範囲第1項ないし第9項のいずれかの方法。 (10基材がセルロース繊維および/またはガラス繊維
製である特許請求の範囲第1項ないし第10項のいずれ
かの方法。 (12) @層板を実質的に無圧の状態で連続的に硬
化させる特許請求の範囲第1項ないし第11項のいずれ
かの方法。 +13) 積層板を自己支持能を有しカッターで切断
可能の状態になるまで連続的に硬化し、次いでカッター
で所要寸法に切断した後切断した多数枚の積層板をバッ
チ式に後硬化させる特許請求の範囲第1項ないし第12
項のいずれかの方法。 (14)積層板の両面に金属箔を積層する特許請求の範
囲第1項ないし第13項のいずれかの方法。 (15)金属箔が電解銅箔または圧延銅箔である特許請
求の範囲第1項ないし第14項のいずれかの方法。[Scope of Claims] (1) A metal foil-covered laminate in which a long metal foil coated with an adhesive on one side and a required number of base materials impregnated with a resin are laminated while being continuously conveyed and cured. A continuous manufacturing method for a metal foil-clad laminate, characterized in that the continuous manufacturing method uses a long adhesive-precoated metal foil that is coated with an adhesive on the metal foil in a separate process and wound up into a roll. (2) The method according to claim 1, wherein the adhesive applied to the metal foil in advance is semi-cured to B stage. (3) The method according to claim 1 or 2, wherein the adhesive is an epoxy resin adhesive. (4) The method according to claim 3, wherein the curing agent for the epoxy resin is an aromatic amine. (5) The method according to claim 3, wherein the curing agent for the epoxy resin is an acid anhydride. (6) The method according to claim 3, wherein the curing agent for the epoxy resin is dicyandiamide. (7) The method according to claim 1 or 2, wherein the adhesive is a phenolic resin adhesive. (8) The method according to any one of claims 1 to 7, wherein the adhesive layer of the adhesive precoated metal foil is continuously heated immediately before lamination with the resin-impregnated base material. (9) Immediately before laminating with the resin-impregnated base material, an epoxy resin is continuously applied on the adhesive layer of the adhesive pre-coated metal foil and heated.
Either way. 00 The method according to any one of claims 1 to 9, wherein the resin impregnating the base material is liquid at room temperature and does not generate gas or liquid by-products during the curing reaction process. (10 The method according to any one of claims 1 to 10, wherein the base material is made of cellulose fiber and/or glass fiber. The method of curing according to any one of claims 1 to 11. +13) Continuously curing the laminate until it has self-supporting ability and can be cut with a cutter, and then cut to the required size with a cutter. Claims 1 to 12, in which a large number of cut laminates are post-cured in a batch manner after cutting.
Either way. (14) The method according to any one of claims 1 to 13, wherein metal foil is laminated on both sides of the laminate. (15) The method according to any one of claims 1 to 14, wherein the metal foil is an electrolytic copper foil or a rolled copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58066203A JPS59190846A (en) | 1983-04-13 | 1983-04-13 | Continuous manufacture of metallic foil lined laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58066203A JPS59190846A (en) | 1983-04-13 | 1983-04-13 | Continuous manufacture of metallic foil lined laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59190846A true JPS59190846A (en) | 1984-10-29 |
| JPH0338980B2 JPH0338980B2 (en) | 1991-06-12 |
Family
ID=13309042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58066203A Granted JPS59190846A (en) | 1983-04-13 | 1983-04-13 | Continuous manufacture of metallic foil lined laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59190846A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62183338A (en) * | 1986-02-07 | 1987-08-11 | 東芝ケミカル株式会社 | Multilayer printed wiring board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126419A (en) * | 1979-03-26 | 1980-09-30 | Kanegafuchi Chem Ind Co Ltd | Method and apparatus for continuous preparation of laminated material |
-
1983
- 1983-04-13 JP JP58066203A patent/JPS59190846A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55126419A (en) * | 1979-03-26 | 1980-09-30 | Kanegafuchi Chem Ind Co Ltd | Method and apparatus for continuous preparation of laminated material |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62183338A (en) * | 1986-02-07 | 1987-08-11 | 東芝ケミカル株式会社 | Multilayer printed wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0338980B2 (en) | 1991-06-12 |
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